JPS57102922A - Thermosetting composition - Google Patents

Thermosetting composition

Info

Publication number
JPS57102922A
JPS57102922A JP17845180A JP17845180A JPS57102922A JP S57102922 A JPS57102922 A JP S57102922A JP 17845180 A JP17845180 A JP 17845180A JP 17845180 A JP17845180 A JP 17845180A JP S57102922 A JPS57102922 A JP S57102922A
Authority
JP
Japan
Prior art keywords
acid
organic
organic substance
salt
cationically polymerizable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17845180A
Other languages
Japanese (ja)
Other versions
JPS6312094B2 (en
Inventor
Kazuhiko Morio
Hisashi Murase
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Adeka Corp
Original Assignee
Asahi Denka Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Denka Kogyo KK filed Critical Asahi Denka Kogyo KK
Priority to JP17845180A priority Critical patent/JPS57102922A/en
Publication of JPS57102922A publication Critical patent/JPS57102922A/en
Publication of JPS6312094B2 publication Critical patent/JPS6312094B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PURPOSE: A thermosetting composition designed to have an enhanced cure rate and to form excellent cured products, by mixing a cationically polymerizable organic substance with an onium salt of a non-nucleophilic Lewis acid or a weak acid.
CONSTITUTION: A cationically polymerizable organic substance is mixed with an onium salt of a non-nucleophilic Lewis acid or a weak acid, at least one cure accelerator selected from the group consisting of a t-alcohol ester of a carboxylic acid, an organic peroxide, a thiocarbonyl derivative, an organic polysulfide, an acetylacetone metal salt, an aromatic-substituted vic. diol, a lead salt of an organic peracid, a quinone derivative and iodosobenzene. As the cationically polymerizable organic substance, there is preferably used an acid-polymerizable or acid-curable organic substance, particularly an epoxy resin. The onium salt is represented by[A]+[B]-, wherein A is an organic group-substituted onium structure and B is a non-nucleophilic anion.
COPYRIGHT: (C)1982,JPO&Japio
JP17845180A 1980-12-17 1980-12-17 Thermosetting composition Granted JPS57102922A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17845180A JPS57102922A (en) 1980-12-17 1980-12-17 Thermosetting composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17845180A JPS57102922A (en) 1980-12-17 1980-12-17 Thermosetting composition

Publications (2)

Publication Number Publication Date
JPS57102922A true JPS57102922A (en) 1982-06-26
JPS6312094B2 JPS6312094B2 (en) 1988-03-17

Family

ID=16048742

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17845180A Granted JPS57102922A (en) 1980-12-17 1980-12-17 Thermosetting composition

Country Status (1)

Country Link
JP (1) JPS57102922A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01118564A (en) * 1987-10-30 1989-05-11 Toshiba Chem Corp One-pack epoxy resin composition
JPH03115427A (en) * 1989-07-31 1991-05-16 General Electric Co <Ge> Method of encapsulation, microdevice thereby prepared, and thermosetting composition
JPH08104706A (en) * 1994-09-16 1996-04-23 Rhone Poulenc Chim Initiators for cationic crosslinking of polymer having organic functional group,crosslinkable polyorganosiloxane-based compositions containing them and application of these compositions to antisticking uses
JP2003234017A (en) * 1993-07-29 2003-08-22 Hitachi Chem Co Ltd Circuit connecting material and circuit connecting method using the same
JP2004511641A (en) * 2000-10-14 2004-04-15 ローベルト　ボツシユ　ゲゼルシヤフト　ミツト　ベシユレンクテル　ハフツング Silicone-modified one-component seal compound
JP2007162019A (en) * 1993-07-29 2007-06-28 Hitachi Chem Co Ltd Circuit connecting material and method for connecting circuit using the same
JP2008507620A (en) * 2004-07-26 2008-03-13 ジョージア − パシフィック ケミカルズ エルエルシー Phenolic resin composition containing an etherified curing agent
EP1897913A4 (en) * 2005-06-27 2009-05-13 Toray Finechemicals Co Ltd Curable composition

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4002967A1 (en) * 1989-11-02 1991-05-08 Huebner Gmbh & Co Max SCREW CAP FOR ORIGINALITY SECURING FOR PARTICULAR WIDE NECK CONTAINERS

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01118564A (en) * 1987-10-30 1989-05-11 Toshiba Chem Corp One-pack epoxy resin composition
JPH03115427A (en) * 1989-07-31 1991-05-16 General Electric Co <Ge> Method of encapsulation, microdevice thereby prepared, and thermosetting composition
JP2003234017A (en) * 1993-07-29 2003-08-22 Hitachi Chem Co Ltd Circuit connecting material and circuit connecting method using the same
JP2007162019A (en) * 1993-07-29 2007-06-28 Hitachi Chem Co Ltd Circuit connecting material and method for connecting circuit using the same
JP4539644B2 (en) * 1993-07-29 2010-09-08 日立化成工業株式会社 Circuit connection material and circuit connection method using the connection material
JPH08104706A (en) * 1994-09-16 1996-04-23 Rhone Poulenc Chim Initiators for cationic crosslinking of polymer having organic functional group,crosslinkable polyorganosiloxane-based compositions containing them and application of these compositions to antisticking uses
JP2004511641A (en) * 2000-10-14 2004-04-15 ローベルト　ボツシユ　ゲゼルシヤフト　ミツト　ベシユレンクテル　ハフツング Silicone-modified one-component seal compound
JP2008507620A (en) * 2004-07-26 2008-03-13 ジョージア − パシフィック ケミカルズ エルエルシー Phenolic resin composition containing an etherified curing agent
EP1897913A4 (en) * 2005-06-27 2009-05-13 Toray Finechemicals Co Ltd Curable composition

Also Published As

Publication number Publication date
JPS6312094B2 (en) 1988-03-17

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