HK70993A - Epoxy adhesive film for electronic applications - Google Patents

Epoxy adhesive film for electronic applications

Info

Publication number
HK70993A
HK70993A HK709/93A HK70993A HK70993A HK 70993 A HK70993 A HK 70993A HK 709/93 A HK709/93 A HK 709/93A HK 70993 A HK70993 A HK 70993A HK 70993 A HK70993 A HK 70993A
Authority
HK
Hong Kong
Prior art keywords
adhesive film
epoxy adhesive
electronic applications
adhesive composition
adhesive
Prior art date
Application number
HK709/93A
Other languages
English (en)
Inventor
James Schenz
Original Assignee
Minnesota Mining & Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining & Mfg filed Critical Minnesota Mining & Mfg
Publication of HK70993A publication Critical patent/HK70993A/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C09J171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C09J171/12—Polyphenylene oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5033—Amines aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • H—ELECTRICITY
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    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
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    • Y10S525/00—Synthetic resins or natural rubbers -- part of the class 520 series
    • Y10S525/93—Reaction product of a polyhydric phenol and epichlorohydrin or diepoxide, having a molecular weight of over 5,000, e.g. phenoxy resins

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
HK709/93A 1987-03-12 1993-07-22 Epoxy adhesive film for electronic applications HK70993A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/025,009 US4769399A (en) 1987-03-12 1987-03-12 Epoxy adhesive film for electronic applications

Publications (1)

Publication Number Publication Date
HK70993A true HK70993A (en) 1993-07-30

Family

ID=21823551

Family Applications (1)

Application Number Title Priority Date Filing Date
HK709/93A HK70993A (en) 1987-03-12 1993-07-22 Epoxy adhesive film for electronic applications

Country Status (9)

Country Link
US (1) US4769399A (xx)
EP (1) EP0283134B1 (xx)
JP (1) JP2647120B2 (xx)
KR (1) KR960008488B1 (xx)
CA (1) CA1298008C (xx)
DE (1) DE3872552T2 (xx)
HK (1) HK70993A (xx)
MY (1) MY102739A (xx)
SG (1) SG49093G (xx)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4931598A (en) * 1988-12-30 1990-06-05 3M Company Electrical connector tape
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US5055616A (en) * 1990-01-29 1991-10-08 Air Products And Chemicals, Inc. Ortho-alkylated bisanilines having fluorenylidene bridging groups
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Also Published As

Publication number Publication date
EP0283134B1 (en) 1992-07-08
EP0283134A3 (en) 1989-10-25
KR880011300A (ko) 1988-10-27
EP0283134A2 (en) 1988-09-21
DE3872552D1 (de) 1992-08-13
MY102739A (en) 1992-09-30
CA1298008C (en) 1992-03-24
JPS63243185A (ja) 1988-10-11
US4769399A (en) 1988-09-06
JP2647120B2 (ja) 1997-08-27
DE3872552T2 (de) 1993-01-21
SG49093G (en) 1993-07-09
KR960008488B1 (en) 1996-06-26

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