KR900009849A - 반도체 밀봉용 에폭시 수지 조성물 - Google Patents

반도체 밀봉용 에폭시 수지 조성물

Info

Publication number
KR900009849A
KR900009849A KR1019890018189A KR890018189A KR900009849A KR 900009849 A KR900009849 A KR 900009849A KR 1019890018189 A KR1019890018189 A KR 1019890018189A KR 890018189 A KR890018189 A KR 890018189A KR 900009849 A KR900009849 A KR 900009849A
Authority
KR
South Korea
Prior art keywords
resin composition
epoxy resin
semiconductor sealing
semiconductor
sealing
Prior art date
Application number
KR1019890018189A
Other languages
English (en)
Other versions
KR0144007B1 (ko
Inventor
겐이찌 야나기사와
나오끼 모기
히로노리 오오스가
히로시 시마와끼
Original Assignee
스미또모 배꾸라이또 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP30876988A external-priority patent/JP2675108B2/ja
Priority claimed from JP32763088A external-priority patent/JPH02173033A/ja
Priority claimed from JP32886088A external-priority patent/JP2680389B2/ja
Priority claimed from JP3939289A external-priority patent/JPH02219814A/ja
Priority claimed from JP3939189A external-priority patent/JPH02219816A/ja
Application filed by 스미또모 배꾸라이또 가부시끼가이샤 filed Critical 스미또모 배꾸라이또 가부시끼가이샤
Publication of KR900009849A publication Critical patent/KR900009849A/ko
Application granted granted Critical
Publication of KR0144007B1 publication Critical patent/KR0144007B1/ko

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1019890018189A 1988-12-08 1989-12-08 반도체 밀봉용 에폭시 수지 조성물 KR0144007B1 (ko)

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
JP30876988A JP2675108B2 (ja) 1988-12-08 1988-12-08 エポキシ樹脂組成物
JP63-308769 1988-12-08
JP63-327630 1988-12-27
JP32763088A JPH02173033A (ja) 1988-12-27 1988-12-27 半導体封止用エポキシ樹脂組成物
JP32886088A JP2680389B2 (ja) 1988-12-28 1988-12-28 エポキシ樹脂組成物
JP63-328860 1988-12-28
JP01-039391 1989-02-21
JP3939289A JPH02219814A (ja) 1989-02-21 1989-02-21 エポキシ樹脂組成物
JP3939189A JPH02219816A (ja) 1989-02-21 1989-02-21 エポキシ樹脂組成物
JP01-039392 1989-02-21

Publications (2)

Publication Number Publication Date
KR900009849A true KR900009849A (ko) 1990-07-05
KR0144007B1 KR0144007B1 (ko) 1998-07-15

Family

ID=27522009

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890018189A KR0144007B1 (ko) 1988-12-08 1989-12-08 반도체 밀봉용 에폭시 수지 조성물

Country Status (6)

Country Link
US (1) US5001174A (ko)
EP (1) EP0372983B1 (ko)
KR (1) KR0144007B1 (ko)
DE (1) DE68928583T2 (ko)
MY (1) MY104894A (ko)
SG (1) SG43788A1 (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100471632B1 (ko) * 1996-12-30 2005-10-21 고려화학 주식회사 신규한다관능성페놀수지의제조방법및이를함유하는반도체봉지재용에폭시수지조성물
KR100678345B1 (ko) * 1999-12-02 2007-02-05 신에쓰 가가꾸 고교 가부시끼가이샤 에폭시 수지 조성물 및 예비성형 반도체 패키지

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5008350A (en) * 1987-12-16 1991-04-16 Sumitomo Chemical Company, Limited Glycidyl ethers of phenolic compounds and process for producing the same
US5064881A (en) * 1989-01-18 1991-11-12 Mitsui Petrochemical Industries, Ltd. Epoxy resin composition and semiconductor sealing material comprising same based on spherical silica
US5661223A (en) * 1989-04-25 1997-08-26 Mitsubishi Denki Kabushiki Kaisha Composition of phenolic resin-modified epoxy resin and straight chain polymer
JPH0388818A (ja) * 1989-08-31 1991-04-15 Sumitomo Chem Co Ltd エポキシ樹脂用硬化剤
US5190995A (en) * 1990-01-25 1993-03-02 Shin-Etsu Chemical Co., Ltd. Naphthalene ring containing epoxy resin composition and semiconductor device encapsulated therewith
JPH06102715B2 (ja) * 1990-08-14 1994-12-14 信越化学工業株式会社 エポキシ樹脂組成物及び半導体装置
US5659004A (en) * 1990-08-27 1997-08-19 Fujitsu Limited Epoxy resin composition
US5362775A (en) * 1991-03-27 1994-11-08 Nippondenso Co., Ltd. Epoxy resin composition and cured product thereof
JPH0597970A (ja) * 1991-10-07 1993-04-20 Shin Etsu Chem Co Ltd 熱硬化性樹脂組成物及び半導体装置
US5346743A (en) * 1992-03-13 1994-09-13 Kabushiki Kaisha Toshiba Resin encapsulation type semiconductor device
EP0590463B1 (en) * 1992-09-22 2002-07-10 Sumitomo Chemical Company Limited Halogen containing epoxy resin composition and copper-clad laminate
US5416138A (en) * 1992-09-24 1995-05-16 Sumitomo Bakelite Company Limited Epoxy resin composition
JPH08157561A (ja) * 1994-12-01 1996-06-18 Shin Etsu Chem Co Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
US6534176B2 (en) * 1999-12-10 2003-03-18 Asahi Glass Company, Limited Scaly silica particles and hardenable composition containing them
JP2002275274A (ja) * 2001-03-19 2002-09-25 Dokai Chemical Industries Co Ltd 鱗片状シリカ粒子を含有する高い保存安定性を有する硬化性組成物及びその製造方法
KR101112043B1 (ko) * 2004-12-31 2012-02-13 주식회사 케이씨씨 반도체 소자 봉지용 에폭시 수지 조성물
JP2007231252A (ja) * 2006-01-31 2007-09-13 Shin Etsu Chem Co Ltd 半導体封止用エポキシ樹脂組成物及び該組成物で封止された半導体装置
KR101051865B1 (ko) * 2006-09-14 2011-07-25 파나소닉 전공 주식회사 프린트 배선판용 에폭시 수지 조성물, 수지 조성물 바니시,프리프레그, 금속 피복 적층체, 프린트 배선판 및 다층 프린트 배선판
KR20080047990A (ko) 2006-11-27 2008-05-30 린텍 가부시키가이샤 점접착제 조성물, 점접착 시트 및 반도체 장치의 제조방법
EP2352065A1 (en) * 2008-11-07 2011-08-03 Sumitomo Bakelite Co., Ltd. Photosensitive resin composition, photosensitive adhesive film, and light-receiving device
CN102633990A (zh) * 2012-04-05 2012-08-15 广东生益科技股份有限公司 环氧树脂组合物及使用其制作的半固化片与覆铜箔层压板

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5734122A (en) * 1980-08-11 1982-02-24 Mitsubishi Petrochem Co Ltd Thermosetting resin composition
JPS57141419A (en) * 1981-02-27 1982-09-01 Mitsubishi Petrochem Co Ltd Production of polyepoxide
JPS60210643A (ja) * 1983-11-30 1985-10-23 Denki Kagaku Kogyo Kk 充填剤及びその組成物
US4720515A (en) * 1985-05-17 1988-01-19 Denki Kagaku Kogyo Kabushiki Kaisha Epoxy resin composition for encapsulating semiconductor
JPS61268750A (ja) * 1985-05-22 1986-11-28 Shin Etsu Chem Co Ltd 半導体封止用エポキシ樹脂組成物
JPS6296521A (ja) * 1985-10-23 1987-05-06 Mitsubishi Gas Chem Co Inc エポキシ樹脂組成物
US4722952A (en) * 1986-05-09 1988-02-02 Elkem A/S Resin compositions
JPS62290720A (ja) * 1986-06-11 1987-12-17 Hitachi Chem Co Ltd 電子部品封止用エポキシ樹脂成形材料
US4727119A (en) * 1986-09-15 1988-02-23 The Dow Chemical Company Halogenated epoxy resins
US4816299A (en) * 1987-05-20 1989-03-28 Corning Glass Works Encapsulating compositions containing ultra-pure, fused-silica fillers
JPH01265847A (ja) * 1988-04-18 1989-10-23 Toyo Seikan Kaisha Ltd 牛乳をベースとする缶入り飲料
JPH062801B2 (ja) * 1988-04-28 1994-01-12 住友ベークライト株式会社 半導体封止用エポキシ樹脂組成物
JPH0232115A (ja) * 1988-07-22 1990-02-01 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物
JPH03148664A (ja) * 1989-11-03 1991-06-25 Konica Corp 湿し水不要の感光性平版印刷版用現像液

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100471632B1 (ko) * 1996-12-30 2005-10-21 고려화학 주식회사 신규한다관능성페놀수지의제조방법및이를함유하는반도체봉지재용에폭시수지조성물
KR100678345B1 (ko) * 1999-12-02 2007-02-05 신에쓰 가가꾸 고교 가부시끼가이샤 에폭시 수지 조성물 및 예비성형 반도체 패키지

Also Published As

Publication number Publication date
US5001174A (en) 1991-03-19
KR0144007B1 (ko) 1998-07-15
EP0372983B1 (en) 1998-02-25
EP0372983A2 (en) 1990-06-13
EP0372983A3 (en) 1991-11-27
DE68928583T2 (de) 1998-07-23
MY104894A (en) 1994-06-30
SG43788A1 (en) 1997-11-14
DE68928583D1 (de) 1998-04-02

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