ES2152527T3 - Empleo de resinas epoxi modificadas con silicona como masas de sellado. - Google Patents

Empleo de resinas epoxi modificadas con silicona como masas de sellado.

Info

Publication number
ES2152527T3
ES2152527T3 ES96915973T ES96915973T ES2152527T3 ES 2152527 T3 ES2152527 T3 ES 2152527T3 ES 96915973 T ES96915973 T ES 96915973T ES 96915973 T ES96915973 T ES 96915973T ES 2152527 T3 ES2152527 T3 ES 2152527T3
Authority
ES
Spain
Prior art keywords
silicone
epoxy resin
epoxy resins
modified epoxy
enduritible
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES96915973T
Other languages
English (en)
Inventor
Werner Pfander
Irene Jennrich
Richard Spitz
Uwe Kohler
Siegfried Schuler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Application granted granted Critical
Publication of ES2152527T3 publication Critical patent/ES2152527T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/306—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

LA INVENCION TRATA DEL EMPLEO DE UNA MEZCLA DE RESINA EPOXI ENDURECIBLE COMO MASA DE RELLENO PARA COMPONENTES ELECTROTECNICOS O ELECTRONICOS. ESTE COMPUESTO SE CARACTERIZA PORQUE LA MEZCLA CONTIENE UNA RESINA EPOXI SILICONA-MODIFICADA, EN LA QUE LAS FRACCIONES ORGANICAS QUE CONTIENEN GRUPOS EPOXI ESTAN LIGADAS QUIMICAMENTE A LAS FRACCIONES DE SILICONA, Y PORQUE CONTIENE DE UN 40 A UN 75 % EN PESO, REFERIDO ESTE A LA MEZCLA DE RESINA EPOXI ENDURECIBLE, DE UNA SUSTANCIA DE RELLENO MINERAL, OPCIONALMENTE SILANIZADA, QUE REGULA LA CAPACIDAD DE EXPANSION TERMICA. LAS MEZCLAS DE RESINAS EPOXI ENDURECIBLES SON UTILIZADAS DE UN MODO ESPECIALMENTE VENTAJOSO PARA FUNDIR DIODOS.
ES96915973T 1995-06-30 1996-06-05 Empleo de resinas epoxi modificadas con silicona como masas de sellado. Expired - Lifetime ES2152527T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19523897A DE19523897C2 (de) 1995-06-30 1995-06-30 Verwendung von Silicon-modifizierten Epoxidharzen als Vergußmassen für elektrotechnische oder elektronische Bauteile

Publications (1)

Publication Number Publication Date
ES2152527T3 true ES2152527T3 (es) 2001-02-01

Family

ID=7765704

Family Applications (1)

Application Number Title Priority Date Filing Date
ES96915973T Expired - Lifetime ES2152527T3 (es) 1995-06-30 1996-06-05 Empleo de resinas epoxi modificadas con silicona como masas de sellado.

Country Status (8)

Country Link
US (1) US5965637A (es)
EP (1) EP0835287B1 (es)
JP (1) JP4138001B2 (es)
KR (1) KR19990028499A (es)
CN (1) CN1093866C (es)
DE (2) DE19523897C2 (es)
ES (1) ES2152527T3 (es)
WO (1) WO1997002321A1 (es)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19638630B4 (de) * 1996-09-20 2004-11-18 Siemens Ag UV- und thermisch härtbare Gießharzformulierung und ihre Verwendung zum Unterfüllprozeß bei elektrischen und elektronischen Bauelementen
AU767776B2 (en) * 1998-12-09 2003-11-27 Vantico Ag Hydrophobic epoxide resin system
JP2002020586A (ja) * 2000-07-05 2002-01-23 Shin Etsu Chem Co Ltd エポキシ樹脂組成物
DE10051051A1 (de) * 2000-10-14 2002-04-18 Bosch Gmbh Robert Silikonmodifizierte Einkomponentenvergußmasse
DE10057111C1 (de) * 2000-11-16 2002-04-11 Bosch Gmbh Robert Wärmeleitfähige Vergußmasse
JP3685253B2 (ja) * 2001-02-23 2005-08-17 信越化学工業株式会社 シリコーン変性エポキシ樹脂又はシリコーン変性フェノール樹脂を含有する樹脂組成物、並びにこれを用いた半導体装置
DE10144871A1 (de) * 2001-09-12 2003-03-27 Bosch Gmbh Robert Vergußmasse mit hoher thermischer Stabilität
DE10224587A1 (de) * 2002-06-04 2003-12-18 Abb Patent Gmbh Vergußmasse
US6800373B2 (en) * 2002-10-07 2004-10-05 General Electric Company Epoxy resin compositions, solid state devices encapsulated therewith and method
DE502004007114D1 (de) * 2003-09-29 2008-06-26 Bosch Gmbh Robert Härtbares Reaktionsharzsystem
EP1736500A4 (en) * 2004-04-16 2010-03-24 Jsr Corp COMPOSITION FOR SEALING AN OPTICAL SEMICONDUCTOR, OPTICAL SEMICONDUCTOR SEALING MATERIAL, AND PROCESS FOR PRODUCING A COMPOSITION FOR SEALING AN OPTICAL SEMICONDUCTOR
ATE500596T1 (de) * 2007-10-08 2011-03-15 Abb Research Ltd Elektrisches polymerbeton-isolationssystem
WO2009109216A1 (en) * 2008-03-03 2009-09-11 Abb Research Ltd Electrical hollow core insulator
DE102009007392A1 (de) * 2009-01-29 2010-08-05 Siemens Aktiengesellschaft Tränkharzsystem für Isolierstoffe in Schaltanlagen
DE102009008464A1 (de) * 2009-02-10 2010-08-12 Siemens Aktiengesellschaft Gießharzsystem für Isolierstoffe in Schaltanlagen
DE102009003132A1 (de) * 2009-05-15 2010-11-18 Robert Bosch Gmbh Kunststoffformmasse sowie Verfahren zu deren Herstellung
JP5185890B2 (ja) * 2009-06-17 2013-04-17 株式会社日立産機システム 高電圧電気機器用絶縁注型樹脂及びこれを用いた高電圧電気機器
KR101222502B1 (ko) * 2011-01-12 2013-01-29 정우화인 주식회사 충전제 분산과 결합에 유리한 실리콘-에폭시-비닐 수지 및 그의 제조 방법
JP7244177B2 (ja) * 2018-11-12 2023-03-22 株式会社ダイセル 硬化性組成物
DE102019209346A1 (de) * 2019-06-27 2020-12-31 Siemens Aktiengesellschaft Imprägnierformulierung, Isolationsmaterial, Verfahren zum Herstellen eines Isolationsmaterials und elektrische Maschine mit einem Isolationsmaterial
DE102020214020A1 (de) 2020-11-09 2022-05-12 Robert Bosch Gesellschaft mit beschränkter Haftung Positionssensor und Führungswagen mit einem Positionssensor und Verfahren zur Herstellung eines Positionssensors
TWI784356B (zh) * 2020-11-30 2022-11-21 財團法人工業技術研究院 具環氧基之矽氧烷改質樹脂、封裝材料、與封裝結構

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1745545A1 (de) * 1967-12-01 1969-10-02 Vni I P Ki Elektrovozostrojeni Verfahren zur Herstellung von Elektroisolierkoerpern und -ueberzuegen
US3849187A (en) * 1970-03-08 1974-11-19 Dexter Corp Encapsulant compositions for semiconductors
DE3229558C2 (de) * 1982-08-07 1984-11-08 Robert Bosch Gmbh, 7000 Stuttgart Imprägniervergußmasse für elektrische Bauteile
US4560716A (en) * 1983-08-30 1985-12-24 Kabushiki Kaisha Toyota Chuo Kenkyusho Rust preventing epoxy resin compositions
JPS61271319A (ja) * 1985-05-24 1986-12-01 Shin Etsu Chem Co Ltd 半導体封止用エポキシ樹脂組成物
DE3634084A1 (de) * 1986-10-07 1988-04-21 Hanse Chemie Gmbh Modifiziertes reaktionsharz, verfahren zu seiner herstellung und seine verwendung
JPH0617458B2 (ja) * 1987-03-16 1994-03-09 信越化学工業株式会社 エポキシ樹脂組成物
US5120803A (en) * 1988-09-07 1992-06-09 Mitsui Toatsu Chemicals, Inc. Resin compositions for sealing semiconductor
EP0379464B1 (de) * 1989-01-16 1993-02-10 Ciba-Geigy Ag Araliphatische Sulfoniumsalze und deren Verwendung
JPH0362844A (ja) * 1989-02-27 1991-03-18 Shin Etsu Chem Co Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
DE3913488C2 (de) * 1989-04-25 1994-02-03 Bosch Gmbh Robert Vergußmasse für elektrische und elektronische Bauteile
JP3367964B2 (ja) * 1992-04-21 2003-01-20 東レ・ダウコーニング・シリコーン株式会社 硬化性樹脂組成物
JP3359410B2 (ja) * 1994-03-04 2002-12-24 三菱電機株式会社 成形用エポキシ樹脂組成物ならびにそれを用いた高電圧機器用モールド製品およびその製法

Also Published As

Publication number Publication date
DE19523897A1 (de) 1997-01-02
JPH11508928A (ja) 1999-08-03
WO1997002321A1 (de) 1997-01-23
DE59606048D1 (de) 2000-11-30
EP0835287B1 (de) 2000-10-25
EP0835287A1 (de) 1998-04-15
CN1189847A (zh) 1998-08-05
DE19523897C2 (de) 2002-10-24
CN1093866C (zh) 2002-11-06
KR19990028499A (ko) 1999-04-15
US5965637A (en) 1999-10-12
JP4138001B2 (ja) 2008-08-20

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