GB1349569A - Toughening epoxy resins - Google Patents
Toughening epoxy resinsInfo
- Publication number
- GB1349569A GB1349569A GB1269571*[A GB1349569DA GB1349569A GB 1349569 A GB1349569 A GB 1349569A GB 1349569D A GB1349569D A GB 1349569DA GB 1349569 A GB1349569 A GB 1349569A
- Authority
- GB
- United Kingdom
- Prior art keywords
- epoxy resin
- average
- polymer
- radicals
- alkyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
1349569 Epoxy resin composition E I DU PONT DE NEMOURS & CO 3 May 1971 12695/71 Heading C3B A composition comprises: (A) 5-40% of a polymer containing epoxy radicals which is obtained by reacting (I) at least one polymer selected from (a) copolymers of 5-45% by wt. acrylonitrile and 55-95% by wt. of butadiene; (b) acrylic polymers which are (i) homopolymers of CH 2 = CHCOOR (R = C 2-8 alkyl) or (ii) copolymers of up to 30% by methyl methacrylate and monomers CH 2 = CHCOOR<SP>1</SP> (R<SP>1</SP> = C 4-8 alkyl) or mixtures of polymers (i) and (ii); (c) polyesters or (d) polyalkylene ethers; (a), (b), (c) and (d) each contain an average of more than one OH, SH, COOH, COCNHNH 2 or NHR<SP>11</SP> radical (R<SP>11</SP> = H or C 1-6 alkyl) at least one of said radicals being in a terminal position, each have a M.W. >1000 if the polymer is a polyalkylene ether or >2000 if the polymer is an acrylonitrile/butadiene copolymer, an acrylic copolymer or a polyester, a glass transition temp. <25‹ C. and a solubility parameter of 8-10À5; and (II) at least one epoxy resin containing an average of at least 1À5 epoxy radicals per molecule, at a temperature sufficient to produce the polymer containing epoxy radicals; and (B) 95-60% by wt. of an epoxy resin having an average of at least 1À5 epoxy radicals per molecule; and (C) 0À5-60% by wt. of a filler, e.g. glass microballoons. The percentages of (A), (B) and (C) are based on their combined weight. The polymers (I) used in preparing (A) may contain on average 1À3 to 3 of the specified radicals per molecule. The epoxy resin may be a diglycidyl ether of bisphenol A. The compositions may be cured using conventional epoxy resin curing agents. Uses.-Coatings, adhesives, for repairing damaged car bodies.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1269571 | 1971-05-03 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1349569A true GB1349569A (en) | 1974-04-03 |
Family
ID=10009411
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1269571*[A Expired GB1349569A (en) | 1971-05-03 | 1971-05-03 | Toughening epoxy resins |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB1349569A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2341607A2 (en) * | 1976-02-23 | 1977-09-16 | Goodrich Co B F | ELASTOMERIC, THERMOPLASTIC, THERMOSETTING COMPOSITIONS AND THEIR PROCESSING METHODS |
EP0145323A2 (en) * | 1983-11-18 | 1985-06-19 | Loctite Corporation | Toughened epoxy composition |
FR2579984A1 (en) * | 1985-04-03 | 1986-10-10 | Nitto Electric Ind Co | |
NL8700189A (en) * | 1986-02-13 | 1987-09-01 | Hitachi Chemical Co Ltd | ELECTRO-CONDUCTIVE RESIN PASTE. |
GB2202225A (en) * | 1987-02-11 | 1988-09-21 | Brilcut Patent | Cement for use in working gemstones |
EP0518067A2 (en) * | 1991-06-12 | 1992-12-16 | Beiersdorf Aktiengesellschaft | Reactive hot-melt adhesive |
US5280068A (en) * | 1990-04-27 | 1994-01-18 | The B.F. Goodrich Company | Epoxy resin systems modified with low viscosity statistical monofunctional reactive polymers |
-
1971
- 1971-05-03 GB GB1269571*[A patent/GB1349569A/en not_active Expired
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2341607A2 (en) * | 1976-02-23 | 1977-09-16 | Goodrich Co B F | ELASTOMERIC, THERMOPLASTIC, THERMOSETTING COMPOSITIONS AND THEIR PROCESSING METHODS |
EP0145323A2 (en) * | 1983-11-18 | 1985-06-19 | Loctite Corporation | Toughened epoxy composition |
EP0145323A3 (en) * | 1983-11-18 | 1985-10-16 | Loctite Corporation | Toughened epoxy composition |
FR2579984A1 (en) * | 1985-04-03 | 1986-10-10 | Nitto Electric Ind Co | |
NL8700189A (en) * | 1986-02-13 | 1987-09-01 | Hitachi Chemical Co Ltd | ELECTRO-CONDUCTIVE RESIN PASTE. |
GB2202225A (en) * | 1987-02-11 | 1988-09-21 | Brilcut Patent | Cement for use in working gemstones |
US5280068A (en) * | 1990-04-27 | 1994-01-18 | The B.F. Goodrich Company | Epoxy resin systems modified with low viscosity statistical monofunctional reactive polymers |
EP0518067A2 (en) * | 1991-06-12 | 1992-12-16 | Beiersdorf Aktiengesellschaft | Reactive hot-melt adhesive |
EP0518067A3 (en) * | 1991-06-12 | 1993-12-29 | Beiersdorf Ag | Reactive hot-melt adhesive |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
414F | Notice of opposition given (sect. 14/1949) | ||
414E | Application relinquished (sect. 14/1949) | ||
CSNS | Application of which complete specification have been accepted and published, but patent is not sealed |