KR880011300A - 에폭시 접착제 필름 - Google Patents
에폭시 접착제 필름 Download PDFInfo
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- KR880011300A KR880011300A KR1019880002517A KR880002517A KR880011300A KR 880011300 A KR880011300 A KR 880011300A KR 1019880002517 A KR1019880002517 A KR 1019880002517A KR 880002517 A KR880002517 A KR 880002517A KR 880011300 A KR880011300 A KR 880011300A
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- Prior art keywords
- adhesive composition
- formula
- epoxy
- present
- fluorene
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- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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- C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
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Abstract
내용없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
Claims (12)
- 하기식 (Ⅰ) 페녹시수지, 하기식(Ⅳ) 플루오렌 약제 혼합물과 하기식(Ⅱ,Ⅲ)의 YE, Z 또는 적어도 이들 혼합물을 포함하는 하나의 에폭시 수지와의 반응생성물을 포함하는 다이-어태치 접착제로 사용되는 접착제 조성물.R3, R5는 -H, -CH3, R4는 -NH2, 또는 -NHCH3이며, 상기식(Ⅰ)에서 n=50 내지 150, X=단일결합, -CH2또는 -C(CH3)2이다.상기식(Ⅱ)에서 X는 단일결합, -CH2또는 -C(CH3)2-,은 -H, CH3, 에폭시기인에서 선택된 것으로서 R6-R11중 적어도 두 개는 에폭시기이며, 상기식(Ⅲ) R12-R17은 -H, -CH3, 에폭시기인에서 선택된 것이며, k은 0 또는 1, m은 0-9이며 단 k=0 일때를 제외하고는 적어도 하나의 에폭시기는 각 아릴기상에 존재하는데 여기서 R12-R13은 모두 에폭시기이다.
- 제1항에 있어서, R7및 R10은인 것을 특징으로 하는 접착제 조성물.
- 제1항에 있어서, 상기 페녹시 수지, 상기 플로오렌약제, 상기 적어도 하나의 에폭시수지 사이의 반응속도를 증가시킬수 있는 촉매를 포함하는 것을 특징으로 하는 접착제 조성물.
- 제1항에 있어서, 충진제 물질을 포함하는 것을 특징으로 하는 접착제 조성물.
- 제4항에 있어서, 상기 충진제 물질은 기능적으로 반응성인 실란을 포함하며 이물질은 약 10-70부피%의 범위로 존재하는 것을 특징으로 하는 접착제 조성물.
- 제5항에 있어서, 상기 기능적으로 반응성인 실란은 아민 또는 에폭시 기능을 갖는 것을 특징으로 하는 접착제 조성물.
- 제2항에 있어서, 사익 페녹시 수지는 약 10-80중량%의 범위로 존재하는 것을 특징으로 하는 접착제 조성물.
- 제7항에 있어서, 상기 플루오렌 약제는 약 5-50중량%의 범위로 존재하는 것을 특징으로 하는 접착제 조성물.
- 제7항에 있어서, 약 70중량% 이하의 YE, 약 50중량% 이하의 Z를 함유하며 적어도 5 중량%의 YE, 또는 Z가 존재하는 것을 특징으로 하는 접착제 조성물.
- 제1항에 있어서, k는 1, m은 1,2 또는 3인 것을 특징으로 하는 접착제 조성물.
- 제1항에 있어서, R7및 R10은 에폭시 기능기, R6, R8, R9및 R11은 -H 및 -CH3로부터 선택된 것을 특징으로 하는 접착제 조성물.
- 제1항에 있어서, 조성물은 자체지지성 필름인 것을 특징으로 하는 접착제 조성물.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/025,009 US4769399A (en) | 1987-03-12 | 1987-03-12 | Epoxy adhesive film for electronic applications |
US025009 | 1993-03-15 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR880011300A true KR880011300A (ko) | 1988-10-27 |
KR960008488B1 KR960008488B1 (en) | 1996-06-26 |
Family
ID=21823551
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR88002517A KR960008488B1 (en) | 1987-03-12 | 1988-03-11 | Epoxy adhesive film |
Country Status (9)
Country | Link |
---|---|
US (1) | US4769399A (ko) |
EP (1) | EP0283134B1 (ko) |
JP (1) | JP2647120B2 (ko) |
KR (1) | KR960008488B1 (ko) |
CA (1) | CA1298008C (ko) |
DE (1) | DE3872552T2 (ko) |
HK (1) | HK70993A (ko) |
MY (1) | MY102739A (ko) |
SG (1) | SG49093G (ko) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4931598A (en) * | 1988-12-30 | 1990-06-05 | 3M Company | Electrical connector tape |
US4990667A (en) * | 1990-01-29 | 1991-02-05 | Air Products And Chemicals, Inc. | Alkylated 1,1-bis(4-aminophenyl)-1-phenyl-2,2,2-trifluoroethanes |
US5055616A (en) * | 1990-01-29 | 1991-10-08 | Air Products And Chemicals, Inc. | Ortho-alkylated bisanilines having fluorenylidene bridging groups |
EP0454005B1 (en) * | 1990-04-26 | 1994-12-07 | E.I. Du Pont De Nemours And Company | Die attach adhesive composition |
KR930701561A (ko) * | 1990-06-08 | 1993-06-12 | 게리 엘. 그리스울드 | 전자 용품용 재처리가능한 접착제 |
JPH0819213B2 (ja) * | 1990-07-09 | 1996-02-28 | 三菱電機株式会社 | エポキシ樹脂組成物および銅張積層板 |
US5143785A (en) * | 1990-08-20 | 1992-09-01 | Minnesota Mining And Manufacturing Company | Cyanate ester adhesives for electronic applications |
US5087494A (en) * | 1991-04-12 | 1992-02-11 | Minnesota Mining And Manufacturing Company | Electrically conductive adhesive tape |
US5275856A (en) * | 1991-11-12 | 1994-01-04 | Minnesota Mining And Manufacturing Company | Electrically conductive adhesive web |
US5369192A (en) * | 1993-06-28 | 1994-11-29 | Minnesota Mining And Manufacturing Company | Binder resin for resin transfer molding preforms |
SG59997A1 (en) * | 1995-06-07 | 1999-02-22 | Ibm | Apparatus and process for improved die adhesion to organic chip carries |
US5576074A (en) * | 1995-08-23 | 1996-11-19 | Minnesota Mining And Manufacturing Company | Laser write process for making a conductive metal circuit |
US5728755A (en) * | 1995-09-22 | 1998-03-17 | Minnesota Mining And Manufacturing Company | Curable epoxy resin compositions with 9,9'-bis(4-aminophenyl)fluorenes as curatives |
US5756380A (en) * | 1995-11-02 | 1998-05-26 | Motorola, Inc. | Method for making a moisture resistant semiconductor device having an organic substrate |
US5976699A (en) * | 1995-11-09 | 1999-11-02 | Sumitomo Bakelite Company Limited | Insulating adhesive for multilayer printed circuit board |
JP3178417B2 (ja) * | 1998-06-10 | 2001-06-18 | 日本電気株式会社 | 半導体キャリアおよびその製造方法 |
KR100339183B1 (ko) | 1998-07-13 | 2002-05-31 | 포만 제프리 엘 | 접착제 번짐이 감소된 다이 부착법 |
US6938783B2 (en) | 2000-07-26 | 2005-09-06 | Amerasia International Technology, Inc. | Carrier tape |
JP3911154B2 (ja) | 2001-03-16 | 2007-05-09 | 日本碍子株式会社 | 接着体及びその製造方法 |
JP2007305994A (ja) * | 2007-05-07 | 2007-11-22 | Hitachi Chem Co Ltd | 回路用接続部材及び回路板 |
JP2011082559A (ja) * | 2010-12-24 | 2011-04-21 | Hitachi Chem Co Ltd | 半導体用接着フィルム |
WO2013145498A1 (ja) * | 2012-03-29 | 2013-10-03 | 株式会社村田製作所 | 導電性ペーストおよびそれを用いた固体電解コンデンサ |
US9056438B2 (en) | 2012-05-02 | 2015-06-16 | 3M Innovative Properties Company | Curable composition, articles comprising the curable composition, and method of making the same |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3873637A (en) * | 1973-02-23 | 1975-03-25 | Sony Corp | Adhesive composition containing phenoxy and epoxy resins and a cross-linking agent therefor |
US3888942A (en) * | 1973-12-13 | 1975-06-10 | Gen Electric | Resinous compositions and laminates made therefrom |
JPS612725A (ja) * | 1984-06-15 | 1986-01-08 | Mitsubishi Electric Corp | 熱硬化性樹脂組成物 |
US4644023A (en) * | 1985-05-09 | 1987-02-17 | General Motors Corporation | Heat curable epoxy adhesive composition |
CA1264476A (en) * | 1985-05-30 | 1990-01-16 | William J. Schultz | Epoxy resin curing agent, process, and composition |
EP0264705A3 (en) * | 1986-10-10 | 1990-10-31 | The Dow Chemical Company | Blends of relatively low molecular weight epoxy resins and relatively high molecular weight epoxy or phenoxy resins and cured products therefrom |
-
1987
- 1987-03-12 US US07/025,009 patent/US4769399A/en not_active Expired - Lifetime
-
1988
- 1988-02-02 CA CA000557992A patent/CA1298008C/en not_active Expired - Fee Related
- 1988-02-17 DE DE8888301326T patent/DE3872552T2/de not_active Expired - Fee Related
- 1988-02-17 EP EP88301326A patent/EP0283134B1/en not_active Expired - Lifetime
- 1988-02-25 MY MYPI88000190A patent/MY102739A/en unknown
- 1988-03-11 KR KR88002517A patent/KR960008488B1/ko not_active IP Right Cessation
- 1988-03-11 JP JP63058125A patent/JP2647120B2/ja not_active Expired - Lifetime
-
1993
- 1993-04-17 SG SG49093A patent/SG49093G/en unknown
- 1993-07-22 HK HK709/93A patent/HK70993A/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0283134B1 (en) | 1992-07-08 |
EP0283134A3 (en) | 1989-10-25 |
HK70993A (en) | 1993-07-30 |
EP0283134A2 (en) | 1988-09-21 |
DE3872552D1 (de) | 1992-08-13 |
MY102739A (en) | 1992-09-30 |
CA1298008C (en) | 1992-03-24 |
JPS63243185A (ja) | 1988-10-11 |
US4769399A (en) | 1988-09-06 |
JP2647120B2 (ja) | 1997-08-27 |
DE3872552T2 (de) | 1993-01-21 |
SG49093G (en) | 1993-07-09 |
KR960008488B1 (en) | 1996-06-26 |
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