ES2111609T3 - Composiciones de ppo/monomeros epoxido curables de elevado rendimiento con agente compatibilizante de sal metalica de estaño. - Google Patents
Composiciones de ppo/monomeros epoxido curables de elevado rendimiento con agente compatibilizante de sal metalica de estaño.Info
- Publication number
- ES2111609T3 ES2111609T3 ES92302576T ES92302576T ES2111609T3 ES 2111609 T3 ES2111609 T3 ES 2111609T3 ES 92302576 T ES92302576 T ES 92302576T ES 92302576 T ES92302576 T ES 92302576T ES 2111609 T3 ES2111609 T3 ES 2111609T3
- Authority
- ES
- Spain
- Prior art keywords
- ppo
- high performance
- metallic salt
- tin
- compatibilizing agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000003795 chemical substances by application Substances 0.000 title abstract 3
- 150000003839 salts Chemical class 0.000 title abstract 3
- 239000004593 Epoxy Substances 0.000 title 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title 1
- 239000000203 mixture Substances 0.000 title 1
- 239000000178 monomer Substances 0.000 title 1
- 150000001875 compounds Chemical class 0.000 abstract 3
- 229920000647 polyepoxide Polymers 0.000 abstract 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 abstract 2
- 239000003822 epoxy resin Substances 0.000 abstract 2
- 229930185605 Bisphenol Natural products 0.000 abstract 1
- 239000004721 Polyphenylene oxide Substances 0.000 abstract 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 abstract 1
- 150000002118 epoxides Chemical class 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 abstract 1
- 229920006380 polyphenylene oxide Polymers 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/121—Metallo-organic compounds
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Reinforced Plastic Materials (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
Abstract
COMPUESTOS DE EPOXIDO MONOMERICO/PPO ENDURECIBLES DE ALTO RENDIMIENTO CON UN AGENTE COMPATABILIZADOR DE LA SAL METALICA DE ESTAÑO. SE PRESENTAN COMPUESTOS ENDURECIBLES BASADOS EN UNA COMBINACION DE OXIDO DE POLIFENILENO, RESINA EPOXIDA MONOMERICA, UNA SAL DE METAL COMPATIBILIZANTE DE ESTAÑO, Y AGENTES ENDURECEDORES ADECUADOS. LA RESINA EPOXIDA MONOMERICA COMPRENDE UN COMPUESTO DE POLIEPOXIDO QUE CONTIENE AL MENOS UN ETER DE POLIGLICIDIL BISFENOL QUE TIENE UNA MEDIA DE COMO MAXIMO UN GRUPO DE HIDROXIDO ALIFATICO POR MOLECULA. EL COMPUESTO PUEDE USARSE EN LA PREPARACION DE LAMINADOS UTILES COMO TARJETAS DE CIRCUITOS IMPRESOS.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US07/677,229 US5262491A (en) | 1991-03-29 | 1991-03-29 | High performance curable PPO/monomeric epoxy compositions with tin metal salt compatibilizing agent |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES2111609T3 true ES2111609T3 (es) | 1998-03-16 |
Family
ID=24717857
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES92302576T Expired - Lifetime ES2111609T3 (es) | 1991-03-29 | 1992-03-25 | Composiciones de ppo/monomeros epoxido curables de elevado rendimiento con agente compatibilizante de sal metalica de estaño. |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US5262491A (es) |
| EP (1) | EP0506366B1 (es) |
| JP (1) | JP3308583B2 (es) |
| KR (1) | KR100209387B1 (es) |
| BR (1) | BR9201109A (es) |
| DE (1) | DE69223668T2 (es) |
| ES (1) | ES2111609T3 (es) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6231959B1 (en) | 1995-02-27 | 2001-05-15 | Matsushita Electric Works, Ltd. | Prepreg of epoxy resin, hardener, and organodialkyurea promotor |
| US5719891A (en) * | 1995-12-18 | 1998-02-17 | Picolight Incorporated | Conductive element with lateral oxidation barrier |
| US6304588B1 (en) * | 1997-02-07 | 2001-10-16 | Xerox Corporation | Method and structure for eliminating polarization instability in laterally-oxidized VCSELs |
| US6518362B1 (en) * | 1998-02-18 | 2003-02-11 | 3M Innovative Properties Company | Melt blending polyphenylene ether, polystyrene and curable epoxy |
| US6576718B1 (en) * | 1999-10-05 | 2003-06-10 | General Electric Company | Powder coating of thermosetting resin(s) and poly(phenylene ethers(s)) |
| US6369145B1 (en) * | 1999-11-04 | 2002-04-09 | Rohm And Haas Company | Low gloss polyester coating powder compositions |
| US7257141B2 (en) * | 2003-07-23 | 2007-08-14 | Palo Alto Research Center Incorporated | Phase array oxide-confined VCSELs |
| US7101933B2 (en) * | 2003-12-10 | 2006-09-05 | Uniplus Electronics Co., Ltd. | Process for producing high speed transmitting dielectric material |
| USRE44893E1 (en) | 2004-03-26 | 2014-05-13 | Hanwha Azdel, Inc. | Fiber reinforced thermoplastic sheets with surface coverings |
| US7687556B2 (en) * | 2004-09-28 | 2010-03-30 | Isola Usa Corp. | Flame retardant compositions |
| US20060074151A1 (en) * | 2004-09-28 | 2006-04-06 | Polyclad Laminates, Inc. | Low expansion dielectric compositions |
| US8129456B2 (en) * | 2004-09-28 | 2012-03-06 | Isola Usa Corp. | Flame retardant compositions with a phosphorated compound |
| JPWO2011068092A1 (ja) * | 2009-12-01 | 2013-04-18 | ナガセケムテックス株式会社 | エポキシ樹脂組成物 |
| US8039560B1 (en) | 2010-04-01 | 2011-10-18 | Nan Ya Plastics Corporation | Low dielectric brominated resin with a symmetric or saturated heterocyclic alphatic molecular structure and the preparation thereof |
| EP2762512A1 (de) * | 2013-02-04 | 2014-08-06 | Siemens Aktiengesellschaft | Reaktionsbeschleuniger für eine Copolymerisation, Elektroisolationsband, Elektroisolationskörper und Konsolidierungskörper |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL128175C (es) * | 1961-08-28 | |||
| US5073605A (en) * | 1988-07-14 | 1991-12-17 | General Electric Company | Bromine-bisphenol reacted bisphenol and novolak epoxy resins with polyphenylene ether |
| US4853423A (en) * | 1988-07-14 | 1989-08-01 | General Electric Company | Curable polyphenylene ether-polyepoxide compositions useful in printed circuit board production |
| US5043367A (en) * | 1988-12-22 | 1991-08-27 | General Electric Company | Curable dielectric polyphenylene ether-polyepoxide compositions useful in printed circuit board production |
| EP0436212A3 (en) * | 1990-01-02 | 1992-07-29 | General Electric Company | Polyphenylene ether-polyepoxide compositions rapidly curable to flame retardant, solderable materials |
-
1991
- 1991-03-29 US US07/677,229 patent/US5262491A/en not_active Expired - Lifetime
-
1992
- 1992-03-25 DE DE69223668T patent/DE69223668T2/de not_active Expired - Lifetime
- 1992-03-25 ES ES92302576T patent/ES2111609T3/es not_active Expired - Lifetime
- 1992-03-25 EP EP92302576A patent/EP0506366B1/en not_active Expired - Lifetime
- 1992-03-26 JP JP06771292A patent/JP3308583B2/ja not_active Expired - Lifetime
- 1992-03-28 KR KR1019920005164A patent/KR100209387B1/ko not_active Expired - Lifetime
- 1992-03-30 BR BR929201109A patent/BR9201109A/pt not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| EP0506366A3 (en) | 1993-01-27 |
| EP0506366A2 (en) | 1992-09-30 |
| KR920018150A (ko) | 1992-10-21 |
| BR9201109A (pt) | 1992-11-24 |
| JP3308583B2 (ja) | 2002-07-29 |
| JPH0597971A (ja) | 1993-04-20 |
| EP0506366B1 (en) | 1997-12-29 |
| DE69223668T2 (de) | 1998-07-16 |
| DE69223668D1 (de) | 1998-02-05 |
| US5262491A (en) | 1993-11-16 |
| KR100209387B1 (ko) | 1999-07-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FG2A | Definitive protection |
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