ES458240A1 - Un metodo de preparacion de una composicion resinosa sin di-solvente muy fluida util como aislamiento resinoso de un e- lemento o aparato electrico aislado. - Google Patents
Un metodo de preparacion de una composicion resinosa sin di-solvente muy fluida util como aislamiento resinoso de un e- lemento o aparato electrico aislado.Info
- Publication number
- ES458240A1 ES458240A1 ES458240A ES458240A ES458240A1 ES 458240 A1 ES458240 A1 ES 458240A1 ES 458240 A ES458240 A ES 458240A ES 458240 A ES458240 A ES 458240A ES 458240 A1 ES458240 A1 ES 458240A1
- Authority
- ES
- Spain
- Prior art keywords
- epoxy resins
- curing epoxy
- latent accelerators
- epoxy resin
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/226—Mixtures of di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/70—Chelates
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Epoxy Resins (AREA)
- Organic Insulating Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Paints Or Removers (AREA)
Abstract
Un método de preparación de una composición resinosa sin disolvente, muy fluida, útil como aislamiento resinoso de un elemento o aparato eléctrico aislado, caracterizado por hacer reaccionar (1) 100 partes en peso de una resina constituida por una primera resina epoxi formada por un éter diglicidílico de un diol alifático que tiene una viscosidad de entre 5 cps. Y 60 cps. A 25ºC y una segunda resina epoxi en forma de por lo menos por una resina epoxi de bisfenol A.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/680,633 US4137275A (en) | 1976-04-27 | 1976-04-27 | Latent accelerators for curing epoxy resins |
Publications (1)
Publication Number | Publication Date |
---|---|
ES458240A1 true ES458240A1 (es) | 1978-06-16 |
Family
ID=24731884
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES458240A Expired ES458240A1 (es) | 1976-04-27 | 1977-04-27 | Un metodo de preparacion de una composicion resinosa sin di-solvente muy fluida util como aislamiento resinoso de un e- lemento o aparato electrico aislado. |
Country Status (7)
Country | Link |
---|---|
US (1) | US4137275A (es) |
JP (1) | JPS52130899A (es) |
BR (1) | BR7702618A (es) |
CA (1) | CA1110393A (es) |
ES (1) | ES458240A1 (es) |
FR (1) | FR2349623A1 (es) |
IT (1) | IT1075837B (es) |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4224541A (en) * | 1978-05-26 | 1980-09-23 | Westinghouse Electric Corp. | Fluid solventless epoxy-anhydride compositions containing metal acetylacetonate accelerators and organic carboxylic acid co-accelerators for use on an electrical member |
JPS5513797A (en) * | 1978-07-13 | 1980-01-30 | Westinghouse Electric Corp | Uniform*finely crushed*solid*insulating powder coating composition |
US4356417A (en) * | 1979-05-17 | 1982-10-26 | Westinghouse Electric Corp. | Catechol or pyrogallol containing flexible insulating tape having low gel time |
US4296018A (en) * | 1979-05-17 | 1981-10-20 | Westinghouse Electric Corp. | Catechol or pyrogallol containing flexible insulating tape having low gel time |
US4246161A (en) * | 1979-08-08 | 1981-01-20 | Westinghouse Electric Corp. | Carbonyl latent accelerators for curing epoxy resins |
US4401775A (en) * | 1982-06-24 | 1983-08-30 | Rca Corporation | Epoxy encapsulating formulation |
US4510277A (en) * | 1983-11-03 | 1985-04-09 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Process for improving moisture resistance of epoxy resins by addition of chromium ions |
US4473674A (en) * | 1983-11-03 | 1984-09-25 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Process for improving mechanical properties of epoxy resins by addition of cobalt ions |
GB2161164B (en) * | 1984-07-03 | 1987-10-14 | Coates Brothers Plc | Coating compositions |
JPH0192567U (es) * | 1987-12-11 | 1989-06-16 | ||
US4814391A (en) * | 1988-05-09 | 1989-03-21 | General Electric Company | Heat curable epoxy compositions, and amine adducts of cobalt (II) complexes |
US5213886A (en) * | 1989-02-17 | 1993-05-25 | General Electric Company | Curable dielectric polyphenylene ether-polyepoxide compositions |
US5162450A (en) * | 1989-02-17 | 1992-11-10 | General Electric Company | Curable dielectric polyphenylene ether-polyepoxide compositions |
DD292468A5 (de) | 1990-03-09 | 1991-08-01 | Zeiss Carl Jena Gmbh | Verfahren zur polymerisation von epoxidverbindungen |
US6375867B1 (en) | 1993-11-29 | 2002-04-23 | Eaton Corporation | Process for making a positive temperature coefficient conductive polymer from a thermosetting epoxy resin and conductive fillers |
EP0705856A2 (en) * | 1994-10-07 | 1996-04-10 | Shell Internationale Researchmaatschappij B.V. | Epoxy resin composition for semiconductor encapsulation |
JP3201262B2 (ja) * | 1996-05-30 | 2001-08-20 | 株式会社日立製作所 | 熱硬化性樹脂組成物,電機絶縁線輪,回転電機及びその製造方法 |
US5834565A (en) * | 1996-11-12 | 1998-11-10 | General Electric Company | Curable polyphenylene ether-thermosetting resin composition and process |
JP3651729B2 (ja) * | 1997-03-14 | 2005-05-25 | 株式会社東芝 | 含浸用樹脂組成物 |
US6197898B1 (en) | 1997-11-18 | 2001-03-06 | General Electric Company | Melt-mixing thermoplastic and epoxy resin above Tg or Tm of thermoplastic with curing agent |
US5968419A (en) * | 1997-12-08 | 1999-10-19 | Westinghouse Electric Company Llc | Conductive polymer compositions, electrical devices and methods of making |
US6437090B1 (en) | 1998-06-17 | 2002-08-20 | Kabushiki Kaisha Toshiba | Curing catalyst, resin composition, resin-sealed semiconductor device and coating material |
US6544651B2 (en) | 2000-05-18 | 2003-04-08 | Georgia Tech Research Corp. | High dielectric constant nano-structure polymer-ceramic composite |
US6680119B2 (en) | 2001-08-22 | 2004-01-20 | Siemens Westinghouse Power Corporation | Insulated electrical coil having enhanced oxidation resistant polymeric insulation composition |
US6555023B2 (en) | 2001-08-22 | 2003-04-29 | Siemens Westinghouse Power Corporation | Enhanced oxidation resistant polymeric insulation composition for air-cooled generators |
US6548576B1 (en) | 2001-11-07 | 2003-04-15 | Bourns, Inc. | Epoxy formulation adapted to be used in conjunction with no-lead solder in electronic components |
US20120308831A1 (en) * | 2009-12-01 | 2012-12-06 | Nagase Chemtex Corporation | Epoxy resin composition |
JP5166495B2 (ja) * | 2010-08-11 | 2013-03-21 | 株式会社日立製作所 | ドライマイカテープ及びこれを用いた電気絶縁線輪 |
ITMI20110797A1 (it) * | 2011-05-10 | 2012-11-11 | Polynt S P A | Miscela indurente a bassa temperatura per resine epossidiche. |
WO2013183188A1 (ja) * | 2012-06-08 | 2013-12-12 | 株式会社安川電機 | 回転電機及び回転電機の製造方法 |
WO2014092826A1 (en) * | 2012-12-12 | 2014-06-19 | Empire Technology Development Llc | Nano-encapsulating polymers with high barrier properties |
FR3020367B1 (fr) | 2014-04-24 | 2017-10-27 | Arkema France | Catalyseur a base de titane pour resines vitrimeres de type epoxy/anhyride |
CN104449268B (zh) * | 2014-11-18 | 2017-02-22 | 广州擎天材料科技有限公司 | 一种低温固化的汽车铝轮毂专用底粉粉末涂料及其制备方法 |
CN113402853B (zh) * | 2021-07-05 | 2023-08-01 | 北玻院(滕州)复合材料有限公司 | 一种双组份环氧树脂组合物及其制备方法 |
CN116285595B (zh) * | 2022-09-26 | 2024-04-19 | 苏州巨峰电气绝缘系统股份有限公司 | 一种绝缘滴浸树脂及其制备方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL283978A (es) * | 1961-10-05 | 1900-01-01 | ||
US3626022A (en) * | 1967-04-13 | 1971-12-07 | Asahi Denka Kogyo Kk | Hardenable epoxy resin containing chelates from metal halides, monoepoxides, and chelate forming compounds |
US3624032A (en) * | 1969-04-24 | 1971-11-30 | Morton Int Inc | Epoxy compositions cured with carboxylic acid anhydrides and metallic salt of acetylacetone |
GB1402899A (en) * | 1971-10-28 | 1975-08-13 | Gen Electric | Curable epoxy resin compositons |
US3956241A (en) * | 1974-06-07 | 1976-05-11 | Aerojet-General Corporation | Latent catalysts for epoxy resins |
DE2535101A1 (de) * | 1974-08-12 | 1976-02-26 | Aerojet General Co | Verfahren zum herstellen von harzen |
-
1976
- 1976-04-27 US US05/680,633 patent/US4137275A/en not_active Expired - Lifetime
-
1977
- 1977-04-20 CA CA276,595A patent/CA1110393A/en not_active Expired
- 1977-04-26 BR BR2618/77A patent/BR7702618A/pt unknown
- 1977-04-26 JP JP4748377A patent/JPS52130899A/ja active Granted
- 1977-04-26 IT IT22818/77A patent/IT1075837B/it active
- 1977-04-27 FR FR7712765A patent/FR2349623A1/fr active Granted
- 1977-04-27 ES ES458240A patent/ES458240A1/es not_active Expired
Also Published As
Publication number | Publication date |
---|---|
CA1110393A (en) | 1981-10-06 |
JPS52130899A (en) | 1977-11-02 |
JPS54960B2 (es) | 1979-01-18 |
FR2349623A1 (fr) | 1977-11-25 |
FR2349623B1 (es) | 1984-05-11 |
US4137275A (en) | 1979-01-30 |
BR7702618A (pt) | 1978-02-08 |
IT1075837B (it) | 1985-04-22 |
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