KR920000865A - 에폭시 수지 조성물 및 반도체 장치 - Google Patents
에폭시 수지 조성물 및 반도체 장치Info
- Publication number
- KR920000865A KR920000865A KR1019910009949A KR910009949A KR920000865A KR 920000865 A KR920000865 A KR 920000865A KR 1019910009949 A KR1019910009949 A KR 1019910009949A KR 910009949 A KR910009949 A KR 910009949A KR 920000865 A KR920000865 A KR 920000865A
- Authority
- KR
- South Korea
- Prior art keywords
- epoxy resin
- semiconductor devices
- resin compositions
- molecule
- resin composition
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3218—Carbocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Phenolic Resins Or Amino Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 흡습 땜납 후의 내크랙성 시험에서 사용한 SO 팩키지에 크랙이 생긴 상태를 나타내는 단면도.
Claims (3)
- (A) 1분자 중에 에폭시기를 2개 이상 갖는 에폭시 수지,(B) 1분자 중에 치환되거나 또는 비치환된 나프탈렌 고리를 1개 이상 갖는 페놀 수지,(C)무기질 충진제를 함유함을 특징으로 하는 에폭시 수지 조성물.
- 제1항에 있어서, (A)성분의 에폭시 수지의 일부 또는 전부가, 치환되거나 또는 비치환된 나프탈렌 고리를 1분자 중에 1개 이상 갖는 에폭시 수지인 수지 조성물.
- 제1항 또는 제2항 기재의 에폭시 수지 조성물의 경화물로 밀봉한 반도체 장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2160489A JPH06102714B2 (ja) | 1990-06-18 | 1990-06-18 | エポキシ樹脂組成物及び半導体装置 |
JP2-160489 | 1990-06-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR920000865A true KR920000865A (ko) | 1992-01-29 |
KR100191744B1 KR100191744B1 (ko) | 1999-06-15 |
Family
ID=15716045
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019910009949A KR100191744B1 (ko) | 1990-06-18 | 1991-06-17 | 에폭시 수지 조성물 및 반도체 장치 |
Country Status (4)
Country | Link |
---|---|
US (1) | US5162400A (ko) |
JP (1) | JPH06102714B2 (ko) |
KR (1) | KR100191744B1 (ko) |
DE (1) | DE4119552C2 (ko) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0496929A (ja) * | 1990-08-14 | 1992-03-30 | Shin Etsu Chem Co Ltd | エポキシ樹脂組成物及び半導体装置 |
JP2970969B2 (ja) * | 1992-05-21 | 1999-11-02 | 富士通株式会社 | エポキシ樹脂組成物 |
US5334674A (en) * | 1991-06-19 | 1994-08-02 | Dai-Ichi Kogyo Seiyaku Co., Ltd. | Polyhydroxy aromatic compounds, epoxy resins derived therefrom and epoxy resin compositions |
JPH05230187A (ja) * | 1991-06-25 | 1993-09-07 | Matsushita Electric Works Ltd | 封止用エポキシ樹脂組成物 |
JPH05230170A (ja) * | 1991-06-25 | 1993-09-07 | Matsushita Electric Works Ltd | エポキシ樹脂組成物 |
JPH0597970A (ja) * | 1991-10-07 | 1993-04-20 | Shin Etsu Chem Co Ltd | 熱硬化性樹脂組成物及び半導体装置 |
US5346743A (en) * | 1992-03-13 | 1994-09-13 | Kabushiki Kaisha Toshiba | Resin encapsulation type semiconductor device |
US5459223A (en) * | 1993-01-22 | 1995-10-17 | Hitachi Chemical Company | Method of preparing naphthol-modified phenolic resin |
US5827908A (en) * | 1994-01-26 | 1998-10-27 | Shin-Etsu Chemical Co., Ltd. | Naphthalene and or biphenyl skeleton containing epoxy resin composition |
JPH09235451A (ja) * | 1996-02-28 | 1997-09-09 | Yuka Shell Epoxy Kk | 半導体封止用エポキシ樹脂組成物 |
TW452944B (en) * | 1997-06-03 | 2001-09-01 | Hitachi Chemical Co Ltd | Phenolic resin, resin composition, molding material for encapsulation, and electronic component device |
US20040075802A1 (en) * | 1999-12-14 | 2004-04-22 | Mitsui Chemicals, Inc. | Sealant for liquid crystal display cell, composition for liquid crystal display cell sealant and liquid crystal display element |
US7943706B2 (en) * | 2005-03-24 | 2011-05-17 | Shin-Etsu Chemical Co., Ltd. | Semiconductor encapsulating epoxy resin composition and semiconductor device |
JP5513840B2 (ja) * | 2009-10-22 | 2014-06-04 | 電気化学工業株式会社 | 絶縁シート、回路基板及び絶縁シートの製造方法 |
US9641163B2 (en) | 2014-05-28 | 2017-05-02 | Cree, Inc. | Bandwidth limiting methods for GaN power transistors |
US9515011B2 (en) | 2014-05-28 | 2016-12-06 | Cree, Inc. | Over-mold plastic packaged wide band-gap power transistors and MMICS |
US9472480B2 (en) * | 2014-05-28 | 2016-10-18 | Cree, Inc. | Over-mold packaging for wide band-gap semiconductor devices |
JP6267261B2 (ja) * | 2016-03-30 | 2018-01-24 | 旭化成株式会社 | 熱硬化性樹脂組成物 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2095678B (en) * | 1981-03-11 | 1984-08-01 | Coal Industry Patents Ltd | Epoxy-cured nfp resin varnish and products prepared therewith |
JPS62167318A (ja) * | 1986-01-20 | 1987-07-23 | Teijin Ltd | エポキシ樹脂の硬化方法 |
JPS63159419A (ja) * | 1986-12-23 | 1988-07-02 | Dainippon Ink & Chem Inc | エポキシ樹脂の製造方法 |
JPH0617440B2 (ja) * | 1989-05-30 | 1994-03-09 | 新日鐵化学株式会社 | 新規エポキシ樹脂及びその製造法 |
JP2732126B2 (ja) * | 1989-07-12 | 1998-03-25 | 日本化薬株式会社 | 高耐熱、低吸水性樹脂組成物 |
JP2732125B2 (ja) * | 1989-07-07 | 1998-03-25 | 日本化薬株式会社 | 高耐熱性樹脂組成物 |
JPH0390075A (ja) * | 1989-09-01 | 1991-04-16 | Nippon Steel Chem Co Ltd | エポキシ樹脂及びその中間体並びにその製造法 |
JP3074013B2 (ja) * | 1989-11-20 | 2000-08-07 | 日本化薬株式会社 | エポキシ樹脂組成物及びその硬化物 |
-
1990
- 1990-06-18 JP JP2160489A patent/JPH06102714B2/ja not_active Expired - Lifetime
-
1991
- 1991-06-12 US US07/713,841 patent/US5162400A/en not_active Expired - Lifetime
- 1991-06-13 DE DE4119552A patent/DE4119552C2/de not_active Expired - Fee Related
- 1991-06-17 KR KR1019910009949A patent/KR100191744B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE4119552A1 (de) | 1991-12-19 |
JPH0450223A (ja) | 1992-02-19 |
US5162400A (en) | 1992-11-10 |
KR100191744B1 (ko) | 1999-06-15 |
JPH06102714B2 (ja) | 1994-12-14 |
DE4119552C2 (de) | 1997-05-15 |
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