KR880701749A - 할로겐화된 에폭시수지 및 이로부터 제조된 개선된 수지 - Google Patents
할로겐화된 에폭시수지 및 이로부터 제조된 개선된 수지Info
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- KR880701749A KR880701749A KR1019880700532A KR880700532A KR880701749A KR 880701749 A KR880701749 A KR 880701749A KR 1019880700532 A KR1019880700532 A KR 1019880700532A KR 880700532 A KR880700532 A KR 880700532A KR 880701749 A KR880701749 A KR 880701749A
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- 239000003822 epoxy resin Substances 0.000 title claims 10
- 229920000647 polyepoxide Polymers 0.000 title claims 10
- 229920005989 resin Polymers 0.000 title claims 2
- 239000011347 resin Substances 0.000 title claims 2
- 125000004432 carbon atom Chemical group C* 0.000 claims 15
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 13
- 229910052739 hydrogen Inorganic materials 0.000 claims 10
- 239000001257 hydrogen Substances 0.000 claims 10
- 125000005843 halogen group Chemical group 0.000 claims 9
- 229910052736 halogen Inorganic materials 0.000 claims 7
- 150000002367 halogens Chemical class 0.000 claims 7
- 239000000203 mixture Substances 0.000 claims 6
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical group C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims 5
- 150000002431 hydrogen Chemical class 0.000 claims 5
- 125000003118 aryl group Chemical group 0.000 claims 4
- 239000003795 chemical substances by application Substances 0.000 claims 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 4
- NRYMKBCXSUVWQA-UHFFFAOYSA-N 3,5-dibromo-4-[(2,6-dibromo-4-hydroxy-3,5-dimethylphenyl)methyl]-2,6-dimethylphenol Chemical compound CC1=C(O)C(C)=C(Br)C(CC=2C(=C(C)C(O)=C(C)C=2Br)Br)=C1Br NRYMKBCXSUVWQA-UHFFFAOYSA-N 0.000 claims 3
- ASQUJLDEXYPPML-UHFFFAOYSA-N 3,5-dibromo-4-[2-(2,6-dibromo-4-hydroxy-3,5-dimethylphenyl)ethyl]-2,6-dimethylphenol Chemical compound CC1=C(O)C(C)=C(Br)C(CCC=2C(=C(C)C(O)=C(C)C=2Br)Br)=C1Br ASQUJLDEXYPPML-UHFFFAOYSA-N 0.000 claims 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims 3
- 150000001875 compounds Chemical class 0.000 claims 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 3
- 125000000217 alkyl group Chemical group 0.000 claims 2
- 229910052799 carbon Inorganic materials 0.000 claims 2
- 150000002118 epoxides Chemical group 0.000 claims 2
- 229920003986 novolac Polymers 0.000 claims 2
- 125000004430 oxygen atom Chemical group O* 0.000 claims 2
- SQZCAOHYQSOZCE-UHFFFAOYSA-N 1-(diaminomethylidene)-2-(2-methylphenyl)guanidine Chemical compound CC1=CC=CC=C1N=C(N)N=C(N)N SQZCAOHYQSOZCE-UHFFFAOYSA-N 0.000 claims 1
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical group C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 claims 1
- KPSKFRBAZLLZTP-UHFFFAOYSA-N 6-methyl-4-oxatricyclo[5.2.1.02,6]dec-1-ene-3,5-dione Chemical compound C1C2CCC1=C1C2(C)C(=O)OC1=O KPSKFRBAZLLZTP-UHFFFAOYSA-N 0.000 claims 1
- 239000004593 Epoxy Substances 0.000 claims 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 claims 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 claims 1
- ROXSUKUCXOVPOB-UHFFFAOYSA-N ethene;toluene Chemical compound C=C.C=C.CC1=CC=CC=C1 ROXSUKUCXOVPOB-UHFFFAOYSA-N 0.000 claims 1
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 claims 1
- 229920001568 phenolic resin Polymers 0.000 claims 1
- 150000002989 phenols Chemical class 0.000 claims 1
- 230000003014 reinforcing effect Effects 0.000 claims 1
- RSPCKAHMRANGJZ-UHFFFAOYSA-N thiohydroxylamine Chemical compound SN RSPCKAHMRANGJZ-UHFFFAOYSA-N 0.000 claims 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
- C07D303/02—Compounds containing oxirane rings
- C07D303/12—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms
- C07D303/18—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms by etherified hydroxyl radicals
- C07D303/20—Ethers with hydroxy compounds containing no oxirane rings
- C07D303/24—Ethers with hydroxy compounds containing no oxirane rings with polyhydroxy compounds
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C37/00—Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom of a six-membered aromatic ring
- C07C37/62—Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom of a six-membered aromatic ring by introduction of halogen; by substitution of halogen atoms by other halogen atoms
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
- C08G59/066—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3218—Carbocyclic compounds
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
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- Chemical Kinetics & Catalysis (AREA)
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- Polymers & Plastics (AREA)
- Epoxy Resins (AREA)
- Polyesters Or Polycarbonates (AREA)
- Polyethers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Organic Insulating Materials (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
Claims (10)
- (Ⅰ) 5 내지 95 중량%의 적어도 하나의 하기 일반식(Ⅰ) 또는 (Ⅱ)의 할로겐화된 방향족 에폭시 수지 : 및 (Ⅱ) 95 내지 5 중량%의 적어도 하나의 하기 일반식(Ⅲ),(Ⅳ)(Ⅴ)(Ⅵ)(Ⅶ)(Ⅷ)(Ⅸ) 또는 (Ⅹ)의 방향족 에폭시 수시로 이루어진 할로겐 함유 에폭시 수지 조성물.상기식에서, A는 각기 독립적으로 탄소수 1내지 12의 2가 하이드로카빌 그룹, -S-, -S-S-, 또는 -0-이고 ; A'는 각기 독립적으로 탄소수 1 내지 12의 2가 하이드로카빌 그룹이며; A"는 각기 독립적으로 탄소수 1내지 4의 2가 하이드로카빌 그룹이고 ; R은 각기 독립적으로 수소 또는 탄소수 1 내지 4의 알킬 그룹이며 ; R'는 각기 독립적으로 수소, 탄소수 1내지 10의 하이드로카빌 또는 하이드로카빌옥시 그룹 또는 할로겐 원자이고; a는 0또는 1이며; R"는 독립적으로 수소, 탄소수 1내지 10의 하이드로카빌 또는 하이드로카빌옥시 그룹, 할로겐 원자 또는 글리시딜 에테르 그룹이고; X는 각기 독립적으로 수소 또는 할로겐 원자이며, 각각의 방향족환에 대하여 평균 적어도 0.5의 X그룹이 할로겐 원자이고;B는 각기 독립적으로 일반식을 나타내고;B'는 각기 독립적으로 일반식을 나타내며;B"는 각기 독립적으로 일반식을 나타내고; Q는 각기 독립적으로 수소 또는 탄소수 1내지 10의 하이드로카빌 그룹이며; C는 0 내지 10, 바람직하게는 1내지 5이고; m은 n-1며; m'는 n'-1 이고 ;m"는 n"-1이며 ;n,n' 및 n"는 각기 독립적으로 0내지 3이고 : g는 0내지 4이며; Y는 각기 독립적으로 1내지 5의 평균값을 가지고; Y'는 0내지 3ㅢ 평균값을 가지며; Z및 Z'는 각기독립적으로 0내지 3이며, 단, 상기식 (Ⅲ)내지 (Ⅹ)에서, 할로겐원자는 글리시딜 에테르 그룹에 대해 메타위치에 존재하지 않는다.
- 제1항에 있어서, 성분(Ⅰ)이 2,2,',6,6,' -테트라브로모-3,3,', 5,5,',-테트라메틸-4,4'-비레놀; 2,2',6-트리브로모-3,3,3', 5,5,'-테트라메틸-4,4'-비페놀;1,2-비스-(2,6-디브로모-3,5-디메틸-4-하이드록시페닐)에탄 : 비스-(2,6-디브로모-3,5-디메틸-4-하이드록시페닐)메탄의 디글리시딜 에테르 ; 또는 이들의 혼합물인 할롤겐 함유 에폭시 수지 조성물.
- (A)하기 일반식(Ⅰ),(Ⅱ),(Ⅲ),(Ⅳ)(Ⅴ)(Ⅵ)(Ⅶ)(Ⅷ)(Ⅸ) 또는 (Ⅹ)의 적어도 하나의 엑폭시 수지 ; 및 (B)하기 일반식(ⅩⅠ),(ⅩⅡ),(ⅩⅢ),(ⅩⅣ)(ⅩⅤ)(ⅩⅥ) 또는 (ⅩⅧ)의 적어도 하나의 다가의 페놀성 화합물을 반응시킴으로써 생성되고; (i) 성분(A) 및 (B)중 적어도 하나는 각각의 두 방향족호나에 대하여 환에 결합되어 있는 산소 원자에 대해 메타위치에 존재하는 적어도 하나는 각각의 두 방향족환에 대하여 환에 결합되어 있는 산소 원자에 대해 메타위치에 존재하는 적어도 하나의 할로겐원자를 함유하며; (ii)성분 (A)의 평균 에폭시드 작용도가 2이하이고, 성분 (B)의 평균 하이드록실 작용도가 2이하인 경우에 , 성분(A) 및 (B)는 에폭시드에 대한 하이드록실의 비가 0.1:1내지 0.9:1 이 되는 양으로 존재하며; (iv) 성분(A) 및 (B)가 모두 평균 2이상의 작용도를 가질 경우에, 성분 (A) 및 (B)는 에폭시드에 대한 하이드록실비가 0.01:1내지 0.3:1이 되는 양으로 존재하는 할로겐-함유 개선된 에폭시수지.상기식에서, A는 각기 독립적으로 탄소수 1내지 12의 2가 하이드로카빌 그룹, 또는 -0-이고; A'는 각기 독립적으로 탄소수 1내지 12의 2가 하이드로카빌 그룹이며; A"는 각기 독립적으로 탄소수 1내지 4의 2가 하이드로카빌 그룹이고;B는 각기 독립적으로 일반식을 나타내며;B'는 각기 독립적으로 일반식을 나타내고;B"는 각기 독립적으로 일반식을 나타내며;Q는 각기 독립적으로 수소 또는 탄소수 1내지 10의 하이드로카빌 그룹이며; R은 각기 독립적으로 수소 또는 탄소수 1내지 4의 알킬 그룹이고; R'는각기 독립적으로 수소, 탄소수 1내지 10의 하이드로카빌 또는 하이드로카빌옥시 그룹 또는 할로겐 원자이며; a는 0 또는 1이고 ; R"는 독립적으로 수소, 탄소수 1내지 10의 하이드로카빌 또는 하이드로카빌옥시 그룹, 할로겐원자 또는 글리시딜 에테르 그룹이며; Y는 각기 독립적으로 수소, 탄소수 1내지 10의 하이드로카빌 또는 하이드로카빌옥시 그룹, 할로겐원자 또는 하이드록실 그룹이고 ; C,C',C"는 각기 독립적으로 0 내지 10이며; m은 n-1이고 ; m'는 n'-1이며 ; m"는 n"-1이이고 ; n,n' 및 n"는 각기 독립적으로 0내지 3이며; q는 0내지 4이고; y는 각기 독립적으로 1내지 5의 평균값을 가지며; Y'는 0내지 3의 평균값을 가지고; Z 및 Z'는 각기 독립적으로 0내지 3이다.
- 제3항에 있어서, 성분(A)가 2,2', 6,6,'-테트라브로모-3,3,',, 5.5'-테트라메틸-4,4'-비페놀;2,2',6-트리브로모-3,3',5,5'-테트라메틸-4,4'-비페놀; 1,2-비스-(2,6-디브로모-3,5-디메틸-4-하이드록시페닐)-에탄; 비스-(2,6-디브로모-3,5-디메틸-4-하이드록시페닐)메탄의 디글리시딜 에테르; 또는 그의 혼합물인 할로겐-함유 개선된 에폭시 수지.
- 제3항에 있어서, 성분(B)가 2,2', 6,6'-테트라브로모-3,3,', 5,5'-테트라메틸-4,4'-비페놀; 2,2',6-트리브로모-3,3', 5,5'-테트라메틸-4,4,'-비페놀 :1,2-비스-(2,6-디브로모-3.5-디메틸-4 하이드록시페닐)에탄:비스-(2,6-디브로모-3,5-디메틸-4-하이드록시페닐)-메탄; 또는 그의 혼합물인 할로겐-함유 개선된 에폭시 수지.
- 적어도 하나의 제1 또는 2항의 할로겐-함유 에폭시 수지 및 이를 위한 경화량의 적어도 하나의 적절한 경화제를 함유함을 특징으로 하는 강화 조성물.
- 적어도 하나의 제3,4또는 5항의 할로겐-함유 에폭시 수지 및 이를 위한 경화량의 적어도 하나의 적절한 경화제를 함유함을 특징으로 하는 경화 조성물.
- 제6또는 7항에 있어서, 경화제가 메틸렌디아닐린, 디시안디아미드, 디아미노디페닐메탄, 설파닐아미드, O-톨릴비구아니드, 디에틸렌 톨루엔 디아민, 페놀-포름알데히드 노볼락 수지, 크레졸-포름알데히드 노볼락수지, 메틸비사이클로[2,2,1]헵텐-2,3-디카복실산 무수물, 에틸렌 디아민 또는 그의 혼합물인 경화 조성물.
- 제6또는 7항의 조성물을 경화시키깅 충분한 조건하에서 처리함으로써 생성된 생성물.
- 제9항에 있어서, 전기 적층물 또는 캡슐화된 전기 성분인 생성물.※참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019920701123A KR920010140B1 (ko) | 1986-09-15 | 1987-09-10 | 할로겐-함유 에폭시 수지 조성물, 이를 함유하는 경화 조성물, 및 이로부터 수득된 경화 생성물 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/907,706 US4727119A (en) | 1986-09-15 | 1986-09-15 | Halogenated epoxy resins |
US907,706 | 1986-09-15 | ||
US907706 | 1986-09-15 | ||
PCT/US1987/002328 WO1988002012A1 (en) | 1986-09-15 | 1987-09-10 | Halogenated epoxy resins and advanced resins prepared therefrom |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019920701123A Division KR920010140B1 (ko) | 1986-09-15 | 1987-09-10 | 할로겐-함유 에폭시 수지 조성물, 이를 함유하는 경화 조성물, 및 이로부터 수득된 경화 생성물 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR880701749A true KR880701749A (ko) | 1988-11-05 |
KR920007658B1 KR920007658B1 (ko) | 1992-09-14 |
Family
ID=25424516
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019880700532A KR920007658B1 (ko) | 1986-09-15 | 1987-09-10 | 할로겐-함유 개선된 에폭시 수지, 이를 함유하는 경화 조성물 및 이로부터 수득된 경화 생성물 |
KR1019920701123A KR920010140B1 (ko) | 1986-09-15 | 1987-09-10 | 할로겐-함유 에폭시 수지 조성물, 이를 함유하는 경화 조성물, 및 이로부터 수득된 경화 생성물 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019920701123A KR920010140B1 (ko) | 1986-09-15 | 1987-09-10 | 할로겐-함유 에폭시 수지 조성물, 이를 함유하는 경화 조성물, 및 이로부터 수득된 경화 생성물 |
Country Status (12)
Country | Link |
---|---|
US (1) | US4727119A (ko) |
EP (1) | EP0260571B1 (ko) |
JP (2) | JPH0617449B2 (ko) |
KR (2) | KR920007658B1 (ko) |
AT (1) | ATE91134T1 (ko) |
AU (1) | AU595394B2 (ko) |
BR (1) | BR8707814A (ko) |
CA (2) | CA1323462C (ko) |
DE (1) | DE3786380T2 (ko) |
IL (1) | IL83891A (ko) |
MY (1) | MY102118A (ko) |
WO (1) | WO1988002012A1 (ko) |
Families Citing this family (16)
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JPH0735492B2 (ja) * | 1986-09-26 | 1995-04-19 | 三井石油化学工業株式会社 | 熱水用管内面塗料組成物 |
IL88389A (en) * | 1987-11-30 | 1992-02-16 | Dow Chemical Co | Curable compositions and electrical or electronic components or devices encapsulated therewith |
US5001174A (en) * | 1988-12-08 | 1991-03-19 | Sumitomo Bakelite Company Limited | Epoxy resin composition for semiconductor sealing employing triphenylmethane based novolac epoxy resin |
US4892925A (en) * | 1989-01-23 | 1990-01-09 | The Dow Chemical Company | Process for preparing phenolic hydroxyl-containing compounds from 2,6-dibromo-3,5-dialkyl-4-hydroxybenzyl ethers |
US5443911A (en) * | 1990-05-21 | 1995-08-22 | Gurit-Essex Ag | Curable resins comprising halogenated epoxy resins and 1-oxa-3-aza tetraline compounds, method for preparing and use of resins |
JP3308397B2 (ja) * | 1994-07-07 | 2002-07-29 | 住友ベークライト株式会社 | 半導体封止用エポキシ樹脂組成物 |
WO1997011105A1 (en) * | 1995-09-13 | 1997-03-27 | Akzo Nobel N.V. | Epoxy resin composition for electrolaminates having aryl substituted guanidine and/or biguanide as cross-linking agent |
EP1298063B1 (en) | 1997-02-20 | 2005-06-08 | Elopak Systems Ag | Apparatus and method of securing pour spout fitments to containers |
US7623487B2 (en) * | 2006-05-24 | 2009-11-24 | Nortel Networks Limited | OFDM system and method for supporting a wide range of mobility speeds |
US7919567B2 (en) * | 2006-06-07 | 2011-04-05 | Dow Global Technologies Llc | Oligomeric halogenated chain extenders for preparing epoxy resins |
US20080039595A1 (en) * | 2006-06-07 | 2008-02-14 | Joseph Gan | Oligomeric halogenated chain extenders for preparing epoxy resins |
JP5443993B2 (ja) * | 2007-11-08 | 2014-03-19 | 新日鉄住金化学株式会社 | エポキシ樹脂、その製造方法、エポキシ樹脂組成物及び硬化物 |
JP2015010885A (ja) * | 2013-06-27 | 2015-01-19 | 幸生 隅田 | セシウムの放射能の減少方法 |
IN2013MU02455A (ko) * | 2013-07-24 | 2015-06-26 | Reliance Ind Ltd | |
AU2013399661A1 (en) * | 2013-09-04 | 2016-02-04 | Halliburton Energy Services, Inc. | Heavy-atom resin formulation for use in subterranean wells |
CN113056459A (zh) * | 2018-12-13 | 2021-06-29 | 捷恩智株式会社 | 环氧化合物 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3058946A (en) * | 1958-08-05 | 1962-10-16 | Michigan Chem Corp | Plastic product comprising cured mixture of a brominated polyepoxide and a non-halogenated polyepoxide |
US3004951A (en) * | 1958-09-26 | 1961-10-17 | Monsanto Chemicals | Diglycidyl ether of dihydroxypoly-chlorobiphenyls and epoxy resins therefrom |
NL283388A (ko) * | 1961-10-03 | |||
US3989531A (en) * | 1971-08-05 | 1976-11-02 | General Electric Company | Fire-retardant polymeric compositions containing brominated biphenols |
US3929908A (en) * | 1971-08-05 | 1975-12-30 | Gen Electric | Brominated biphenols |
US3956403A (en) * | 1971-08-05 | 1976-05-11 | General Electric Company | Brominated biphenols |
US3748303A (en) * | 1972-01-28 | 1973-07-24 | Gen Electric | Halogenated biphenol polyesters and polycarbonates |
US3974235A (en) * | 1973-10-01 | 1976-08-10 | General Electric Company | Blends of a polyphenylene ether resin, alkenyl aromatic resins modified with EPDM rubber and flame retardant |
US4170711A (en) * | 1974-03-12 | 1979-10-09 | General Electric Company | Brominated biphenol derivatives |
CA1073471A (en) * | 1974-12-18 | 1980-03-11 | Philip L. Kinson | Brominated biphenol process |
US4104257A (en) * | 1977-07-27 | 1978-08-01 | The Dow Chemical Company | Process for preparing high molecular weight polyether resins from bisphenols and epoxy resins |
JPS61123618A (ja) * | 1984-11-20 | 1986-06-11 | Sanyo Kokusaku Pulp Co Ltd | 新規エポキシ樹脂およびその製造法 |
JPS61171728A (ja) * | 1985-01-24 | 1986-08-02 | Sanyo Kokusaku Pulp Co Ltd | 新規臭素含有エポキシ樹脂およびその製法 |
US4647648A (en) * | 1985-08-26 | 1987-03-03 | The Dow Chemical Company | Polyhydroxyethers from hydroxybiphenyls |
US4661644A (en) * | 1985-09-09 | 1987-04-28 | The Dow Chemical Company | Brominated epoxyaromatic compounds |
US4722965A (en) * | 1986-02-24 | 1988-02-02 | Reichhold Chemicals, Inc. | Chalk adhesion polymer composition and method of preparation |
CA1272345A (en) * | 1986-02-24 | 1990-07-31 | The Dow Chemical Company | Curable compositions containing a polyepoxide and a halogenated bisphenol |
WO1988000600A1 (en) * | 1986-07-18 | 1988-01-28 | The Dow Chemical Company | Cationic, advanced epoxy resin compositions |
-
1986
- 1986-09-15 US US06/907,706 patent/US4727119A/en not_active Expired - Fee Related
-
1987
- 1987-09-08 EP EP87113067A patent/EP0260571B1/en not_active Expired - Lifetime
- 1987-09-08 DE DE87113067T patent/DE3786380T2/de not_active Expired - Fee Related
- 1987-09-08 AT AT87113067T patent/ATE91134T1/de not_active IP Right Cessation
- 1987-09-09 CA CA000546396A patent/CA1323462C/en not_active Expired - Fee Related
- 1987-09-10 AU AU80255/87A patent/AU595394B2/en not_active Ceased
- 1987-09-10 KR KR1019880700532A patent/KR920007658B1/ko not_active IP Right Cessation
- 1987-09-10 WO PCT/US1987/002328 patent/WO1988002012A1/en unknown
- 1987-09-10 KR KR1019920701123A patent/KR920010140B1/ko not_active IP Right Cessation
- 1987-09-10 JP JP62505894A patent/JPH0617449B2/ja not_active Expired - Lifetime
- 1987-09-10 BR BR8707814A patent/BR8707814A/pt unknown
- 1987-09-14 IL IL83891A patent/IL83891A/xx not_active IP Right Cessation
- 1987-10-01 MY MYPI87002692A patent/MY102118A/en unknown
-
1993
- 1993-04-28 CA CA000616652A patent/CA1335402C/en not_active Expired - Fee Related
- 1993-09-16 JP JP5229898A patent/JPH0811767B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0260571A2 (en) | 1988-03-23 |
EP0260571B1 (en) | 1993-06-30 |
JPH0811767B2 (ja) | 1996-02-07 |
KR920010140B1 (ko) | 1992-11-16 |
EP0260571A3 (en) | 1988-08-24 |
JPH06256469A (ja) | 1994-09-13 |
MY102118A (en) | 1992-03-31 |
ATE91134T1 (de) | 1993-07-15 |
US4727119A (en) | 1988-02-23 |
DE3786380T2 (de) | 1994-01-05 |
JPH01501800A (ja) | 1989-06-22 |
DE3786380D1 (de) | 1993-08-05 |
CA1323462C (en) | 1993-10-19 |
AU8025587A (en) | 1988-04-07 |
BR8707814A (pt) | 1989-08-15 |
AU595394B2 (en) | 1990-03-29 |
IL83891A (en) | 1991-07-18 |
KR920007658B1 (ko) | 1992-09-14 |
JPH0617449B2 (ja) | 1994-03-09 |
WO1988002012A1 (en) | 1988-03-24 |
CA1335402C (en) | 1995-04-25 |
IL83891A0 (en) | 1988-02-29 |
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