KR900001782A - 밀봉용 수지 조성물 - Google Patents
밀봉용 수지 조성물 Download PDFInfo
- Publication number
- KR900001782A KR900001782A KR1019890010495A KR890010495A KR900001782A KR 900001782 A KR900001782 A KR 900001782A KR 1019890010495 A KR1019890010495 A KR 1019890010495A KR 890010495 A KR890010495 A KR 890010495A KR 900001782 A KR900001782 A KR 900001782A
- Authority
- KR
- South Korea
- Prior art keywords
- resin composition
- sealing
- polymethylsilsesukioxane
- novolak
- note
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
Claims (1)
- (A)에폭시수지, (B)노보락형 페놀수지, (C)폴리메틸시르세스키옥산 분말 및 (D)무기질 충전제로 이루어진 것을 특징으로 하는 밀봉용 수지 조성물.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP88-186833 | 1988-07-28 | ||
| JP63186833A JP2585384B2 (ja) | 1988-07-28 | 1988-07-28 | 封止用樹脂組成物 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR900001782A true KR900001782A (ko) | 1990-02-27 |
Family
ID=16195422
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019890010495A KR900001782A (ko) | 1988-07-28 | 1989-07-25 | 밀봉용 수지 조성물 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2585384B2 (ko) |
| KR (1) | KR900001782A (ko) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08332925A (ja) * | 1995-06-07 | 1996-12-17 | Nisshin Seiki Kk | 洗車機のブラシ制御装置 |
| JP2006299128A (ja) * | 2005-04-21 | 2006-11-02 | Matsushita Electric Works Ltd | 半導体封止用エポキシ樹脂組成物及びそれを用いた半導体装置 |
| JP5061760B2 (ja) * | 2007-07-06 | 2012-10-31 | 住友ベークライト株式会社 | ダイアタッチペースト及び半導体装置 |
| CN104870543A (zh) * | 2012-12-21 | 2015-08-26 | 3M创新有限公司 | 包含粒子流动助剂的组合物 |
| JP7221079B2 (ja) * | 2019-02-27 | 2023-02-13 | 株式会社東光高岳 | エポキシ樹脂組成物、絶縁性成形体及びその製造方法 |
| JP7192681B2 (ja) * | 2019-07-02 | 2022-12-20 | 味の素株式会社 | 樹脂組成物 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5952893B2 (ja) * | 1979-12-05 | 1984-12-21 | 松下電器産業株式会社 | エポキシ樹脂組成物 |
| JPS6081223A (ja) * | 1983-10-11 | 1985-05-09 | Toyota Central Res & Dev Lab Inc | エポキシ樹脂組成物 |
| JPS60229945A (ja) * | 1984-04-28 | 1985-11-15 | Fujitsu Ltd | エポキシ樹脂系封止材料 |
| JPS61160955A (ja) * | 1985-01-09 | 1986-07-21 | Nitto Electric Ind Co Ltd | 半導体装置 |
-
1988
- 1988-07-28 JP JP63186833A patent/JP2585384B2/ja not_active Expired - Lifetime
-
1989
- 1989-07-25 KR KR1019890010495A patent/KR900001782A/ko not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| JP2585384B2 (ja) | 1997-02-26 |
| JPH0238417A (ja) | 1990-02-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E902 | Notification of reason for refusal | ||
| E601 | Decision to refuse application | ||
| J2X1 | Appeal (before the patent court) |
Free format text: APPEAL AGAINST DECISION TO DECLINE REFUSAL |