KR890008249A - 이작용성 에폭시 수지, 다작용성 에폭시 수지, 이작용성 페놀 및 다작용성 페놀을 함유하는 경화성 조성물 - Google Patents

이작용성 에폭시 수지, 다작용성 에폭시 수지, 이작용성 페놀 및 다작용성 페놀을 함유하는 경화성 조성물 Download PDF

Info

Publication number
KR890008249A
KR890008249A KR1019880005136A KR880005136A KR890008249A KR 890008249 A KR890008249 A KR 890008249A KR 1019880005136 A KR1019880005136 A KR 1019880005136A KR 880005136 A KR880005136 A KR 880005136A KR 890008249 A KR890008249 A KR 890008249A
Authority
KR
South Korea
Prior art keywords
component
composition
phenolic hydroxyl
general formula
epoxy resin
Prior art date
Application number
KR1019880005136A
Other languages
English (en)
Other versions
KR920001742B1 (ko
Inventor
엘.위커 루이스
에이. 라슨 폴
Original Assignee
리챠드 지.웨터맨
더 다우 케미칼 캄파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 리챠드 지.웨터맨, 더 다우 케미칼 캄파니 filed Critical 리챠드 지.웨터맨
Publication of KR890008249A publication Critical patent/KR890008249A/ko
Application granted granted Critical
Publication of KR920001742B1 publication Critical patent/KR920001742B1/ko

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/066—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31522—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31529—Next to metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)

Abstract

내용 없음

Description

이작용성 에폭시 수지, 다작용성 에폭시 수지, 이작용성 페놀 및 다작용성 페놀을 함유하는 경화성 조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (12)

  1. (A)필수적으로(1)분자당(평균)2개 이하의 인접한 에폭사이드 그룹을 갖는 하나 이상의 에폭시 수지 5 내지 96중량%: 및 (2)분자당(평균)2개 이상의 인접한 에폭사이드 그룹을 갖는 하나 이상의 에폭시 수지 95 내지 5중량%로 구성된 에폭시-함유 성분: 및 (B)필수적으로(1)분자당 평균 2개 이하의 페놀성 히드록실 그룹을 갖는 하나 이상의 페놀성 히드록실-함유 화합물 10 내지 70중량%: 및 (2)분자당 평균 2개 이상의 페놀성 히드록실 그룹을 갖는 하나 이상의 페놀성 히드록실-함유 화합물 90 내지 30중량%로 구성된 페놀성 히드록실-함유 성분으로 이루어지며, 성분(A) 및 (B)가 각각의 에폭시 그룹에 대한 페놀성 히드록실 그룹의 비가 0.75:1 내지 1.2:1이 되도록 하는 양으로 존재하는 조성물.
  2. 제1항에 있어서, (a)성분(A-1)이 하기 일반식(Ⅰ) 또는 (Ⅱ)의 에폭시 수지 또는 이러한 에폭시 수지의 혼합물이고, (b)성분(A-2)이 하기 일반식(Ⅲ) 또는 (Ⅳ)의 에폭시 수지 또는 이러한 에폭시 수지의 혼합물이며, (c)성분(B-1)이 하기 일반식(Ⅴ) 또는 (Ⅵ)의 페놀성 히드록실-함유 화합물 또는 이러한 페놀성 히드록실-함유 화합물의 혼합물이고, (d)성분(B-2)가 하기 일반식(Ⅶ) 또는 (Ⅷ)의 페녹성 히드록실-함유 화합물 또는 이러한 페놀성 히드록실-함유 화합물의 혼합물인 조성물.
    상기식에서 A는 각각 독립적으로 C1내지 C10의 2가 히드로카르빌그룹, -S-, -S-S-, -SO-, -SO2-, -CO- 또는 -O-이며, A'는 각각 독립적으로 C1내지 C10의 2가 히드로카르빌 그룹이고, R은 각각 독립적으로 수소 또는 C1내지 C3의 알킬그룹이며, R'는 각각 독립적으로 수소 또는 C1내지 C10의 히드로카르빌 그룹이고, x는 각각 독립적으로 수소, C1내지 C10의 알킬 그룹 또는 할로겐이며, m은 0,1 내지 7이고, m'는 0 내지 3이며, n은 각각 독립적으로 0 또는 1이고, n'는 0 내지 10이다.
  3. 제2항에 있어서, (a)성분(A-1)이 n이 1이고 n'가 0 내지 2인 일반식(Ⅱ)의 디글리시딜 에테르이고, (b)성분(A-2)가 m이 1 내지 5인 일반식(Ⅲ)의 폴리글리시딜 에테르이며, (c)성분(B-1)이 n이 1인 일반식(Ⅵ)의 페놀성 히드록실-함유 화합물이고, (d)성분(B-2)가 m이 0,1 내지 7인 일반식(Ⅶ)의 페놀성 히드록실-함유 화합물인 조성물.
  4. 제3항에 있어서, (a)성분(A-1)이 n이 1이고 n'가 0 내지 2인 일반식(Ⅱ)의 디글리시딜 에테르이고, (b)성분(A-2)가 페놀-포름알데히드 노볼락 에폭시 수지의폴리글리시딜 에테르이며, (c)성분(B-1)이 비스페놀 A또는 테트라브로모비스페놀 A이고, (d)성분(B-2)가 페놀-포름알데히드 노볼락 수지인 조성물.
  5. 제1항에 있어서, 성분(A)와 (B)의 반응을 수행하기 위한 하나 이상의 촉매(C)의 촉매량을 추가로 함유하는 조성물.
  6. 제5항에 있어서, 촉매가 포스포늄 화합물, 이미다졸 또는 이의 혼합물인 조성물.
  7. 제6항에 있어서, 촉매가 1:0.9 내지 1:1.25의 몰비의 4급 포스포늄 아세테이트, 아세트산 착물: 플루오로 붕산, 2-메틸이미다졸 또는 이의 혼합물인 조성물.
  8. 제1항에 있어서, 안정화제를 추가로 함유하는 조성물.
  9. 제5항 내지 제7항중 어느 한항에 있어서, 총 조성물의 1 내지 75중량%의 양으로 하나 이상의 용매(D)를 추가로 함유하는 조성물.
  10. 제5항 내지 제7항중 어느 한항의 조성물을 경화시켜 수득한 제품.
  11. 제9항의 조성물로 침지시킨 기질 재표의 하나 이상의 층을 경화시켜 수득한 적층판.
  12. 제11항에 있어서, 전기 전도성 재표의 외층을 갖는 적층판.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019880005136A 1987-11-16 1988-05-03 이작용성 에폭시 수지, 다작용성 에폭시 수지, 이작용성 페놀 및 다작용성 페놀을 함유하는 경화성 조성물 KR920001742B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US07/121,329 US4868059A (en) 1987-11-16 1987-11-16 Curable composition containing a difunctional epoxy resin, a polyfunctional epoxy resin, a difunctional phenol and a polyfunctional phenol
US121,329 1987-11-16
US121329 1987-11-16

Publications (2)

Publication Number Publication Date
KR890008249A true KR890008249A (ko) 1989-07-10
KR920001742B1 KR920001742B1 (ko) 1992-02-24

Family

ID=22395980

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019880005136A KR920001742B1 (ko) 1987-11-16 1988-05-03 이작용성 에폭시 수지, 다작용성 에폭시 수지, 이작용성 페놀 및 다작용성 페놀을 함유하는 경화성 조성물

Country Status (10)

Country Link
US (1) US4868059A (ko)
EP (1) EP0316509A3 (ko)
JP (1) JP2716726B2 (ko)
KR (1) KR920001742B1 (ko)
AU (1) AU607989B2 (ko)
BR (1) BR8802396A (ko)
CA (1) CA1333732C (ko)
IL (1) IL86138A (ko)
MX (1) MX165339B (ko)
MY (1) MY103263A (ko)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0487164A3 (en) * 1985-11-26 1992-06-24 Sumitomo Chemical Company, Limited Thermosetting resin composition and a composite material comprising the cured product of the resin composition as its matrix
AU608627B2 (en) * 1987-08-10 1991-04-11 Dow Chemical Company, The Curing agent compositions, laminating varnishes containing same and laminates prepared therefrom
US5066735A (en) * 1987-11-16 1991-11-19 The Dow Chemical Company Curable composition containing a difunctional epoxy resin, a polyfunctional epoxy resin, a difunctional phenol and a polyfunctional phenol
JPH0627181B2 (ja) * 1988-02-16 1994-04-13 ソマール株式会社 可とう性エポキシ樹脂組成物
US4874669A (en) * 1988-08-15 1989-10-17 The Dow Chemical Company Curable compositions containing an epoxy resin, a difunctional phenol and a polyfunctional phenol
EP0379468B1 (de) * 1989-01-20 1995-03-01 Ciba-Geigy Ag Härtbare Epoxidharz-Stoffgemische enthaltend einen Thermoplast mit phenolischen Endgruppen
US5661223A (en) * 1989-04-25 1997-08-26 Mitsubishi Denki Kabushiki Kaisha Composition of phenolic resin-modified epoxy resin and straight chain polymer
JPH0388818A (ja) * 1989-08-31 1991-04-15 Sumitomo Chem Co Ltd エポキシ樹脂用硬化剤
JPH03139519A (ja) * 1989-10-25 1991-06-13 Sumitomo Chem Co Ltd エポキシ樹脂用硬化剤
JPH0832817B2 (ja) * 1990-08-17 1996-03-29 東邦レーヨン株式会社 低発煙性フェノール樹脂系プリプレグ及びその製造法
JPH04103620A (ja) * 1990-08-24 1992-04-06 Dow Chem Nippon Kk 硬化性樹脂組成物
DE4110219A1 (de) * 1991-03-28 1992-10-01 Huels Troisdorf Verfahren zur herstellung von prepregs mit loesungsmittelfreiem epoxidharz
MY131084A (en) * 1991-04-03 2007-07-31 Dow Chemical Co Epoxy resin compositions for use in electrical laminates.
JPH05239238A (ja) * 1991-08-26 1993-09-17 Matsushita Electric Works Ltd プリプレグの製造法及び該プリプレグを用いた積層板
US5364925A (en) * 1992-01-27 1994-11-15 The Dow Chemical Company Epoxy resin advanced with a dihydric phenol and further chain extended with an additional dihydric phenol for use in electrical laminates
DE69307442T2 (de) * 1992-09-21 1997-08-21 Sumitomo Bakelite Co Epoxidharzzusammensetzung auf Basis des Diglycidylethers von Biphenyldiol
TW251298B (ko) * 1993-01-12 1995-07-11 Shell Internat Res Schappej Bv
US5439779A (en) * 1993-02-22 1995-08-08 International Business Machines Corporation Aqueous soldermask
GB9421405D0 (en) † 1994-10-21 1994-12-07 Dow Chemical Co Low voc laminating formulations
US5994429A (en) * 1995-03-10 1999-11-30 Toshiba Chemical Corporation Halogen-free flame-retardant epoxy resin composition
TW354451B (en) * 1995-09-18 1999-03-11 Ibm Method of fabricating cross-linked biobased materials and structures fabricated therewith a method comprising the step of: forming the mixture of polymer and cross-linked agent
US6486256B1 (en) 1998-10-13 2002-11-26 3M Innovative Properties Company Composition of epoxy resin, chain extender and polymeric toughener with separate base catalyst
US6512031B1 (en) * 1999-04-15 2003-01-28 Shin-Etsu Chemical Co., Ltd. Epoxy resin composition, laminate film using the same, and semiconductor device
ATE333487T1 (de) * 2000-02-07 2006-08-15 Nagoya Oilchemical Harzzusammensetzung, formmaterial und geformter gegenstand
US7223477B2 (en) * 2000-12-05 2007-05-29 Alpha Coating Technologies, Llc Coating powders having enhanced flexability
US6537671B2 (en) 2000-12-05 2003-03-25 Alpha Coating Technologies, Llc Coating powders having enhanced electrostatic chargeability
US20060222856A1 (en) * 2003-06-02 2006-10-05 Katsuhiko Itou Prepreg for printed wiring board and copper-clad laminated board
US6855738B2 (en) 2003-06-06 2005-02-15 Dow Global Technologies Inc. Nanoporous laminates
CN102977340A (zh) * 2005-12-22 2013-03-20 陶氏环球技术有限责任公司 包含混合催化剂体系的可固化环氧树脂组合物以及由其制得的层压材料
EP3261814B1 (en) 2015-02-27 2023-04-19 Huntsman Advanced Materials Licensing (Switzerland) GmbH A process for manufacturing a fiber reinforced composite article, the composite article obtained and the use thereof

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL133216C (ko) * 1964-09-22
US3738862A (en) * 1971-11-08 1973-06-12 Shell Oil Co Process for preparing reinforced laminates in situ with epoxy-polyhydric phenol condensates
US3931109A (en) * 1972-03-13 1976-01-06 The Dow Chemical Company Process for coating substrates with high molecular weight epoxy resins
US4322456A (en) * 1972-03-13 1982-03-30 The Dow Chemical Company Process for coating substrates with high molecular weight epoxy resins
GB1583539A (en) * 1977-06-16 1981-01-28 Du Pont Epoxy resin powder coating composition
US4186036A (en) * 1978-08-25 1980-01-29 The Dow Chemical Company Weldable coating compositions
JPS5819322A (ja) * 1981-07-27 1983-02-04 Dainippon Ink & Chem Inc 新規多官能エポキシ樹脂の製造方法
US4440914A (en) * 1981-10-19 1984-04-03 Ciba-Geigy Corporation Solid epoxy resin systems
US4549000A (en) * 1983-03-09 1985-10-22 Vernicolor Ag Thermosetting powder lacquer for covering weld seams
US4604317A (en) * 1984-10-05 1986-08-05 The Dow Chemical Company Curable compositions containing a polyepoxide and a halogenated bisphenol
JPS61148228A (ja) * 1984-12-20 1986-07-05 Ajinomoto Co Inc 一液性エポキシ樹脂組成物
JPS61148226A (ja) * 1984-12-21 1986-07-05 Toto Kasei Kk 塗料用及び積層板用固体状エポキシ樹脂
JPS61246228A (ja) * 1985-04-24 1986-11-01 Shin Kobe Electric Mach Co Ltd 積層板用樹脂組成物
GB8519290D0 (en) * 1985-07-31 1985-09-04 Dow Chemical Rheinwerk Gmbh Resin composition
DE3700287A1 (de) * 1986-01-10 1987-07-16 Hitachi Chemical Co Ltd Epoxyharz-zusammensetzung fuer kupfer-plattierte laminate
CA1288189C (en) * 1986-01-20 1991-08-27 Glenda C. Young Epoxy resin composition
CA1272345A (en) * 1986-02-24 1990-07-31 The Dow Chemical Company Curable compositions containing a polyepoxide and a halogenated bisphenol

Also Published As

Publication number Publication date
JP2716726B2 (ja) 1998-02-18
IL86138A0 (en) 1988-11-15
AU1506788A (en) 1989-05-18
EP0316509A3 (en) 1989-10-18
MX165339B (es) 1992-11-05
IL86138A (en) 1991-08-16
US4868059A (en) 1989-09-19
CA1333732C (en) 1994-12-27
BR8802396A (pt) 1989-05-23
AU607989B2 (en) 1991-03-21
KR920001742B1 (ko) 1992-02-24
MY103263A (en) 1993-05-29
JPH01153715A (ja) 1989-06-15
EP0316509A2 (en) 1989-05-24

Similar Documents

Publication Publication Date Title
KR890008249A (ko) 이작용성 에폭시 수지, 다작용성 에폭시 수지, 이작용성 페놀 및 다작용성 페놀을 함유하는 경화성 조성물
KR880007590A (ko) 플루오렌-함유 비스페놀의 글리시딜에테르
KR880001760A (ko) 개선된 양이온성 에폭시 수지 조성물
KR890010094A (ko) 가요 처리된 에폭시 수지 조성물
KR880005166A (ko) 열적으로 안정한 캡화된 열 가소성 페놀계 수지
US5066735A (en) Curable composition containing a difunctional epoxy resin, a polyfunctional epoxy resin, a difunctional phenol and a polyfunctional phenol
US4687832A (en) Novel epoxy resin compositions
KR900003286A (ko) 에폭시수지, 2작용성 페놀 및 다작용성 페놀을 함유하는 경화성 조성물
GB1515140A (en) Process for preparing water-dilutable heat-curing coating compositions
KR910004698A (ko) 개량된 에폭시 수지 조성물 및 이의 제조방법
KR920701362A (ko) 전기 적층품을 위한 폴리페닐렌 옥시드/하이브리드 에폭시 수지계
KR880701749A (ko) 할로겐화된 에폭시수지 및 이로부터 제조된 개선된 수지
US5405931A (en) Epoxy resin compositions for use in electrical laminates
MY101760A (en) Controlled film build epoxy coatings applied by cathodic electrodeposition
KR930017972A (ko) 트리글리시딜 이소시아누레이트 계 에폭시 수지
KR900003315A (ko) 양이온 전착도료용 수지 조성물
KR900004796A (ko) 포스포늄 촉매를 함유하는 에폭시 수지
KR870007980A (ko) 폴리에폭사이드와 할로겐화 비스페놀을 함유하는 경화성 조성물
GB1488241A (en) Process for preparing water-dilutable coating composition
KR910003034A (ko) 안료 분산제
KR100225739B1 (ko) 전기용 적층판에 사용되는 에폭시 수지 조성물
KR890003873A (ko) 경화제 조성물, 이를 함유한 적층 니스 및 이로부터 제조한 적층물
KR870007955A (ko) 지방족 할라이드 함량이 낮은 에폭시 또는 페녹시 수지를 제조하는 방법
KR900000402A (ko) 방향족계 에폭시수지의 모노카복실산 유도체
US4959425A (en) Laminating varnish composition containing a difunctional epoxy resin, a polyfunctional epoxy resin, a difunctional phenol and a polyfunctional phenol and a solvent

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 19941223

Year of fee payment: 4

LAPS Lapse due to unpaid annual fee