KR920000865A - 에폭시 수지 조성물 및 반도체 장치 - Google Patents

에폭시 수지 조성물 및 반도체 장치

Info

Publication number
KR920000865A
KR920000865A KR1019910009949A KR910009949A KR920000865A KR 920000865 A KR920000865 A KR 920000865A KR 1019910009949 A KR1019910009949 A KR 1019910009949A KR 910009949 A KR910009949 A KR 910009949A KR 920000865 A KR920000865 A KR 920000865A
Authority
KR
South Korea
Prior art keywords
epoxy resin
semiconductor devices
resin compositions
molecule
resin composition
Prior art date
Application number
KR1019910009949A
Other languages
English (en)
Other versions
KR100191744B1 (ko
Inventor
도시오 시오바라
다까시 쯔찌야
가즈또시 도미요시
다까유끼 아오끼
Original Assignee
카나가와 치히로
신에쓰 가가꾸 고교 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 카나가와 치히로, 신에쓰 가가꾸 고교 가부시끼가이샤 filed Critical 카나가와 치히로
Publication of KR920000865A publication Critical patent/KR920000865A/ko
Application granted granted Critical
Publication of KR100191744B1 publication Critical patent/KR100191744B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

내용 없음

Description

에폭시 수지 조성물 및 반도체 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 흡습 땜납 후의 내크랙성 시험에서 사용한 SO 팩키지에 크랙이 생긴 상태를 나타내는 단면도.

Claims (3)

  1. (A) 1분자 중에 에폭시기를 2개 이상 갖는 에폭시 수지,
    (B) 1분자 중에 치환되거나 또는 비치환된 나프탈렌 고리를 1개 이상 갖는 페놀 수지,
    (C)무기질 충진제를 함유함을 특징으로 하는 에폭시 수지 조성물.
  2. 제1항에 있어서, (A)성분의 에폭시 수지의 일부 또는 전부가, 치환되거나 또는 비치환된 나프탈렌 고리를 1분자 중에 1개 이상 갖는 에폭시 수지인 수지 조성물.
  3. 제1항 또는 제2항 기재의 에폭시 수지 조성물의 경화물로 밀봉한 반도체 장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019910009949A 1990-06-18 1991-06-17 에폭시 수지 조성물 및 반도체 장치 KR100191744B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2160489A JPH06102714B2 (ja) 1990-06-18 1990-06-18 エポキシ樹脂組成物及び半導体装置
JP2-160489 1990-06-18

Publications (2)

Publication Number Publication Date
KR920000865A true KR920000865A (ko) 1992-01-29
KR100191744B1 KR100191744B1 (ko) 1999-06-15

Family

ID=15716045

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910009949A KR100191744B1 (ko) 1990-06-18 1991-06-17 에폭시 수지 조성물 및 반도체 장치

Country Status (4)

Country Link
US (1) US5162400A (ko)
JP (1) JPH06102714B2 (ko)
KR (1) KR100191744B1 (ko)
DE (1) DE4119552C2 (ko)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0496929A (ja) * 1990-08-14 1992-03-30 Shin Etsu Chem Co Ltd エポキシ樹脂組成物及び半導体装置
JP2970969B2 (ja) * 1992-05-21 1999-11-02 富士通株式会社 エポキシ樹脂組成物
US5334674A (en) * 1991-06-19 1994-08-02 Dai-Ichi Kogyo Seiyaku Co., Ltd. Polyhydroxy aromatic compounds, epoxy resins derived therefrom and epoxy resin compositions
JPH05230170A (ja) * 1991-06-25 1993-09-07 Matsushita Electric Works Ltd エポキシ樹脂組成物
JPH05230187A (ja) * 1991-06-25 1993-09-07 Matsushita Electric Works Ltd 封止用エポキシ樹脂組成物
JPH0597970A (ja) * 1991-10-07 1993-04-20 Shin Etsu Chem Co Ltd 熱硬化性樹脂組成物及び半導体装置
US5346743A (en) * 1992-03-13 1994-09-13 Kabushiki Kaisha Toshiba Resin encapsulation type semiconductor device
US5459223A (en) * 1993-01-22 1995-10-17 Hitachi Chemical Company Method of preparing naphthol-modified phenolic resin
US5827908A (en) * 1994-01-26 1998-10-27 Shin-Etsu Chemical Co., Ltd. Naphthalene and or biphenyl skeleton containing epoxy resin composition
JPH09235451A (ja) * 1996-02-28 1997-09-09 Yuka Shell Epoxy Kk 半導体封止用エポキシ樹脂組成物
TW452944B (en) * 1997-06-03 2001-09-01 Hitachi Chemical Co Ltd Phenolic resin, resin composition, molding material for encapsulation, and electronic component device
US20040075802A1 (en) * 1999-12-14 2004-04-22 Mitsui Chemicals, Inc. Sealant for liquid crystal display cell, composition for liquid crystal display cell sealant and liquid crystal display element
US7943706B2 (en) * 2005-03-24 2011-05-17 Shin-Etsu Chemical Co., Ltd. Semiconductor encapsulating epoxy resin composition and semiconductor device
JP5513840B2 (ja) * 2009-10-22 2014-06-04 電気化学工業株式会社 絶縁シート、回路基板及び絶縁シートの製造方法
US9472480B2 (en) * 2014-05-28 2016-10-18 Cree, Inc. Over-mold packaging for wide band-gap semiconductor devices
US9515011B2 (en) 2014-05-28 2016-12-06 Cree, Inc. Over-mold plastic packaged wide band-gap power transistors and MMICS
US9641163B2 (en) 2014-05-28 2017-05-02 Cree, Inc. Bandwidth limiting methods for GaN power transistors
JP6267261B2 (ja) * 2016-03-30 2018-01-24 旭化成株式会社 熱硬化性樹脂組成物

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2095678B (en) * 1981-03-11 1984-08-01 Coal Industry Patents Ltd Epoxy-cured nfp resin varnish and products prepared therewith
JPS62167318A (ja) * 1986-01-20 1987-07-23 Teijin Ltd エポキシ樹脂の硬化方法
JPS63159419A (ja) * 1986-12-23 1988-07-02 Dainippon Ink & Chem Inc エポキシ樹脂の製造方法
JPH0617440B2 (ja) * 1989-05-30 1994-03-09 新日鐵化学株式会社 新規エポキシ樹脂及びその製造法
JP2732126B2 (ja) * 1989-07-12 1998-03-25 日本化薬株式会社 高耐熱、低吸水性樹脂組成物
JP2732125B2 (ja) * 1989-07-07 1998-03-25 日本化薬株式会社 高耐熱性樹脂組成物
JPH0390075A (ja) * 1989-09-01 1991-04-16 Nippon Steel Chem Co Ltd エポキシ樹脂及びその中間体並びにその製造法
JP3074013B2 (ja) * 1989-11-20 2000-08-07 日本化薬株式会社 エポキシ樹脂組成物及びその硬化物

Also Published As

Publication number Publication date
US5162400A (en) 1992-11-10
DE4119552C2 (de) 1997-05-15
DE4119552A1 (de) 1991-12-19
JPH06102714B2 (ja) 1994-12-14
KR100191744B1 (ko) 1999-06-15
JPH0450223A (ja) 1992-02-19

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