GB2055109B - Heat-curable epoxy resin adhesives - Google Patents

Heat-curable epoxy resin adhesives

Info

Publication number
GB2055109B
GB2055109B GB8021655A GB8021655A GB2055109B GB 2055109 B GB2055109 B GB 2055109B GB 8021655 A GB8021655 A GB 8021655A GB 8021655 A GB8021655 A GB 8021655A GB 2055109 B GB2055109 B GB 2055109B
Authority
GB
United Kingdom
Prior art keywords
heat
epoxy resin
curable epoxy
resin adhesives
adhesives
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB8021655A
Other versions
GB2055109A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Evonik Operations GmbH
Original Assignee
TH Goldschmidt AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TH Goldschmidt AG filed Critical TH Goldschmidt AG
Publication of GB2055109A publication Critical patent/GB2055109A/en
Application granted granted Critical
Publication of GB2055109B publication Critical patent/GB2055109B/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/04—Epoxynovolacs

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
GB8021655A 1979-07-04 1980-07-02 Heat-curable epoxy resin adhesives Expired GB2055109B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2926945A DE2926945C3 (en) 1979-07-04 1979-07-04 Thermosetting adhesives

Publications (2)

Publication Number Publication Date
GB2055109A GB2055109A (en) 1981-02-25
GB2055109B true GB2055109B (en) 1983-08-10

Family

ID=6074854

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8021655A Expired GB2055109B (en) 1979-07-04 1980-07-02 Heat-curable epoxy resin adhesives

Country Status (4)

Country Link
DE (1) DE2926945C3 (en)
FR (1) FR2460985A1 (en)
GB (1) GB2055109B (en)
IT (1) IT1143160B (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4517340A (en) * 1982-08-25 1985-05-14 Raychem Corporation Adhesive composition
JPS6079081A (en) * 1983-10-07 1985-05-04 Sunstar Giken Kk Two-pack adhesive
US4855358A (en) * 1984-12-14 1989-08-08 Morton Thiokol, Inc. Powder coating containing an epoxy resin, acrylic resin and polyamide
US4892901A (en) 1987-12-31 1990-01-09 General Electric Company Polyetherimide ester elastomer
DE3938376A1 (en) * 1989-11-18 1991-05-23 Beiersdorf Ag Heat-cured powder adhesive for high-strength composites - has homogeneous mixt. of solid and liq. epoxy] resins, PVAC plastomer, hardener and/or fillers
FR2674861B1 (en) * 1991-04-04 1994-06-03 Rhone Poulenc Chimie THERMOSETTING MOLDING COMPOSITIONS OBTAINED FROM A POLY (IMIDE-AMIDE) REACTIVE THERMOPLASTIC OLIGOMER AND A CO-REACTIVE BASED ON A PHENOLIC POLYCONDENSATE.
JP4600640B2 (en) * 2003-11-10 2010-12-15 信越化学工業株式会社 Acrylic adhesive sheet
US10253211B2 (en) * 2011-05-12 2019-04-09 Elantas Pdg, Inc. Composite insulating film

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1184013A (en) * 1968-03-18 1970-03-11 Wolf Ltd Victor Polyamide-Imide Compositions
FR1601964A (en) * 1968-12-31 1970-09-21 Polyimides for adhesive compositions
US3663651A (en) * 1970-09-03 1972-05-16 Rogers Corp Thermal-resistant polyimide-epoxy polymers
JPS5015488A (en) * 1973-06-07 1975-02-18

Also Published As

Publication number Publication date
GB2055109A (en) 1981-02-25
IT8048650A0 (en) 1980-05-12
IT1143160B (en) 1986-10-22
DE2926945A1 (en) 1981-02-05
DE2926945B2 (en) 1981-06-19
FR2460985B1 (en) 1982-12-17
DE2926945C3 (en) 1982-04-01
FR2460985A1 (en) 1981-01-30

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee