KR850002582A - 경화성 에폭시 수지 조성물 - Google Patents
경화성 에폭시 수지 조성물 Download PDFInfo
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- KR850002582A KR850002582A KR1019840004552A KR840004552A KR850002582A KR 850002582 A KR850002582 A KR 850002582A KR 1019840004552 A KR1019840004552 A KR 1019840004552A KR 840004552 A KR840004552 A KR 840004552A KR 850002582 A KR850002582 A KR 850002582A
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- 239000000203 mixture Substances 0.000 title claims 9
- 239000003822 epoxy resin Substances 0.000 title claims 8
- 229920000647 polyepoxide Polymers 0.000 title claims 8
- 239000000835 fiber Substances 0.000 claims description 13
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000000805 composite resin Substances 0.000 claims 13
- 239000003795 chemical substances by application Substances 0.000 claims 9
- 150000001412 amines Chemical class 0.000 claims 7
- 229920001187 thermosetting polymer Polymers 0.000 claims 7
- 239000004593 Epoxy Substances 0.000 claims 5
- 150000002430 hydrocarbons Chemical class 0.000 claims 5
- 230000003014 reinforcing effect Effects 0.000 claims 5
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 claims 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims 4
- 239000007795 chemical reaction product Substances 0.000 claims 4
- 150000001875 compounds Chemical class 0.000 claims 4
- 230000002787 reinforcement Effects 0.000 claims 4
- KZNICNPSHKQLFF-UHFFFAOYSA-N succinimide Chemical compound O=C1CCC(=O)N1 KZNICNPSHKQLFF-UHFFFAOYSA-N 0.000 claims 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 3
- 150000002118 epoxides Chemical group 0.000 claims 3
- 229910052739 hydrogen Inorganic materials 0.000 claims 3
- 239000001257 hydrogen Substances 0.000 claims 3
- 230000001737 promoting effect Effects 0.000 claims 3
- 229910052710 silicon Inorganic materials 0.000 claims 3
- 239000010703 silicon Substances 0.000 claims 3
- AZCPGKKUVBUVMP-UHFFFAOYSA-N 4-amino-2-[3-(5-amino-2-carboxyphenyl)propyl]benzoic acid Chemical compound NC1=CC=C(C(O)=O)C(CCCC=2C(=CC=C(N)C=2)C(O)=O)=C1 AZCPGKKUVBUVMP-UHFFFAOYSA-N 0.000 claims 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 2
- 239000004215 Carbon black (E152) Substances 0.000 claims 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 claims 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- 125000000217 alkyl group Chemical group 0.000 claims 2
- 125000003118 aryl group Chemical group 0.000 claims 2
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 claims 2
- -1 heterocyclic hydrocarbon Chemical class 0.000 claims 2
- 229930195733 hydrocarbon Natural products 0.000 claims 2
- 150000002431 hydrogen Chemical group 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 239000000047 product Substances 0.000 claims 2
- 239000011342 resin composition Substances 0.000 claims 2
- 229960002317 succinimide Drugs 0.000 claims 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 claims 2
- KGSFMPRFQVLGTJ-UHFFFAOYSA-N 1,1,2-triphenylethylbenzene Chemical compound C=1C=CC=CC=1C(C=1C=CC=CC=1)(C=1C=CC=CC=1)CC1=CC=CC=C1 KGSFMPRFQVLGTJ-UHFFFAOYSA-N 0.000 claims 1
- YPACMOORZSDQDQ-UHFFFAOYSA-N 3-(4-aminobenzoyl)oxypropyl 4-aminobenzoate Chemical compound C1=CC(N)=CC=C1C(=O)OCCCOC(=O)C1=CC=C(N)C=C1 YPACMOORZSDQDQ-UHFFFAOYSA-N 0.000 claims 1
- RVHYAZQAQIWUDD-UHFFFAOYSA-N 4-[bis(oxiran-2-ylmethyl)amino]-2-[3-[5-[bis(oxiran-2-ylmethyl)amino]-2-carboxyphenyl]propyl]benzoic acid Chemical compound OC(=O)C1=CC=C(N(CC2OC2)CC2OC2)C=C1CCCC(C(=CC=1)C(O)=O)=CC=1N(CC1OC1)CC1CO1 RVHYAZQAQIWUDD-UHFFFAOYSA-N 0.000 claims 1
- ALYNCZNDIQEVRV-UHFFFAOYSA-M 4-aminobenzoate Chemical compound NC1=CC=C(C([O-])=O)C=C1 ALYNCZNDIQEVRV-UHFFFAOYSA-M 0.000 claims 1
- 229910015900 BF3 Inorganic materials 0.000 claims 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 claims 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims 1
- 229920002614 Polyether block amide Polymers 0.000 claims 1
- 239000004721 Polyphenylene oxide Substances 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 229910052796 boron Inorganic materials 0.000 claims 1
- 229910052799 carbon Inorganic materials 0.000 claims 1
- 239000002131 composite material Substances 0.000 claims 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims 1
- 125000003700 epoxy group Chemical group 0.000 claims 1
- 238000005187 foaming Methods 0.000 claims 1
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 claims 1
- 229910002804 graphite Inorganic materials 0.000 claims 1
- 239000010439 graphite Substances 0.000 claims 1
- 229920001519 homopolymer Polymers 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims 1
- 229920006122 polyamide resin Polymers 0.000 claims 1
- 229920000570 polyether Polymers 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
- 229910052708 sodium Inorganic materials 0.000 claims 1
- 239000011734 sodium Substances 0.000 claims 1
- 229910000033 sodium borohydride Inorganic materials 0.000 claims 1
- 239000012279 sodium borohydride Substances 0.000 claims 1
- 239000002904 solvent Substances 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 125000003258 trimethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])[*:1] 0.000 claims 1
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D207/00—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom
- C07D207/02—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom
- C07D207/30—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom having two double bonds between ring members or between ring members and non-ring members
- C07D207/34—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom having two double bonds between ring members or between ring members and non-ring members with hetero atoms or with carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals, directly attached to ring carbon atoms
- C07D207/36—Oxygen or sulfur atoms
- C07D207/40—2,5-Pyrrolidine-diones
- C07D207/404—2,5-Pyrrolidine-diones with only hydrogen atoms or radicals containing only hydrogen and carbon atoms directly attached to other ring carbon atoms, e.g. succinimide
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
- C07D303/02—Compounds containing oxirane rings
- C07D303/36—Compounds containing oxirane rings with hydrocarbon radicals, substituted by nitrogen atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/52—Amino carboxylic acids
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
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- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 섬유 보강 수지함침 테이프를 준비하는 방법의 모식도. 제2도는 본 발명의 섬유보강 수지함침테이프 한가닥의 절단면의 확대도.
Claims (17)
- 다음으로 구성된 섬유보강수지 복합체:(a) 비규소성 보강 필라멘트, 및 (b) 다음으로 구성된 열경화성 에폭시 수지 조성물:(ⅰ) 분자당 하나이상의 에폭시기를 갖고 있는 에폭시 전중합체 또는 전중합체의 조합, 및 (ⅱ) 경화를 촉진 시키기에 충분한 다음 일반식에서 선택된 아민관능성 경화제 또는 경화제의 조합:여기서 a는 2 또는 3, R은 수소, 알킬기 또는 아릴기, X는 유기 탄화수소, 헤테로성 탄화수소 또는 치환된 탄화수소기의 2가 또는 3가기 또는 -N-이다.
- 보강재와 다음으로 구성된 열경화성 에폭시 수지 조성물:(ⅰ) 분자당 하나이상의 에폭시드기를 갖는 에폭시 전중합체 또는 전중합체의 조합, 및 (ⅱ) 경화제를 촉진시킬수 있는 양의 다음 일반식에서 선택된 아민관능성 경화제 또는 경화제의 조합:여기서 R1은 수소 또는 메틸기 이고 Z는 2-12의 정수이다.
- 다음으로 구성된 섬유보강수지 복합체:(a) 보강 필라멘트, 및 (b) 다음 물질모형성된 열경화성 수지 조성물:(ⅰ) N,N,N´,N´-테트라글리시딜-4,4-디아미노디페닐 메탄, (ⅱ) 테트라글리시독시 테트라페닐에탄, (ⅲ) 트리메틸렌비스- (p-아미노벤조에이트), (ⅳ) 구운 실리카, 및 (ⅴ) 톨루엔 디이소시아네이트와 디메틸아민과의 반응생성물.
- 제3항에 있어서, (b) 성분이 중량배당에 의해 다음과 같이 부(部)를 갖는 물질로 구성된 섬유보강수지 복합체, (b)(ⅰ)이 75-85부, (b)(ⅱ)가 15-24부, (b)(ⅱ)가 35-45부, (b)(ⅳ)가 5-7부, 및 (b)(ⅴ)가 0.5-1.5부
- 제1항에 있어서, 수지조성물이 약 30-40중량퍼센트이고, 필라멘트가 70-60중량퍼센트인 섬유보강수지 복합체.
- 제1항에 있어서, 필라멘트가 탄소 또는 그래파이트 필라멘트로 구성된 섬유보강수지복합체.
- 다음으로 구성된 섬유보강 수지 복합체:(a) 비규소성 보강 필라멘트, 및 (b) 다음으로 구성된 열경화성 에폭시수지 조성물:(ⅰ) 한 분자당 하나이상의 에폭시드기를 갖는 에폭시 전중합체 또는 전중체의 조합, 및 (ⅱ) 경화를 촉진시킬 수 있는 양의 다음 일반식에서 선택된 아민관능성 경화제 또는 경화제의 조합:여기서 n은 2-12이고, (b)(ⅱ)의 아민 관능성 경화제는 (b)(ⅰ)의 에폭시 전중합체보다 많은 화학양론양만큼 존재한다.
- 다음으로 구성된 섬유보강수지복합체:(a) 비규소성 보강 필라멘트, (b) 다음으로 구성된 열경화성 에폭시 수지 조성물:(ⅰ)한 분자당 하나이상의 에폭시드기를 갖는 에폭시 전중합체 또는 전중합체의 조합. (ⅱ) 경화를 촉진 시킬 수 있는 양의 다음 일반식에서 선택된 아민 관능성 경화제:여기서 a는 2 또는 3이고, R은 수소, 알킬기 또는 아릴기이고 X는 2가 또는 3가의 유기 탄화수소기, 테테로성 탄화수소기 또는 치환 된 탄환수소기 이거나 -N-, 이다.(c) 이조성에서 생성된 복합체, 뜨겁고/습한 조건하에서 강인성 및 파괴 저항을 증대시키기에 충분한 만큼 조성(b)와 혼합되거나 또는 연합된 제2의 균일성 또는 불균일성의 폴리에테르알콜 또는 폴리에테르아미드 수지 성분.
- 제8항에 있어서, 제2의 수지 (c)가 다음 일반식의 화합물인 섬유 보강 수지 복합체:
- 제8항에 있어서, 제2의 수지 (c)가 다음 일반식의 화합물인 섬유보강수지 복합체:
- 다음으로 구성된 섬유 보강 수지 복합체:(a) 보강하는 만큼의 보강 필라멘트, 및 (b) 다음으로 구성된 열경화성 에폭시 수지:(ⅰ) N,N,N´,N´-테트라글리시딘-4,4´-디아미노페닐메탄 100중량부; (ⅱ) 트리메틸렌 비스-(p-아미노벤조에이트 40-45중량부; (ⅲ) 2,4-톨루엔 디이소시아네이트와 디메틸아민의 반응 생성물 또는 유기 아민과 삼불화 보론의착물 0.25-4 중량부와, (c) 9항에 보인 일반식의 비스페놀 A와 에피클로로히드린의 수지성 반응 생성물 5-20중량부.
- 다음으로 구성되는 섬유보강 수지 복합체:(a) 보강하는 만큼의 보강 필라멘트, 및 (b) 다음으로 구성된 열경화성 에폭시 수지 조성물:(ⅰ) N,N,N´,N´-테트라글리시딜-4,4´-디아미노페닐메탄 20-90중량부. (ⅱ) 비스페놀 A의 디글리시딜 에테르 10-80중량부; 및 (ⅲ) 트리메틸렌 비스-(p-아미노벤조에이트) 30-60중량부와;(c) 제10항에서 보인 일반식의 폴리에테르폴리이미드 10-30중량부.
- 다음으로 구성된 섬유보강수지복합체 :(a) 보강 필라멘트와, (b) 다음 물질로부터 만들어진 열경화성 에폭시 수지 조성물;(ⅰ) N,N,N´,N´-테트라글리시딜-4,4´-디아미노페닐메탄 114-126중량부. (ⅱ) 다음식의 폴리에테르폴리아미드 수지 14.25-15.75중량부여기서 n은 분자량이 25,000-50,000되기에 충분한 정수, (ⅲ) 1,3-프로필렌-비스-(p-아미노벤조에이트) 45.6-50.4중량부; 및 (ⅳ) 삼불화 보론-유기성아민착물 0.475-0.52중량부.
- 열과 압력하에서 교화시킨 제1항에서 정의한 여러층의 섬유보강수지 복합체로 구성되도록 제조한 제품.
- N,N,N´,N´-테트라글리시딜-1,3-프로필렌-비스-(p-아미노벤조에이트)와, 이들의 단중합체.
- 다음으로 구성된 비스 -N-메틸아미노 방향성화합물의 제조방법:(a) 대응하는 디 일급 아미노방향성화합물이 대응하는 비스-N-석신이미딜 메틸아미노 방향성 화합물이 되도록 석신이미드 및 포층알데히드와 반응시키고; 또 (b) 단계(a)의 생성물을 비스-N-메틸아미노 방향성화합물이 형성되도록 용매에서 소듐브로하이드 라이드로 처리한다.
- 다음으로구성된 다음 일반식의 비스-N-메틸-아미노 화합물의 준비방법:여기서 n은 2-6의 정수. (a) 다음 일반식의 대응하는 디 일급아미노화합물이(여기서 n은 상기정의와 같다.)다음 일반식의 화합물이 형성될 때까지 석신이미드 및 포름알페히드와 반응시키고; 또(여기서 n은 상기의 정의와 같다.)(b) 언급한 bis-N-메틸아미노 화합물의 형성이 완결될 때까지 상기 반응생성물을 소듐보로하이드라이드 및 디메틸 설폭시드와 처리한다.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (14)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US51887283A | 1983-08-01 | 1983-08-01 | |
| US06/518,863 US4623746A (en) | 1983-08-01 | 1983-08-01 | Alkyleneglycol-bis(4-methylaminobenzoates) |
| US06/518,873 US4562217A (en) | 1983-08-01 | 1983-08-01 | Curable epoxy resin compositions |
| US518856 | 1983-08-01 | ||
| US06/518,856 US4518786A (en) | 1983-08-01 | 1983-08-01 | N,N,N',N'-tetraglycidyl-1,3-propylene bis(p-aminobenzoate |
| US518875 | 1983-08-01 | ||
| US06/518,879 US4558078A (en) | 1983-08-01 | 1983-08-01 | Curable epoxy resin compositions |
| US06/518,875 US4533686A (en) | 1983-08-01 | 1983-08-01 | Curable epoxy resin compositions |
| US518872 | 1983-08-01 | ||
| US518874 | 1983-08-01 | ||
| US06/518,874 US4623681A (en) | 1983-08-01 | 1983-08-01 | Curable epoxy resin compositions |
| US518879 | 1983-08-01 | ||
| US518873 | 1983-08-01 | ||
| US518863 | 1983-08-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR850002582A true KR850002582A (ko) | 1985-05-15 |
Family
ID=27569824
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019840004552A KR850002582A (ko) | 1983-08-01 | 1984-07-31 | 경화성 에폭시 수지 조성물 |
Country Status (8)
| Country | Link |
|---|---|
| EP (1) | EP0133281A3 (ko) |
| JP (1) | JPH07107034B2 (ko) |
| KR (1) | KR850002582A (ko) |
| AR (1) | AR244282A1 (ko) |
| AU (1) | AU570708B2 (ko) |
| BR (1) | BR8403823A (ko) |
| IL (1) | IL72598A (ko) |
| MX (1) | MX165504B (ko) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0133280A3 (en) * | 1983-08-01 | 1986-03-19 | American Cyanamid Company | Thermoset interleafed resin matrix composites with improved compression properties |
| US4636535A (en) * | 1983-08-01 | 1987-01-13 | American Cyanamid Company | Curable epoxy resin compositions |
| EP0151722B1 (en) * | 1984-01-30 | 1989-12-13 | American Cyanamid Company | Process for the preparation of thermoplastic composites |
| EP0159482A3 (en) * | 1984-03-28 | 1987-02-25 | American Cyanamid Company | Resin matrix composites with controlled flow and tack |
| EP0156148B1 (en) * | 1984-03-30 | 1990-11-22 | American Cyanamid Company | High impact strength fiber resin matrix composites |
| ATE53537T1 (de) * | 1984-04-10 | 1990-06-15 | President Eng Corp | Verfahren zum herstellen von kupferkaschiertem basismaterial fuer leiterplatten. |
| JPH05156002A (ja) * | 1991-06-04 | 1993-06-22 | Natl Starch & Chem Investment Holding Corp | ポリエーテルアミン化合物及びエポキシ系接着剤組成物 |
| GB0512610D0 (en) * | 2005-06-18 | 2005-07-27 | Hexcel Composites Ltd | Composite material |
| CN104364290B (zh) * | 2012-06-08 | 2016-09-07 | Adeka株式会社 | 固化性树脂组合物、树脂组合物、树脂片、及这些组合物和树脂片的固化物 |
| US10119001B2 (en) | 2014-02-06 | 2018-11-06 | Hexcel Corporation | Extended room temperature storage of epoxy resins |
| GB201402053D0 (en) * | 2014-02-06 | 2014-03-26 | Hexcel Composites Ltd | Amino benzoates or benzamides as curing agents for epoxy resins |
| FR3083242B1 (fr) * | 2018-07-02 | 2020-06-12 | Compagnie Generale Des Etablissements Michelin | Composition de caoutchouc a base de resine epoxyde et d’un derive d’aminobenzoate |
| WO2020187681A1 (en) | 2019-03-15 | 2020-09-24 | Henkel Ag & Co. Kgaa | Sulfone-resin containing gas-barrier adhesive |
| CN118047934A (zh) * | 2024-01-22 | 2024-05-17 | 深圳大学 | 一种全芳香酯环氧树脂及其制备方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1720680A1 (de) * | 1967-07-06 | 1971-07-15 | Bayer Ag | Verfahren zur Herstellung von Formkoerpern,UEberzuegen,Filmen und Verklebungen |
| DE1909520B2 (de) * | 1969-02-26 | 1976-09-02 | Bayer Ag, 5090 Leverkusen | Verfahren zur herstellung aromatischer diamine |
| US3696131A (en) * | 1970-04-06 | 1972-10-03 | Union Carbide Corp | Aromatic acid diamides of diamino diphenyl sulfones |
| BE790595A (fr) * | 1971-11-19 | 1973-02-15 | Gen Electric | Compositions polymeres preparees a partir de melanges d'epoxydes et d'imides |
| GB1489565A (en) * | 1974-02-05 | 1977-10-19 | Mitsui Petrochemical Ind | Room temperature-curable elastomeric composition |
| US3932360A (en) * | 1974-03-14 | 1976-01-13 | Polaroid Corporation | Polyurethane elastomers prepared from diamine curing agents |
| AU543343B2 (en) * | 1981-03-06 | 1985-04-18 | E.I. Du Pont De Nemours And Company | Epoxy-imide composition |
-
1984
- 1984-07-24 EP EP84108757A patent/EP0133281A3/en not_active Ceased
- 1984-07-31 MX MX20221084A patent/MX165504B/es unknown
- 1984-07-31 BR BR8403823A patent/BR8403823A/pt not_active IP Right Cessation
- 1984-07-31 KR KR1019840004552A patent/KR850002582A/ko not_active Application Discontinuation
- 1984-07-31 AU AU31330/84A patent/AU570708B2/en not_active Ceased
- 1984-08-01 AR AR84297429A patent/AR244282A1/es active
- 1984-08-06 IL IL72598A patent/IL72598A/xx unknown
-
1992
- 1992-04-08 JP JP4115387A patent/JPH07107034B2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| MX165504B (es) | 1992-11-16 |
| AR244282A1 (es) | 1993-10-29 |
| IL72598A0 (en) | 1984-11-30 |
| IL72598A (en) | 1988-02-29 |
| JPH05201941A (ja) | 1993-08-10 |
| EP0133281A2 (en) | 1985-02-20 |
| AU3133084A (en) | 1985-02-07 |
| JPH07107034B2 (ja) | 1995-11-15 |
| EP0133281A3 (en) | 1988-11-30 |
| BR8403823A (pt) | 1985-07-09 |
| AU570708B2 (en) | 1988-03-24 |
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