ATE397647T1 - Zusammensetzung zur befestigung von hochleistungshalbleiter - Google Patents

Zusammensetzung zur befestigung von hochleistungshalbleiter

Info

Publication number
ATE397647T1
ATE397647T1 AT06004444T AT06004444T ATE397647T1 AT E397647 T1 ATE397647 T1 AT E397647T1 AT 06004444 T AT06004444 T AT 06004444T AT 06004444 T AT06004444 T AT 06004444T AT E397647 T1 ATE397647 T1 AT E397647T1
Authority
AT
Austria
Prior art keywords
lead
die
free
high power
attach
Prior art date
Application number
AT06004444T
Other languages
English (en)
Inventor
Muriel Thomas
Klaus Schaack
Timo Goergen
Original Assignee
Umicore Ag & Co Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Umicore Ag & Co Kg filed Critical Umicore Ag & Co Kg
Application granted granted Critical
Publication of ATE397647T1 publication Critical patent/ATE397647T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/54—Inorganic substances
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
  • Heterocyclic Carbon Compounds Containing A Hetero Ring Having Oxygen Or Sulfur (AREA)
  • Conductive Materials (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
AT06004444T 2006-03-06 2006-03-06 Zusammensetzung zur befestigung von hochleistungshalbleiter ATE397647T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP06004444A EP1837383B1 (de) 2006-03-06 2006-03-06 Zusammensetzung zur Befestigung von Hochleistungshalbleiter

Publications (1)

Publication Number Publication Date
ATE397647T1 true ATE397647T1 (de) 2008-06-15

Family

ID=36384351

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06004444T ATE397647T1 (de) 2006-03-06 2006-03-06 Zusammensetzung zur befestigung von hochleistungshalbleiter

Country Status (6)

Country Link
US (1) US20070296089A1 (de)
EP (1) EP1837383B1 (de)
JP (1) JP2007302872A (de)
CN (1) CN101055859A (de)
AT (1) ATE397647T1 (de)
DE (1) DE602006001393D1 (de)

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JP2009230092A (ja) * 2008-02-27 2009-10-08 Kyocera Corp 光アイソレータモジュールおよびそれを用いた光素子モジュール
KR101311681B1 (ko) * 2008-04-30 2013-09-25 히타치가세이가부시끼가이샤 접속 재료 및 반도체 장치
FR2953064B1 (fr) 2009-11-20 2011-12-16 St Microelectronics Tours Sas Procede d'encapsulation de composants electroniques sur tranche
US20130256894A1 (en) * 2012-03-29 2013-10-03 International Rectifier Corporation Porous Metallic Film as Die Attach and Interconnect
US9559064B2 (en) * 2013-12-04 2017-01-31 Taiwan Semiconductor Manufacturing Company, Ltd. Warpage control in package-on-package structures
CN105489746B (zh) * 2014-09-19 2018-02-23 展晶科技(深圳)有限公司 发光芯片模组、发光二极管以及发光芯片模组的制造方法
JP6072117B2 (ja) * 2015-03-30 2017-02-01 Ｊｘ金属株式会社 銅微粒子ペースト及びその製造方法
DE102016220092A1 (de) * 2016-10-14 2018-04-19 Robert Bosch Gmbh Halbzeug zur Kontaktierung von Bauteilen
CN106381117A (zh) * 2016-10-26 2017-02-08 三友（天津）高分子技术有限公司 一种双组份环氧美缝胶
EP3665213A2 (de) * 2017-08-07 2020-06-17 Zoltek Corporation Füllstoffe in polyvinylalkoholgrösse zur verstärkung von kunststoffen

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US4147669A (en) * 1977-03-28 1979-04-03 Rockwell International Corporation Conductive adhesive for providing electrical and thermal conductivity
US4247594A (en) * 1979-04-30 1981-01-27 Marshall & Pike Enterprises Inc. Electrically conductive resinous composition
JPS56103260A (en) * 1980-01-22 1981-08-18 Asahi Kagaku Kenkyusho:Kk Conductive paint containing copper powder
JPS604552A (ja) * 1983-06-23 1985-01-11 Mitsubishi Gas Chem Co Inc 導電性組成物
JPS6167702A (ja) * 1984-09-07 1986-04-07 Mitsui Mining & Smelting Co Ltd 導電性粉末及びこれを用いた導電性組成物
US4732702A (en) * 1986-02-13 1988-03-22 Hitachi Chemical Company, Ltd. Electroconductive resin paste
JPH0759660B2 (ja) * 1987-09-25 1995-06-28 アルプス電気株式会社 導電性組成物
US5204399A (en) * 1989-03-09 1993-04-20 National Starch And Chemical Investment Holding Corporation Thermoplastic film die attach adhesives
US4975221A (en) * 1989-05-12 1990-12-04 National Starch And Chemical Investment Holding Corporation High purity epoxy formulations for use as die attach adhesives
JP2893782B2 (ja) * 1990-01-19 1999-05-24 日立化成工業株式会社 導電性接着剤および半導体装置
US5188767A (en) * 1990-04-27 1993-02-23 Hitachi Chemical Co., Ltd. Electroconductive resin paste containing mixed epoxy resin and electroconductive metal powder
JPH0412595A (ja) * 1990-05-02 1992-01-17 Mitsubishi Petrochem Co Ltd 導電性ペースト組成物
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US6551711B1 (en) * 1999-06-18 2003-04-22 The University Of Connecticut Curable episulfide systems having enhanced adhesion to metal
US6459147B1 (en) * 2000-03-27 2002-10-01 Amkor Technology, Inc. Attaching semiconductor dies to substrates with conductive straps
TWI282811B (en) * 2000-04-10 2007-06-21 Sumitomo Bakelite Co Die-attaching paste and semiconductor device
JP2002047475A (ja) * 2000-05-18 2002-02-12 Natl Starch & Chem Investment Holding Corp ビニルエーテルおよびカルバメートまたは尿素官能基を有するダイ結合性接着剤
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Also Published As

Publication number Publication date
US20070296089A1 (en) 2007-12-27
JP2007302872A (ja) 2007-11-22
EP1837383A1 (de) 2007-09-26
CN101055859A (zh) 2007-10-17
DE602006001393D1 (de) 2008-07-17
EP1837383B1 (de) 2008-06-04

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