MX165339B - Composicion curable que contiene una resina epoxi difuncional, una resina epoxi polifuncional, un fenol difuncional y fenol polifuncional - Google Patents

Composicion curable que contiene una resina epoxi difuncional, una resina epoxi polifuncional, un fenol difuncional y fenol polifuncional

Info

Publication number
MX165339B
MX165339B MX011444A MX1144488A MX165339B MX 165339 B MX165339 B MX 165339B MX 011444 A MX011444 A MX 011444A MX 1144488 A MX1144488 A MX 1144488A MX 165339 B MX165339 B MX 165339B
Authority
MX
Mexico
Prior art keywords
epoxy resin
diffunctional
phenol
polyfunctional
phenolic hydroxyl
Prior art date
Application number
MX011444A
Other languages
English (en)
Inventor
Louis L Walker
Paul A Larson
Original Assignee
Dow Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Chemical Co filed Critical Dow Chemical Co
Publication of MX165339B publication Critical patent/MX165339B/es

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/066—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31522—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31529—Next to metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)

Abstract

La presente invención se refiere a una composición, caracterizada porque comprende: A) un componente que contiene epoxi, que consiste esencialmente de: (1) 5 a 95 por ciento en peso de por lo menos una resina epoxi que tiene un promedio de no más de 2 grupos epóxido vecinales por molécula; y (2) de 95 a 5 por ciento en peso de cuando menos una resina epoxi que tiene un promedio de más de dos grupos epóxido vecinales por molécula y b) un componente que contiene hidroxilo fenólico, que consiste esencialmente de; (1) 10 a 70 equivalentes por ciento de por lo menos un compuesto que contiene hidroxilo fenólico, que tiene un promedio de no más de dos grupos hidroxilo fenólico por molécula y (2) de 90 a 30 equivalentes por ciento de cuando menos un compuesto que contiene hidroxilo fenólico, por molécula; en donde los componentes (a) y (b) están presentes en cantidades que proveen una relación de grupos hidroxilo fenólico por cada grupo expoxi, de 0.75:1 a 1.2:1
MX011444A 1987-11-16 1988-05-12 Composicion curable que contiene una resina epoxi difuncional, una resina epoxi polifuncional, un fenol difuncional y fenol polifuncional MX165339B (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/121,329 US4868059A (en) 1987-11-16 1987-11-16 Curable composition containing a difunctional epoxy resin, a polyfunctional epoxy resin, a difunctional phenol and a polyfunctional phenol

Publications (1)

Publication Number Publication Date
MX165339B true MX165339B (es) 1992-11-05

Family

ID=22395980

Family Applications (1)

Application Number Title Priority Date Filing Date
MX011444A MX165339B (es) 1987-11-16 1988-05-12 Composicion curable que contiene una resina epoxi difuncional, una resina epoxi polifuncional, un fenol difuncional y fenol polifuncional

Country Status (10)

Country Link
US (1) US4868059A (es)
EP (1) EP0316509A3 (es)
JP (1) JP2716726B2 (es)
KR (1) KR920001742B1 (es)
AU (1) AU607989B2 (es)
BR (1) BR8802396A (es)
CA (1) CA1333732C (es)
IL (1) IL86138A (es)
MX (1) MX165339B (es)
MY (1) MY103263A (es)

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EP0487164A3 (en) * 1985-11-26 1992-06-24 Sumitomo Chemical Company, Limited Thermosetting resin composition and a composite material comprising the cured product of the resin composition as its matrix
AU608627B2 (en) * 1987-08-10 1991-04-11 Dow Chemical Company, The Curing agent compositions, laminating varnishes containing same and laminates prepared therefrom
US5066735A (en) * 1987-11-16 1991-11-19 The Dow Chemical Company Curable composition containing a difunctional epoxy resin, a polyfunctional epoxy resin, a difunctional phenol and a polyfunctional phenol
JPH0627181B2 (ja) * 1988-02-16 1994-04-13 ソマール株式会社 可とう性エポキシ樹脂組成物
US4874669A (en) * 1988-08-15 1989-10-17 The Dow Chemical Company Curable compositions containing an epoxy resin, a difunctional phenol and a polyfunctional phenol
EP0379468B1 (de) * 1989-01-20 1995-03-01 Ciba-Geigy Ag Härtbare Epoxidharz-Stoffgemische enthaltend einen Thermoplast mit phenolischen Endgruppen
US5661223A (en) * 1989-04-25 1997-08-26 Mitsubishi Denki Kabushiki Kaisha Composition of phenolic resin-modified epoxy resin and straight chain polymer
JPH0388818A (ja) * 1989-08-31 1991-04-15 Sumitomo Chem Co Ltd エポキシ樹脂用硬化剤
JPH03139519A (ja) * 1989-10-25 1991-06-13 Sumitomo Chem Co Ltd エポキシ樹脂用硬化剤
JPH0832817B2 (ja) * 1990-08-17 1996-03-29 東邦レーヨン株式会社 低発煙性フェノール樹脂系プリプレグ及びその製造法
JPH04103620A (ja) * 1990-08-24 1992-04-06 Dow Chem Nippon Kk 硬化性樹脂組成物
DE4110219A1 (de) * 1991-03-28 1992-10-01 Huels Troisdorf Verfahren zur herstellung von prepregs mit loesungsmittelfreiem epoxidharz
MY131084A (en) * 1991-04-03 2007-07-31 Dow Chemical Co Epoxy resin compositions for use in electrical laminates.
JPH05239238A (ja) * 1991-08-26 1993-09-17 Matsushita Electric Works Ltd プリプレグの製造法及び該プリプレグを用いた積層板
US5364925A (en) * 1992-01-27 1994-11-15 The Dow Chemical Company Epoxy resin advanced with a dihydric phenol and further chain extended with an additional dihydric phenol for use in electrical laminates
DE69307442T2 (de) * 1992-09-21 1997-08-21 Sumitomo Bakelite Co Epoxidharzzusammensetzung auf Basis des Diglycidylethers von Biphenyldiol
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US5439779A (en) * 1993-02-22 1995-08-08 International Business Machines Corporation Aqueous soldermask
GB9421405D0 (en) † 1994-10-21 1994-12-07 Dow Chemical Co Low voc laminating formulations
US5994429A (en) * 1995-03-10 1999-11-30 Toshiba Chemical Corporation Halogen-free flame-retardant epoxy resin composition
TW354451B (en) * 1995-09-18 1999-03-11 Ibm Method of fabricating cross-linked biobased materials and structures fabricated therewith a method comprising the step of: forming the mixture of polymer and cross-linked agent
US6486256B1 (en) 1998-10-13 2002-11-26 3M Innovative Properties Company Composition of epoxy resin, chain extender and polymeric toughener with separate base catalyst
US6512031B1 (en) * 1999-04-15 2003-01-28 Shin-Etsu Chemical Co., Ltd. Epoxy resin composition, laminate film using the same, and semiconductor device
ATE333487T1 (de) * 2000-02-07 2006-08-15 Nagoya Oilchemical Harzzusammensetzung, formmaterial und geformter gegenstand
US7223477B2 (en) * 2000-12-05 2007-05-29 Alpha Coating Technologies, Llc Coating powders having enhanced flexability
US6537671B2 (en) 2000-12-05 2003-03-25 Alpha Coating Technologies, Llc Coating powders having enhanced electrostatic chargeability
US20060222856A1 (en) * 2003-06-02 2006-10-05 Katsuhiko Itou Prepreg for printed wiring board and copper-clad laminated board
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CN102977340A (zh) * 2005-12-22 2013-03-20 陶氏环球技术有限责任公司 包含混合催化剂体系的可固化环氧树脂组合物以及由其制得的层压材料
EP3261814B1 (en) 2015-02-27 2023-04-19 Huntsman Advanced Materials Licensing (Switzerland) GmbH A process for manufacturing a fiber reinforced composite article, the composite article obtained and the use thereof

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Also Published As

Publication number Publication date
JP2716726B2 (ja) 1998-02-18
IL86138A0 (en) 1988-11-15
AU1506788A (en) 1989-05-18
EP0316509A3 (en) 1989-10-18
IL86138A (en) 1991-08-16
KR890008249A (ko) 1989-07-10
US4868059A (en) 1989-09-19
CA1333732C (en) 1994-12-27
BR8802396A (pt) 1989-05-23
AU607989B2 (en) 1991-03-21
KR920001742B1 (ko) 1992-02-24
MY103263A (en) 1993-05-29
JPH01153715A (ja) 1989-06-15
EP0316509A2 (en) 1989-05-24

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