KR910003009A - 밀봉 방법, 그로부터 제조된 초소형 전자 디바이스, 및 열 경화성 조성물 - Google Patents

밀봉 방법, 그로부터 제조된 초소형 전자 디바이스, 및 열 경화성 조성물 Download PDF

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Publication number
KR910003009A
KR910003009A KR1019900011573A KR900011573A KR910003009A KR 910003009 A KR910003009 A KR 910003009A KR 1019900011573 A KR1019900011573 A KR 1019900011573A KR 900011573 A KR900011573 A KR 900011573A KR 910003009 A KR910003009 A KR 910003009A
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KR
South Korea
Prior art keywords
salt
thermosetting composition
weight
parts
composition according
Prior art date
Application number
KR1019900011573A
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English (en)
Inventor
휠헬름 월즈 에릭
헨리 루핀스키 존
빈센트 크리벨로 제임스
Original Assignee
아더 엠. 킹
제네랄 일렉트릭 캄파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 아더 엠. 킹, 제네랄 일렉트릭 캄파니 filed Critical 아더 엠. 킹
Publication of KR910003009A publication Critical patent/KR910003009A/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

내용 없음.

Description

밀봉 방법, 그로부터 제조된 초소형 전자 디바이스, 및 열 경화성 조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (7)

  1. (a)100ppm 미만의 가수분해성 염화물을 갖는 100중량부의 에폭시 수지, (b) 10내지1000중량부의 용융 실리카 충진제, (c) 촉매량의 상용성 단량체 또는 중합체성 다디아릴요오드늄헥사플루오로안티모네아트 염, 및 (d)성분(c)의 조촉매로서의 효과량의 유리-라디칼 생성 방향족 화합물을 포함하는 열 경화성 조성물.
  2. 제1항에 있어서, 상기 에폭시 수지가 안정한 메타 브롬화된 에폭시 노볼락인 열 경화성 조성물.
  3. 제1항에 있어서, 상기 중합체성 디아릴요오도늄헥사플루오로안티모 네이트 염이 디페닐요오도늄헥사플루오로안티모 네이트인 열 경화성 조성물.
  4. 제1항에 있어서, 상기 유리-라디칼 생성 방향족 화합물이 벤조피나콜인 열 경화성 조성물.
  5. 제3항에 있어서, 상기 디페닐요오도늄헥사플루오로안티모네이트 염이 옥틸옥사 치화된 디페닐요오도늄헥사플루오로 안티모네이트 염인 열 경화성 조성물.
  6. 제1항에 조성물로 밀봉된(encapsulated)반도체 디바이스(device).
  7. (a)100ppm 미만의 가수분해성 염화물을 갖는 100 중량부의 에폭시 수지, (b)10 내지 1000중량부의 용융 실리카 충진제, (c)촉매량의 상용성 단량체 또는 중합체성 디아릴 요오도늄헥사플루오로안티모네이트 염, 및 (d)성분(c)의 조촉매로서의 효과량의 유리-라디칼 생성 방향족 화합물을 포함하는 열 경화성 조성물을 사용하여 120 내지 230℃의 온도 및 400 내지 1500psi의 압력에서 전자 디바이스를 밀봉함을 포함하는, 고도로 가속화된 응력시허 조건하에 약 145℃의 온도에서 수분이 가해진 환경에서 처리할 때 50% 잔존율이 최소한 100시간을 초과할 수 있는 플라스틱 밀봉된 전자 디바이스의 제조방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019900011573A 1989-07-31 1990-07-30 밀봉 방법, 그로부터 제조된 초소형 전자 디바이스, 및 열 경화성 조성물 KR910003009A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/386670 1989-07-31
US07/386,670 US5015675A (en) 1989-07-31 1989-07-31 Encapsulation method, microelectronic devices made therefrom, and heat curable compositions based on epoxy resins, diaryliodonium hexafluroantimonate salts and free radical generators

Publications (1)

Publication Number Publication Date
KR910003009A true KR910003009A (ko) 1991-02-26

Family

ID=23526558

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900011573A KR910003009A (ko) 1989-07-31 1990-07-30 밀봉 방법, 그로부터 제조된 초소형 전자 디바이스, 및 열 경화성 조성물

Country Status (9)

Country Link
US (1) US5015675A (ko)
EP (1) EP0411405A3 (ko)
JP (1) JPH0822905B2 (ko)
KR (1) KR910003009A (ko)
AU (1) AU635049B2 (ko)
BR (1) BR9003703A (ko)
FI (1) FI903241A0 (ko)
MX (1) MX173674B (ko)
NZ (1) NZ233268A (ko)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2918328B2 (ja) * 1990-11-26 1999-07-12 株式会社デンソー 樹脂の選定方法及びこの選定方法により選定された樹脂を有する樹脂封止型半導体装置
EP0634792B1 (en) * 1991-03-08 1998-04-29 Japan Gore-Tex, Inc. Resin-sealed semiconductor device containing porous fluororesin
JP2927081B2 (ja) * 1991-10-30 1999-07-28 株式会社デンソー 樹脂封止型半導体装置
US6439698B1 (en) 2000-01-14 2002-08-27 Lexmark International, Inc Dual curable encapsulating material
DE10051051A1 (de) 2000-10-14 2002-04-18 Bosch Gmbh Robert Silikonmodifizierte Einkomponentenvergußmasse
US6425655B1 (en) 2001-06-05 2002-07-30 Lexmark International, Inc. Dual curable encapsulating material
JP2004040031A (ja) * 2002-07-08 2004-02-05 Stanley Electric Co Ltd 表面実装型発光ダイオード
WO2005108487A1 (en) * 2004-04-22 2005-11-17 Henkel Corporation Methods for improving the flux compatibility of underfill formulations
US7429800B2 (en) * 2005-06-30 2008-09-30 Sabic Innovative Plastics Ip B.V. Molding composition and method, and molded article
US7378455B2 (en) 2005-06-30 2008-05-27 General Electric Company Molding composition and method, and molded article
US20070004871A1 (en) * 2005-06-30 2007-01-04 Qiwei Lu Curable composition and method
US20070066698A1 (en) * 2005-09-20 2007-03-22 Yang Wenliang P Dual cure compositions, methods of curing thereof and articles therefrom
US20070066710A1 (en) * 2005-09-21 2007-03-22 Peters Edward N Method for electrical insulation and insulated electrical conductor
DK1768182T3 (da) * 2005-09-27 2011-09-19 Semikron Elektronik Gmbh Effekthalvledermodul med overstrømsbeskyttelsesindretning
DE102005046063B3 (de) * 2005-09-27 2007-03-15 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit Überstromschutzeinrichtung
US20090107632A1 (en) * 2007-10-30 2009-04-30 General Electric Company Adhesive compositions for high temperature sensors and methods of making the same
US8337163B2 (en) * 2007-12-05 2012-12-25 General Electric Company Fiber composite half-product with integrated elements, manufacturing method therefor and use thereof
US8079820B2 (en) * 2008-12-18 2011-12-20 General Electric Company Blade module, a modular rotor blade and a method for assembling a modular rotor blade
US20120040106A1 (en) 2010-08-16 2012-02-16 Stefan Simmerer Apparatus for impregnating a fiber material with a resin and methods for forming a fiber-reinforced plastic part
US20120138223A1 (en) 2011-09-29 2012-06-07 General Electric Company Uv-ir combination curing system and method of use for wind blade manufacture and repair
CN110114406A (zh) * 2016-12-29 2019-08-09 汉高股份有限及两合公司 可阳离子固化的密封剂组合物
DE102020127830A1 (de) 2020-10-22 2022-04-28 Infineon Technologies Ag Moldverbindungen und Packages zum Verkapseln elektronischer Komponenten

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4173551A (en) * 1974-05-02 1979-11-06 General Electric Company Heat curable compositions
US4374751A (en) * 1980-08-08 1983-02-22 General Electric Company Polymerization initiator compositions
JPS57102922A (en) * 1980-12-17 1982-06-26 Asahi Denka Kogyo Kk Thermosetting composition
US4358552A (en) 1981-09-10 1982-11-09 Morton-Norwich Products, Inc. Epoxy resinous molding compositions having low coefficient of thermal expansion and high thermal conductivity
IT1152359B (it) * 1981-11-02 1986-12-31 Grace W R & Co Composizione epossidica termoinduribile
US4482679A (en) * 1982-09-18 1984-11-13 Ciba-Geigy Corporation Heat-curable epoxy compositions containing diaryliodosyl salts
JPS60219221A (ja) * 1984-04-17 1985-11-01 Nippon Shokubai Kagaku Kogyo Co Ltd 熱硬化性成形材料組成物
US4845159A (en) * 1987-10-01 1989-07-04 General Electric Company Photoactive and thermally active polymeric iodonium salts, use, and method for making
US4842800A (en) * 1987-10-01 1989-06-27 General Electric Company Method of encapsulating electronic devices

Also Published As

Publication number Publication date
JPH03115427A (ja) 1991-05-16
EP0411405A3 (en) 1991-12-18
JPH0822905B2 (ja) 1996-03-06
AU635049B2 (en) 1993-03-11
MX173674B (es) 1994-03-22
NZ233268A (en) 1991-09-25
US5015675A (en) 1991-05-14
BR9003703A (pt) 1991-09-03
AU5973390A (en) 1991-01-31
FI903241A0 (fi) 1990-06-27
EP0411405A2 (en) 1991-02-06

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