KR930000445A - 폴리히드록시 나프탈렌계 화합물 및 에폭시 수지조성물 - Google Patents

폴리히드록시 나프탈렌계 화합물 및 에폭시 수지조성물 Download PDF

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Publication number
KR930000445A
KR930000445A KR1019920010831A KR920010831A KR930000445A KR 930000445 A KR930000445 A KR 930000445A KR 1019920010831 A KR1019920010831 A KR 1019920010831A KR 920010831 A KR920010831 A KR 920010831A KR 930000445 A KR930000445 A KR 930000445A
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KR
South Korea
Prior art keywords
epoxy resin
compound
resin composition
polyhydroxy naphthalene
polyhydroxy
Prior art date
Application number
KR1019920010831A
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English (en)
Inventor
아키히로 나카
슈이치 이토
신야 아키츠키
기요시 사이토
Original Assignee
스기야마 도모오
다이이치 고교 세이야쿠 가부시키가이샤
카마이 고로
닛토우 덴코 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 스기야마 도모오, 다이이치 고교 세이야쿠 가부시키가이샤, 카마이 고로, 닛토우 덴코 가부시키가이샤 filed Critical 스기야마 도모오
Publication of KR930000445A publication Critical patent/KR930000445A/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C15/00—Cyclic hydrocarbons containing only six-membered aromatic rings as cyclic parts
    • C07C15/02—Monocyclic hydrocarbons
    • C07C15/107—Monocyclic hydrocarbons having saturated side-chain containing at least six carbon atoms, e.g. detergent alkylates
    • C07C15/113—Monocyclic hydrocarbons having saturated side-chain containing at least six carbon atoms, e.g. detergent alkylates having at least two saturated side-chains, each containing at least six carbon atoms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
    • C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
    • C08G8/08—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Phenolic Resins Or Amino Resins (AREA)

Abstract

내용 없음

Description

폴리히드록시 나프탈렌계 화합물 및 에폭시 수지조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (8)

  1. 에폭시 수지 경화제 또는 에폭시수지 전구체이고 α-나프톨, β-나프톨 및 알데히드 화합물과의 공축합에 의해 얻어지는 것을 특징으로 하는 폴리히드록시 나프탈렌계 화합물.
  2. 제1항에 있어서, 폴리히드록시 나프탈렌계 화합물 중량평균 분자량이 300∼200인 것을 특징으로 하는 폴리히드록시 나프탈렌계 화합물.
  3. 제1항에 있어서, α-나프톨 단위 70∼30몰% 및 β-나프톨 단위 30∼70몰%가 알데히드에 의해 공축합되고 또한 중량평균 분자량이 300∼1500인 것을 특징으로 하는 폴리히드록시 나프탈렌계 화합물.
  4. 제1항에 기술된 폴리히드록시 나프탈렌계 화합물로 이루어진 경화제, 에폭시 수지를 포함하는 것을 특징으로 하는 에폭시 수지 조성물.
  5. 제1항에 기재된 폴리히드록시 나프탈렌계 화합물로 이루어진 경화제, 에폭시 수지 및 경화 촉진제를 포함하는 것을 특징으로 하는 반도체 봉지용 에폭시 수지 조성물.
  6. 제1항에 기재된 폴리히드록시 나프탈렌계 화합물과 에피할로히드린의 반응에 의해 얻어지는 것을 특징으로 하는 다관능성 에폭시 수지.
  7. 제6항에 기재된 에폭시 수지 및 경화제를 포함하는 것을 특징으로 하는 에폭시 수지 조성물.
  8. 제6항에 기재된 에폭시 수지, 경화제 및 경화촉진제를 포함하는 것을 특징으로 하는 반도체 봉지용 에폭시 수지 조성물.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019920010831A 1991-06-21 1992-06-20 폴리히드록시 나프탈렌계 화합물 및 에폭시 수지조성물 KR930000445A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP15053891 1991-06-21
JP91-150538 1991-06-21
JP29443791 1991-11-11
JP91-294437 1991-11-11

Publications (1)

Publication Number Publication Date
KR930000445A true KR930000445A (ko) 1993-01-15

Family

ID=26480105

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920010831A KR930000445A (ko) 1991-06-21 1992-06-20 폴리히드록시 나프탈렌계 화합물 및 에폭시 수지조성물

Country Status (4)

Country Link
US (1) US5302673A (ko)
EP (1) EP0524433A3 (ko)
KR (1) KR930000445A (ko)
TW (1) TW210346B (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG87725A1 (en) * 1992-09-21 2002-04-16 Sumitomo Bakelite Co Epoxy resin composition
US5459223A (en) * 1993-01-22 1995-10-17 Hitachi Chemical Company Method of preparing naphthol-modified phenolic resin
TW452944B (en) * 1997-06-03 2001-09-01 Hitachi Chemical Co Ltd Phenolic resin, resin composition, molding material for encapsulation, and electronic component device
EP2532710B1 (en) * 2010-02-03 2018-08-22 DIC Corporation Phenol resin composition, curable resin composition, cured products thereof, and printed circuit board
JP2013145839A (ja) * 2012-01-16 2013-07-25 Nitto Denko Corp 中空封止用樹脂シートおよびその製法、並びに中空型電子部品装置の製法および中空型電子部品装置
JP5621954B1 (ja) * 2013-06-14 2014-11-12 Dic株式会社 フェノール性水酸基含有化合物、フェノール樹脂、硬化性組成物、その硬化物、半導体封止材料、及びプリント配線基板
WO2016029453A1 (en) * 2014-08-29 2016-03-03 Blue Cube Ip Llc Halogen-free and flame retardant compositions with low thermal expansion for high density printed wiring boards
WO2016029451A1 (en) * 2014-08-29 2016-03-03 Blue Cube Ip Llc Synthesis of naphthol novolac
TWI675051B (zh) * 2014-10-10 2019-10-21 日商迪愛生股份有限公司 萘酚型杯芳烴化合物及其製造方法、感光性組成物、光阻材料、及塗膜

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4424315A (en) * 1982-09-20 1984-01-03 Shipley Company Inc. Naphthol novolak resin blend
JPS62167318A (ja) * 1986-01-20 1987-07-23 Teijin Ltd エポキシ樹脂の硬化方法
JPS6225116A (ja) * 1986-07-17 1987-02-03 Agency Of Ind Science & Technol 新規ポリグリシジルエ−テルから得られる樹脂
JPH06104712B2 (ja) * 1987-04-08 1994-12-21 東レ株式会社 半導体封止用樹脂組成物
JP3230054B2 (ja) * 1989-08-29 2001-11-19 大日本インキ化学工業株式会社 ノボラック型エポキシ樹脂の製法およびノボラック型エポキシ樹脂組成物

Also Published As

Publication number Publication date
US5302673A (en) 1994-04-12
TW210346B (ko) 1993-08-01
EP0524433A3 (en) 1993-02-03
EP0524433A2 (en) 1993-01-27

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