DE69223668T2 - Härtbare Hochleistungszusammensetzungen auf der Basis von Polyphenylenoxyd und Epoxydverbindungen, die Zinnsalze als Kompatibilisierungsmittel enthalten - Google Patents

Härtbare Hochleistungszusammensetzungen auf der Basis von Polyphenylenoxyd und Epoxydverbindungen, die Zinnsalze als Kompatibilisierungsmittel enthalten

Info

Publication number
DE69223668T2
DE69223668T2 DE69223668T DE69223668T DE69223668T2 DE 69223668 T2 DE69223668 T2 DE 69223668T2 DE 69223668 T DE69223668 T DE 69223668T DE 69223668 T DE69223668 T DE 69223668T DE 69223668 T2 DE69223668 T2 DE 69223668T2
Authority
DE
Germany
Prior art keywords
compatibilizers
compounds containing
epoxy compounds
polyphenylene oxide
curable compositions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69223668T
Other languages
English (en)
Other versions
DE69223668D1 (de
Inventor
Rakesh Jain
James Estel Tracy
Kalyan Ghosh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Application granted granted Critical
Publication of DE69223668D1 publication Critical patent/DE69223668D1/de
Publication of DE69223668T2 publication Critical patent/DE69223668T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/121—Metallo-organic compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
DE69223668T 1991-03-29 1992-03-25 Härtbare Hochleistungszusammensetzungen auf der Basis von Polyphenylenoxyd und Epoxydverbindungen, die Zinnsalze als Kompatibilisierungsmittel enthalten Expired - Lifetime DE69223668T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/677,229 US5262491A (en) 1991-03-29 1991-03-29 High performance curable PPO/monomeric epoxy compositions with tin metal salt compatibilizing agent

Publications (2)

Publication Number Publication Date
DE69223668D1 DE69223668D1 (de) 1998-02-05
DE69223668T2 true DE69223668T2 (de) 1998-07-16

Family

ID=24717857

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69223668T Expired - Lifetime DE69223668T2 (de) 1991-03-29 1992-03-25 Härtbare Hochleistungszusammensetzungen auf der Basis von Polyphenylenoxyd und Epoxydverbindungen, die Zinnsalze als Kompatibilisierungsmittel enthalten

Country Status (7)

Country Link
US (1) US5262491A (de)
EP (1) EP0506366B1 (de)
JP (1) JP3308583B2 (de)
KR (1) KR100209387B1 (de)
BR (1) BR9201109A (de)
DE (1) DE69223668T2 (de)
ES (1) ES2111609T3 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6231959B1 (en) 1995-02-27 2001-05-15 Matsushita Electric Works, Ltd. Prepreg of epoxy resin, hardener, and organodialkyurea promotor
US5719891A (en) * 1995-12-18 1998-02-17 Picolight Incorporated Conductive element with lateral oxidation barrier
US6304588B1 (en) * 1997-02-07 2001-10-16 Xerox Corporation Method and structure for eliminating polarization instability in laterally-oxidized VCSELs
US6518362B1 (en) * 1998-02-18 2003-02-11 3M Innovative Properties Company Melt blending polyphenylene ether, polystyrene and curable epoxy
US6576718B1 (en) 1999-10-05 2003-06-10 General Electric Company Powder coating of thermosetting resin(s) and poly(phenylene ethers(s))
US6369145B1 (en) * 1999-11-04 2002-04-09 Rohm And Haas Company Low gloss polyester coating powder compositions
US7257141B2 (en) * 2003-07-23 2007-08-14 Palo Alto Research Center Incorporated Phase array oxide-confined VCSELs
US7101933B2 (en) * 2003-12-10 2006-09-05 Uniplus Electronics Co., Ltd. Process for producing high speed transmitting dielectric material
USRE44893E1 (en) 2004-03-26 2014-05-13 Hanwha Azdel, Inc. Fiber reinforced thermoplastic sheets with surface coverings
US7687556B2 (en) * 2004-09-28 2010-03-30 Isola Usa Corp. Flame retardant compositions
US8129456B2 (en) * 2004-09-28 2012-03-06 Isola Usa Corp. Flame retardant compositions with a phosphorated compound
US20060074151A1 (en) * 2004-09-28 2006-04-06 Polyclad Laminates, Inc. Low expansion dielectric compositions
JPWO2011068092A1 (ja) * 2009-12-01 2013-04-18 ナガセケムテックス株式会社 エポキシ樹脂組成物
US8039560B1 (en) 2010-04-01 2011-10-18 Nan Ya Plastics Corporation Low dielectric brominated resin with a symmetric or saturated heterocyclic alphatic molecular structure and the preparation thereof
EP2762512A1 (de) 2013-02-04 2014-08-06 Siemens Aktiengesellschaft Reaktionsbeschleuniger für eine Copolymerisation, Elektroisolationsband, Elektroisolationskörper und Konsolidierungskörper

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL282514A (de) * 1961-08-28
JPH06104771B2 (ja) * 1986-03-17 1994-12-21 三洋化成工業株式会社 硬化性組成物
US5073605A (en) * 1988-07-14 1991-12-17 General Electric Company Bromine-bisphenol reacted bisphenol and novolak epoxy resins with polyphenylene ether
US4853423A (en) * 1988-07-14 1989-08-01 General Electric Company Curable polyphenylene ether-polyepoxide compositions useful in printed circuit board production
US5043367A (en) * 1988-12-22 1991-08-27 General Electric Company Curable dielectric polyphenylene ether-polyepoxide compositions useful in printed circuit board production
EP0436212A3 (en) * 1990-01-02 1992-07-29 General Electric Company Polyphenylene ether-polyepoxide compositions rapidly curable to flame retardant, solderable materials

Also Published As

Publication number Publication date
BR9201109A (pt) 1992-11-24
JP3308583B2 (ja) 2002-07-29
EP0506366A3 (en) 1993-01-27
EP0506366A2 (de) 1992-09-30
EP0506366B1 (de) 1997-12-29
US5262491A (en) 1993-11-16
KR100209387B1 (ko) 1999-07-15
JPH0597971A (ja) 1993-04-20
KR920018150A (ko) 1992-10-21
DE69223668D1 (de) 1998-02-05
ES2111609T3 (es) 1998-03-16

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition