DE69129146D1 - Epoxydharzzusammensetzung - Google Patents
EpoxydharzzusammensetzungInfo
- Publication number
- DE69129146D1 DE69129146D1 DE69129146T DE69129146T DE69129146D1 DE 69129146 D1 DE69129146 D1 DE 69129146D1 DE 69129146 T DE69129146 T DE 69129146T DE 69129146 T DE69129146 T DE 69129146T DE 69129146 D1 DE69129146 D1 DE 69129146D1
- Authority
- DE
- Germany
- Prior art keywords
- resin composition
- epoxy resin
- epoxy
- composition
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C39/00—Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring
- C07C39/205—Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring polycyclic, containing only six-membered aromatic rings as cyclic parts with unsaturation outside the rings
- C07C39/21—Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring polycyclic, containing only six-membered aromatic rings as cyclic parts with unsaturation outside the rings with at least one hydroxy group on a non-condensed ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Phenolic Resins Or Amino Resins (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22240790 | 1990-08-27 | ||
JP3170161A JPH04348121A (ja) | 1990-08-27 | 1991-07-10 | エポキシ樹脂組成物 |
PCT/JP1991/001134 WO1992003489A1 (en) | 1990-08-27 | 1991-08-27 | Epoxy resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69129146D1 true DE69129146D1 (de) | 1998-04-30 |
DE69129146T2 DE69129146T2 (de) | 1998-07-16 |
Family
ID=26493239
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69129146T Expired - Fee Related DE69129146T2 (de) | 1990-08-27 | 1991-08-27 | Epoxydharzzusammensetzung |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0497987B1 (de) |
JP (1) | JPH04348121A (de) |
KR (1) | KR920702380A (de) |
DE (1) | DE69129146T2 (de) |
WO (1) | WO1992003489A1 (de) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5844309A (en) * | 1995-03-20 | 1998-12-01 | Fujitsu Limited | Adhesive composition, semiconductor device using the composition and method for producing a semiconductor device using the composition |
ES2189937T3 (es) * | 1996-10-30 | 2003-07-16 | Vantico Ag | Composiciones reticulables de resina expoxi. |
JP4760066B2 (ja) * | 2005-03-14 | 2011-08-31 | 住友電気工業株式会社 | 異方導電性接着剤 |
JP4581793B2 (ja) * | 2005-03-31 | 2010-11-17 | 住友ベークライト株式会社 | エポキシ樹脂組成物及び半導体装置 |
JP2012017422A (ja) * | 2010-07-08 | 2012-01-26 | Nitto Denko Corp | 熱硬化性樹脂組成物硬化体の製法およびそれにより得られた硬化物 |
JP5364050B2 (ja) * | 2010-07-08 | 2013-12-11 | 日東電工株式会社 | 熱硬化性樹脂組成物硬化体の製法およびそれにより得られた硬化物 |
JP5267958B2 (ja) * | 2011-03-22 | 2013-08-21 | 住友電気工業株式会社 | 接着剤組成物 |
JP2013014709A (ja) * | 2011-07-05 | 2013-01-24 | Nitto Denko Corp | 電子部品封止用エポキシ樹脂組成物およびそれを用いた電子部品装置 |
JPWO2020241594A1 (de) * | 2019-05-30 | 2020-12-03 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB788397A (en) * | 1953-11-03 | 1958-01-02 | Pittsburgh Plate Glass Co | Improvements in the preparation of resinous condensation products of alkenylphenols and aldehydes |
JPS5341399A (en) * | 1976-09-28 | 1978-04-14 | Toshiba Corp | Heat resistant resin composition |
JPS54155297A (en) * | 1978-05-30 | 1979-12-07 | Toshiba Corp | Resin composition |
JPS55145730A (en) * | 1979-05-04 | 1980-11-13 | Toshiba Corp | Curable resin composition |
JPS63291919A (ja) * | 1987-05-25 | 1988-11-29 | Hitachi Ltd | 熱硬化性樹脂組成物 |
JP2646701B2 (ja) * | 1988-09-28 | 1997-08-27 | 三菱化学株式会社 | ポリアルケニルフエノール化合物 |
JPH05341399A (ja) * | 1992-06-12 | 1993-12-24 | Konica Corp | 写真焼付装置 |
-
1991
- 1991-07-10 JP JP3170161A patent/JPH04348121A/ja active Pending
- 1991-08-27 DE DE69129146T patent/DE69129146T2/de not_active Expired - Fee Related
- 1991-08-27 EP EP91914677A patent/EP0497987B1/de not_active Expired - Lifetime
- 1991-08-27 WO PCT/JP1991/001134 patent/WO1992003489A1/ja active IP Right Grant
- 1991-08-27 KR KR1019920700976A patent/KR920702380A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
JPH04348121A (ja) | 1992-12-03 |
DE69129146T2 (de) | 1998-07-16 |
EP0497987A1 (de) | 1992-08-12 |
WO1992003489A1 (en) | 1992-03-05 |
EP0497987A4 (en) | 1993-02-03 |
KR920702380A (ko) | 1992-09-03 |
EP0497987B1 (de) | 1998-03-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |