GB1389493A - Epoxy resin compositions - Google Patents

Epoxy resin compositions

Info

Publication number
GB1389493A
GB1389493A GB2031872A GB2031872A GB1389493A GB 1389493 A GB1389493 A GB 1389493A GB 2031872 A GB2031872 A GB 2031872A GB 2031872 A GB2031872 A GB 2031872A GB 1389493 A GB1389493 A GB 1389493A
Authority
GB
United Kingdom
Prior art keywords
bisphenol
epoxy resin
iii
epoxy
resin compositions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2031872A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Goodrich Corp
Original Assignee
BF Goodrich Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BF Goodrich Corp filed Critical BF Goodrich Corp
Publication of GB1389493A publication Critical patent/GB1389493A/en
Expired legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/01Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/016Layered products comprising a layer of metal all layers being exclusively metallic all layers being formed of aluminium or aluminium alloys
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
    • B32B3/10Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
    • B32B3/12Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material characterised by a layer of regularly- arranged cells, e.g. a honeycomb structure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/12Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02Polycondensates containing more than one epoxy group per molecule
    • C08G59/04Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/066Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00Condition, form or state of the layers or laminate
    • B32B2305/02Cellular or porous
    • B32B2305/024Honeycomb
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00Metals, their alloys or their compounds
    • B32B2311/24Aluminium
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2607/00Walls, panels
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02Organic macromolecular compounds, natural resins, waxes or and bituminous materials

Abstract

1389493 Laminates B F GOODRICH CO 2 May 1972 [3 May 1971] 20318/72 Heading B5N [Also in Division C3] Aluminium honeycomb structures are manufactured using as adhesive a heat curable composition comprising: (I) a diepoxide, (II) a dihydric phenol in amount #70% of that equivalent to the epoxy content of I, (III) a minor amount of a straight chain polymer with end groups reactive with epoxy groups and (IV) an epoxy resin hardener. I may be a glycidyl ether of bisphenol A on a brominated bisphenol. II may be bisphenol A. III may be an amine terminated polyether and IV may be dicyandiamide. In an Example (1) aluminium alloy sheets are coated with a composition according to the invention, an aluminium honeycomb sandwiched between them and the assembly cured for 1 hour at 250‹ C.
GB2031872A 1971-05-03 1972-05-02 Epoxy resin compositions Expired GB1389493A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13995671A 1971-05-03 1971-05-03

Publications (1)

Publication Number Publication Date
GB1389493A true GB1389493A (en) 1975-04-03

Family

ID=22489076

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2031872A Expired GB1389493A (en) 1971-05-03 1972-05-02 Epoxy resin compositions

Country Status (4)

Country Link
DE (1) DE2221227A1 (en)
FR (1) FR2135178B1 (en)
GB (1) GB1389493A (en)
IT (1) IT954638B (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2118558A (en) * 1982-04-20 1983-11-02 Dunlop Ltd Adhesive compositions
EP0103432A2 (en) * 1982-09-07 1984-03-21 Texaco Development Corporation Epoxy resin composition
EP0109174A1 (en) * 1982-10-15 1984-05-23 Texaco Development Corporation One component water reduced epoxy adhesives
JP2014111694A (en) * 2012-12-05 2014-06-19 Kyocera Chemical Corp Thin film adhesive sheet and method for producing the same

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1501366A (en) * 1975-03-06 1978-02-15 Texaco Development Corp Polyether urea epoxy curing agent
AT350181B (en) * 1977-05-04 1979-05-10 Schuller Walter Dr METHOD OF MANUFACTURING A MIXED VACCINE
DE2743015C2 (en) * 1977-09-23 1982-07-15 Lentia GmbH Chem. u. pharm. Erzeugnisse - Industriebedarf, 8000 München Process for curing epoxy resins
US4210704A (en) * 1978-08-04 1980-07-01 Bell Telephone Laboratories, Incorporated Electrical devices employing a conductive epoxy resin formulation as a bonding medium
JPH0699542B2 (en) * 1985-06-03 1994-12-07 チバ−ガイギ− アクチエンゲゼルシヤフト Hardener mixture for epoxy resin and method of use thereof

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2118558A (en) * 1982-04-20 1983-11-02 Dunlop Ltd Adhesive compositions
EP0103432A2 (en) * 1982-09-07 1984-03-21 Texaco Development Corporation Epoxy resin composition
EP0103432A3 (en) * 1982-09-07 1984-05-02 Texaco Development Corporation Epoxy resin composition
EP0109174A1 (en) * 1982-10-15 1984-05-23 Texaco Development Corporation One component water reduced epoxy adhesives
JP2014111694A (en) * 2012-12-05 2014-06-19 Kyocera Chemical Corp Thin film adhesive sheet and method for producing the same

Also Published As

Publication number Publication date
FR2135178B1 (en) 1976-10-29
IT954638B (en) 1973-09-15
DE2221227A1 (en) 1972-11-16
FR2135178A1 (en) 1972-12-15

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Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees