KR870002646A - 에폭시 수지 조성물 및 그것을 이용한 수지 밀봉형 반도체 장치 - Google Patents

에폭시 수지 조성물 및 그것을 이용한 수지 밀봉형 반도체 장치 Download PDF

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KR870002646A
KR870002646A KR1019860002934A KR860002934A KR870002646A KR 870002646 A KR870002646 A KR 870002646A KR 1019860002934 A KR1019860002934 A KR 1019860002934A KR 860002934 A KR860002934 A KR 860002934A KR 870002646 A KR870002646 A KR 870002646A
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resin
epoxy resin
semiconductor device
composition
sealed semiconductor
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KR1019860002934A
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KR900001392B1 (ko
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히로도시 이께야
미찌야 히가시
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가부시끼 가이샤 도시바
사바 소오이찌
가부시끼가이샤 도시바
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/688—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0041—Optical brightening agents, organic pigments
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/50—Phosphorus bound to carbon only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54406—Marks applied to semiconductor devices or parts comprising alphanumeric information
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H01L2223/54486—Located on package parts, e.g. encapsulation, leads, package substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/23—Sheet including cover or casing
    • Y10T428/239—Complete cover or casing

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  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

내용 없음

Description

에폭시 수지 조성물 및 그것을 이용한 수지 밀봉형 반도체 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 실시예를 나타낸 반도체 장치의 일부를 또다시 잘라낸 것을 나타낸 사시도.
제2도는 본 발명의 실시예에서 특성시험을 하였을때에 이용한 레이저 마 킹 방식을 나타낸 설명도.
* 도면의 주요부분에 대한 부호의 설명
10 : 반도체 장치 11 : 밀봉부
12 : 반도체 소자 13 : 리이드선
21 : 레이저 비임 22 : 마킹할 모양
23 : 마스크 24 : 렌즈
25 : 표면

Claims (12)

  1. 에폭시 수지, 1분자속에 적어도 2개의 페놀성 수산기가 있는 경화제, 유기 포스핀 화합물 및 금속착염 염료로 된 것을 특징으로 하는 에폭시 수지 조성물.
  2. 제1항에 있어서, 에폭시 수지가 에폭시 당량 170-300의 노볼락형 에폭시 수지인 것을 특징으로 하는 에폭시 수지 조성물.
  3. 제1항에 있어서, 1분자 속에 적어도 2개의 페놀성 수산기를 가지고 있는 경화제가 노볼락형 페놀 수지인 것을 특징으로 하는 에폭시 수지 조성물.
  4. 제1항에 있어서, 유기 포스핀 화합물이 조성물 속의 수지 성분 100중량부에 대해서 0.01-5중량부 함유되어 있는 것을 특징으로 하는 에폭시 수지 조성물.
  5. 제1항에 있어서, 금속착염 염료가 조성물 100중량부에 대해서 0.05-10중량부 함유되어 있는 것을 특징으로 하는 에폭시 수지 조성물.
  6. 제1항에 있어서, 전술한 조성물에 또다시 용융 실리카 및/또는 결정성 실리카를 첨가하는 것을 특징으로 하는 에폭시 수지 조성물.
  7. 반도체 소자(12)를 수지(11)로 밀봉한 수지 밀봉형 반도체 장치(10)에 있어서, 전술한 수지의 조성물을에폭시 수지,1분자 속에 적어도 2개의 페놀성 수산기를 가지고 있는 경화제,유기 포스핀 화합물 및 금속착염 염료로 된 에폭시 수지 조성물로 한 것을 특징으로 하는 수지 밀봉형 반도체 장치.
  8. 제7항에 있어서, 에폭시 수지가 에폭시 당량 170-300의 노볼락형 에폭시 수지인 것을 특징으로 하는 수지 밀봉형 반도체 장치.
  9. 제7항에 있어서, 1분자 속에 적어도 2개의 페놀성 수산기를 가지고 있는 경화제가 노볼락형 페놀 수지인 것을 특징으로 하는 수지 밀봉형 반도체 장치.
  10. 제7항에 있어서, 유기포스핀 화합물이 조성물 속의 수지 성분의 100중량비에 대해서 0.01-5중량부 함유되어 있는 것을 특징으로 하는 수지 밀봉형 반도체 장치.
  11. 제7항에 있어서, 금속 착염 염료가 조성물 100중량부에 대해서 0.05-10 중량부 함유되어 있는 것을 특징으로 하는 수지 밀봉형 반도체 장치.
  12. 제7항에 있어서, 전술한 조성물에 또다시 용융 실리카 및/또는 결정성 실리카를 첨가하는 것을 특징으로 하는 수지 밀봉형 반도체 장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019860002934A 1985-08-07 1986-04-16 에폭시 수지 조성물 및 그것을 이용한 수지 밀봉형 반도체 장치 KR900001392B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP60172396A JPS6234920A (ja) 1985-08-07 1985-08-07 エポキシ樹脂組成物およびそれを用いた樹脂封止型半導体装置
JP60-172396 1985-08-07

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KR870002646A true KR870002646A (ko) 1987-04-06
KR900001392B1 KR900001392B1 (ko) 1990-03-09

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US (1) US4719502A (ko)
JP (1) JPS6234920A (ko)
KR (1) KR900001392B1 (ko)

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US4719502A (en) 1988-01-12
JPS6234920A (ja) 1987-02-14
JPS6360543B2 (ko) 1988-11-24
KR900001392B1 (ko) 1990-03-09

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