MX173674B - Metodo de encapsulado, dispositivos microelectronicos asi hechos y composicion curable mediante calor - Google Patents

Metodo de encapsulado, dispositivos microelectronicos asi hechos y composicion curable mediante calor

Info

Publication number
MX173674B
MX173674B MX021796A MX2179690A MX173674B MX 173674 B MX173674 B MX 173674B MX 021796 A MX021796 A MX 021796A MX 2179690 A MX2179690 A MX 2179690A MX 173674 B MX173674 B MX 173674B
Authority
MX
Mexico
Prior art keywords
heat
curable composition
parts
microelectronic devices
encapsulation method
Prior art date
Application number
MX021796A
Other languages
English (en)
Inventor
Erik Wilhelm Walles
John Henry Lupinsky
James Vincent Crivello
Original Assignee
Gen Electric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gen Electric filed Critical Gen Electric
Publication of MX173674B publication Critical patent/MX173674B/es

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

La presente invención se refiere a una composición curable mediante calor, la cual está compuesta, en peso por 100 partes de una resina epóxica que contiene menos de 100 partes por millón de cloruro hidrolizable; de 10 a 1000 partes de un rellenador de silice fundida, una cantidad catalítica de una sal monomerica o polimerica compatible de hexafluoroantimoniato de diarilyodonio y una cantidad efectiva un compuesto aromático generador de radicales libres, como co-catalizador para la sal monomerica o polimerica.
MX021796A 1989-07-31 1990-07-31 Metodo de encapsulado, dispositivos microelectronicos asi hechos y composicion curable mediante calor MX173674B (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/386,670 US5015675A (en) 1989-07-31 1989-07-31 Encapsulation method, microelectronic devices made therefrom, and heat curable compositions based on epoxy resins, diaryliodonium hexafluroantimonate salts and free radical generators

Publications (1)

Publication Number Publication Date
MX173674B true MX173674B (es) 1994-03-22

Family

ID=23526558

Family Applications (1)

Application Number Title Priority Date Filing Date
MX021796A MX173674B (es) 1989-07-31 1990-07-31 Metodo de encapsulado, dispositivos microelectronicos asi hechos y composicion curable mediante calor

Country Status (9)

Country Link
US (1) US5015675A (es)
EP (1) EP0411405A3 (es)
JP (1) JPH0822905B2 (es)
KR (1) KR910003009A (es)
AU (1) AU635049B2 (es)
BR (1) BR9003703A (es)
FI (1) FI903241A0 (es)
MX (1) MX173674B (es)
NZ (1) NZ233268A (es)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2918328B2 (ja) * 1990-11-26 1999-07-12 株式会社デンソー 樹脂の選定方法及びこの選定方法により選定された樹脂を有する樹脂封止型半導体装置
EP0634792B1 (en) * 1991-03-08 1998-04-29 Japan Gore-Tex, Inc. Resin-sealed semiconductor device containing porous fluororesin
JP2927081B2 (ja) * 1991-10-30 1999-07-28 株式会社デンソー 樹脂封止型半導体装置
US6439698B1 (en) 2000-01-14 2002-08-27 Lexmark International, Inc Dual curable encapsulating material
DE10051051A1 (de) 2000-10-14 2002-04-18 Bosch Gmbh Robert Silikonmodifizierte Einkomponentenvergußmasse
US6425655B1 (en) 2001-06-05 2002-07-30 Lexmark International, Inc. Dual curable encapsulating material
JP2004040031A (ja) * 2002-07-08 2004-02-05 Stanley Electric Co Ltd 表面実装型発光ダイオード
WO2005108487A1 (en) * 2004-04-22 2005-11-17 Henkel Corporation Methods for improving the flux compatibility of underfill formulations
US7378455B2 (en) 2005-06-30 2008-05-27 General Electric Company Molding composition and method, and molded article
US7429800B2 (en) * 2005-06-30 2008-09-30 Sabic Innovative Plastics Ip B.V. Molding composition and method, and molded article
US20070004871A1 (en) * 2005-06-30 2007-01-04 Qiwei Lu Curable composition and method
US20070066698A1 (en) * 2005-09-20 2007-03-22 Yang Wenliang P Dual cure compositions, methods of curing thereof and articles therefrom
US20070066710A1 (en) * 2005-09-21 2007-03-22 Peters Edward N Method for electrical insulation and insulated electrical conductor
ATE514187T1 (de) * 2005-09-27 2011-07-15 Semikron Elektronik Gmbh Leistungshalbleitermodul mit überstromschutzeinrichtung
DE102005046063B3 (de) * 2005-09-27 2007-03-15 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit Überstromschutzeinrichtung
US20090107632A1 (en) * 2007-10-30 2009-04-30 General Electric Company Adhesive compositions for high temperature sensors and methods of making the same
US8337163B2 (en) * 2007-12-05 2012-12-25 General Electric Company Fiber composite half-product with integrated elements, manufacturing method therefor and use thereof
US8079820B2 (en) * 2008-12-18 2011-12-20 General Electric Company Blade module, a modular rotor blade and a method for assembling a modular rotor blade
US20120040106A1 (en) 2010-08-16 2012-02-16 Stefan Simmerer Apparatus for impregnating a fiber material with a resin and methods for forming a fiber-reinforced plastic part
US20120138223A1 (en) 2011-09-29 2012-06-07 General Electric Company Uv-ir combination curing system and method of use for wind blade manufacture and repair
CN110114406A (zh) * 2016-12-29 2019-08-09 汉高股份有限及两合公司 可阳离子固化的密封剂组合物
DE102020127830A1 (de) 2020-10-22 2022-04-28 Infineon Technologies Ag Moldverbindungen und Packages zum Verkapseln elektronischer Komponenten

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4173551A (en) * 1974-05-02 1979-11-06 General Electric Company Heat curable compositions
US4374751A (en) * 1980-08-08 1983-02-22 General Electric Company Polymerization initiator compositions
JPS57102922A (en) * 1980-12-17 1982-06-26 Asahi Denka Kogyo Kk Thermosetting composition
US4358552A (en) 1981-09-10 1982-11-09 Morton-Norwich Products, Inc. Epoxy resinous molding compositions having low coefficient of thermal expansion and high thermal conductivity
IT1152359B (it) * 1981-11-02 1986-12-31 Grace W R & Co Composizione epossidica termoinduribile
US4482679A (en) * 1982-09-18 1984-11-13 Ciba-Geigy Corporation Heat-curable epoxy compositions containing diaryliodosyl salts
JPS60219221A (ja) * 1984-04-17 1985-11-01 Nippon Shokubai Kagaku Kogyo Co Ltd 熱硬化性成形材料組成物
US4845159A (en) * 1987-10-01 1989-07-04 General Electric Company Photoactive and thermally active polymeric iodonium salts, use, and method for making
US4842800A (en) * 1987-10-01 1989-06-27 General Electric Company Method of encapsulating electronic devices

Also Published As

Publication number Publication date
BR9003703A (pt) 1991-09-03
AU5973390A (en) 1991-01-31
US5015675A (en) 1991-05-14
FI903241A0 (fi) 1990-06-27
KR910003009A (ko) 1991-02-26
NZ233268A (en) 1991-09-25
EP0411405A2 (en) 1991-02-06
JPH03115427A (ja) 1991-05-16
JPH0822905B2 (ja) 1996-03-06
EP0411405A3 (en) 1991-12-18
AU635049B2 (en) 1993-03-11

Similar Documents

Publication Publication Date Title
MX173674B (es) Metodo de encapsulado, dispositivos microelectronicos asi hechos y composicion curable mediante calor
KR850003552A (ko) 전자소자 캡슐화수지용 충전제 및 그를 함유하는 전자소자 캡슐화수지 조성물
ES2005294A6 (es) Una composicion de resina termoendurecible.
ES2074991T3 (es) Composicion de resina para revestimiento.
KR910016067A (ko) 반도체 장치의 봉지재
BR8400531A (pt) Composicoes de epoxido com um endurecedor de diamina,material de reforco pre-impregnado com a resina sintetica(prepreg),e aglomerado
ES2152527T3 (es) Empleo de resinas epoxi modificadas con silicona como masas de sellado.
ES2046191T3 (es) Composicion adhesiva fundible con calor a base de poliesteres.
SG65576A1 (en) Semiconductor encapsulating epoxy resin compositions and semiconductor devices encapsulated therewith
MY104309A (en) Microencapsulation method, microelectronic devices made therefrom, and heat curable composition
BR8105861A (pt) Resina para coroa e ponte provisorias
ES2072919T3 (es) Composiciones de resina epoxida curables.
MY107113A (en) Epoxy resin composition for semiconductor sealing.
MX172203B (es) Composiciones de moldeo
ATE195544T1 (de) Zusammensetzungen auf der basis von epoxidharzen, zähigkeitsvermittlern und aminen
IN164683B (es)
ES555803A0 (es) Procedimiento para producir un objeto de composicion curada de bismaleimida o isomero de isomaleimida
ES2116316T3 (es) Composiciones de caucho de fluorosilicona.
ES2101557T3 (es) Procedimiento para la obtencion de epoxisiloxanos.
JPS53115768A (en) Preparation of marblelike cured material
GB1416361A (en) Epoxy adhesive composition
ATE240358T1 (de) Chemische zusammensetzungen
JPS5740963A (en) Resin-sealed semiconductor device
KR940019803A (ko) 반도체 소자 봉지용 수지조성물(2)
TW327643B (en) Epoxy resin composition the invention relates to an epoxy resin composition comprising an epoxy resin and a curing agent, which can be used to seal a semiconductor device with excellent moisture resistance.