ES8608723A1 - Un metodo para encapsular un componente electrico para pro- porcionar resistencia a descarga en corona - Google Patents

Un metodo para encapsular un componente electrico para pro- porcionar resistencia a descarga en corona

Info

Publication number
ES8608723A1
ES8608723A1 ES542913A ES542913A ES8608723A1 ES 8608723 A1 ES8608723 A1 ES 8608723A1 ES 542913 A ES542913 A ES 542913A ES 542913 A ES542913 A ES 542913A ES 8608723 A1 ES8608723 A1 ES 8608723A1
Authority
ES
Spain
Prior art keywords
heat curable
aromatic amine
encapsulants
polyglycidyl aromatic
electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES542913A
Other languages
English (en)
Other versions
ES542913A0 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Publication of ES542913A0 publication Critical patent/ES542913A0/es
Publication of ES8608723A1 publication Critical patent/ES8608723A1/es
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/28—Di-epoxy compounds containing acyclic nitrogen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3227—Compounds containing acyclic nitrogen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31529—Next to metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cable Accessories (AREA)
  • Organic Insulating Materials (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

METODO PARA ENCAPSULAR UN COMPONENTE ELECTRICO QUE PROPORCIONA RESISTENCIA A LA DESCARGA POR EFECTO CORONA, UTILIZANDO COMPOSICIONES POLIEPOXIDICAS Y TERMOCURABLES. CONSISTE EN IMPREGNAR EL COMPONENTE ELECTRICO CON UNA COMPOSICION TERMOCURABLE DE BAJA VISCOSIDAD QUE COMPRENDE UNA AMINA AROMATICA POLIGLICIDILICA NO CURADA, SELECCIONADA ENTRE DIGLICIDILANILINA, DIGLICIDILORTOTOLUIDINA, TETRAGLICIDILMETAXILILENDIAMINA Y MEZCLAS DE LAS MISMAS, UN AGENTE DE CURADO DE ANHIDRIDO DE ACIDO POLICARBOXILICO Y UN AGENTE ACELERADOR DE CURADO, SELECCIONADO ENTRE UN ANHIDRIDO NADICO-METILICO, ANHIDRIDO METILTETRAHIDROFTALICO Y ANHIDRIDO METILHEXAHIDROFTALICO; Y EN CURAR DICHA COMPOSICION PARA FORMAR UNA CAPA ENCAPSULANTE SOBRE EL COMPONENTE ELECTRICO.
ES542913A 1984-05-09 1985-05-08 Un metodo para encapsular un componente electrico para pro- porcionar resistencia a descarga en corona Expired ES8608723A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/608,615 US4559272A (en) 1984-05-09 1984-05-09 Heat curable polyglycidyl aromatic amine encapsulants

Publications (2)

Publication Number Publication Date
ES542913A0 ES542913A0 (es) 1986-06-16
ES8608723A1 true ES8608723A1 (es) 1986-06-16

Family

ID=24437273

Family Applications (1)

Application Number Title Priority Date Filing Date
ES542913A Expired ES8608723A1 (es) 1984-05-09 1985-05-08 Un metodo para encapsular un componente electrico para pro- porcionar resistencia a descarga en corona

Country Status (16)

Country Link
US (1) US4559272A (es)
EP (1) EP0181337B1 (es)
JP (1) JPS61502059A (es)
KR (1) KR910000047B1 (es)
AU (1) AU572899B2 (es)
CA (1) CA1250992A (es)
DE (1) DE3475242D1 (es)
DK (1) DK5886D0 (es)
EG (1) EG17247A (es)
ES (1) ES8608723A1 (es)
IL (1) IL75092A (es)
IN (1) IN163399B (es)
IT (1) IT1181660B (es)
NO (1) NO163696C (es)
TR (1) TR22203A (es)
WO (1) WO1985005215A1 (es)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6103157A (en) * 1997-07-02 2000-08-15 Ciba Specialty Chemicals Corp. Process for impregnating electrical coils
DE19828248A1 (de) * 1998-06-25 1999-12-30 Abb Corporate Research Ltd Bad Bei niedriger Temperatur härtende Epoxidharzsysteme aus Aminoglycidylverbindungen und cyclischen Carbonsäureanhydriden
US7723162B2 (en) * 2002-03-22 2010-05-25 White Electronic Designs Corporation Method for producing shock and tamper resistant microelectronic devices
DE102009007392A1 (de) * 2009-01-29 2010-08-05 Siemens Aktiengesellschaft Tränkharzsystem für Isolierstoffe in Schaltanlagen
DE102009008464A1 (de) * 2009-02-10 2010-08-12 Siemens Aktiengesellschaft Gießharzsystem für Isolierstoffe in Schaltanlagen
DE102012211323A1 (de) 2012-06-29 2014-01-02 Evonik Industries Ag Härter für Epoxidharzsysteme und deren Verwendung
FR2997401B1 (fr) 2012-10-25 2016-01-29 Univ Montpellier Ii Resines epoxydes reticulables a temperature ambiante
DE102013226601A1 (de) 2013-12-19 2015-06-25 Evonik Industries Ag Verarbeitungsfreundlicher Dianhydridhärter für Epoxidharzsysteme basierend auf 5,5'-Carbonylbis(isobenzofuran-1,3-dion)
DE102013226613A1 (de) 2013-12-19 2015-06-25 Evonik Industries Ag Verarbeitungsfreundlicher Dianhydridhärter für Epoxidharzsysteme basierend auf 5,5'-Oxybis(isobenzofuran-1,3-dion)
US10633084B2 (en) * 2017-08-25 2020-04-28 Bell Helicopter Textron Inc. Geodesic composite structures
CN113674992A (zh) * 2021-08-30 2021-11-19 西安微电子技术研究所 一种使用导热胶料浸渍绕制件的工艺方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1073200B (de) * 1960-01-14 Farbenfabriken Bayer Aktien gesellschaft Leverkusen-Bayerwerk Verfahren zum Beschleunigen der Aushärtung von basischen, mindestens zwei Epoxydgrup pen aufweisenden Derivaten von tertiären Mono- oder Polyaminen
DE1019083B (de) * 1956-01-28 1957-11-07 Bayer Ag Verfahren zur Herstellung von Kunststoffen durch Haerten von Epoxyverbindungen
BE567733A (es) * 1957-05-16
US2951825A (en) * 1958-02-03 1960-09-06 Union Carbide Corp Glycidyl derivatives of amino phenols
FR1357262A (fr) * 1962-05-11 1964-04-03 Bayer Ag Matière durcissable de moulage et de revêtement à base de résine d'époxyde
US3449641A (en) * 1966-01-11 1969-06-10 Gen Electric Epoxy encapsulated semiconductor device wherein the encapsulant comprises an epoxy novolak
US3489952A (en) * 1967-05-15 1970-01-13 Singer Co Encapsulated microelectronic devices
US3816365A (en) * 1968-09-12 1974-06-11 Ciba Geigy Ag Adducts,containing epoxide groups,from polyglycidyl compounds and acid polyesters of aliphatic-cycloaliphatic dicarboxylic acids,process for their manufacture and use
US3683044A (en) * 1969-12-29 1972-08-08 Japan Gas Chemical Co Heat-curable composition comprising polyglycidyl xylylene-diamine and process for preparation of polyglycidyl xylylenediamine
US3849383A (en) * 1973-03-05 1974-11-19 Dexter Corp Molding compounds from hexahydrophthalic anhydride,triglycidyl isocyanurate and a polyol
US3915780A (en) * 1973-08-02 1975-10-28 Texas Instruments Inc Extruded epoxy packaging system
JPS5111897A (ja) * 1974-07-19 1976-01-30 Hitachi Chemical Co Ltd Kokaseiehokishijushisoseibutsu
US4127695A (en) * 1975-10-07 1978-11-28 Matsushita Electric Industrial Co., Ltd. Method of insulating electromagnetic coils
GB2088859B (en) * 1981-11-16 1984-07-18 Takeda Chemical Industries Ltd Polyglycidyl compounds and method for production thereof
AU568601B2 (en) * 1982-09-13 1988-01-07 Dow Chemical Company, The Process for making epoxy resins

Also Published As

Publication number Publication date
IL75092A0 (en) 1985-09-29
DK5886A (da) 1986-01-07
JPH0381243B2 (es) 1991-12-27
WO1985005215A1 (en) 1985-11-21
CA1250992A (en) 1989-03-07
JPS61502059A (ja) 1986-09-18
IT8548050A1 (it) 1986-11-07
AU3392984A (en) 1985-11-28
NO163696B (no) 1990-03-26
DE3475242D1 (en) 1988-12-22
IT8548050A0 (it) 1985-05-07
ES542913A0 (es) 1986-06-16
US4559272A (en) 1985-12-17
IT1181660B (it) 1987-09-30
NO163696C (no) 1990-07-04
KR850008684A (ko) 1985-12-21
EP0181337B1 (en) 1988-11-17
KR910000047B1 (ko) 1991-01-19
DK5886D0 (da) 1986-01-07
NO860024L (no) 1986-01-06
TR22203A (tr) 1986-09-24
AU572899B2 (en) 1988-05-19
EG17247A (en) 1990-10-30
IN163399B (es) 1988-09-17
IL75092A (en) 1988-08-31
EP0181337A1 (en) 1986-05-21

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Legal Events

Date Code Title Description
FD1A Patent lapsed

Effective date: 19990301