KR900013007A - 반도체-캡슐화 에폭시 수지 조성물 - Google Patents

반도체-캡슐화 에폭시 수지 조성물

Info

Publication number
KR900013007A
KR900013007A KR1019900001990A KR900001990A KR900013007A KR 900013007 A KR900013007 A KR 900013007A KR 1019900001990 A KR1019900001990 A KR 1019900001990A KR 900001990 A KR900001990 A KR 900001990A KR 900013007 A KR900013007 A KR 900013007A
Authority
KR
South Korea
Prior art keywords
semiconductor
resin composition
epoxy resin
encapsulated epoxy
encapsulated
Prior art date
Application number
KR1019900001990A
Other languages
English (en)
Other versions
KR960012452B1 (ko
Inventor
게이지 가야바
야스시 사와무라
마사유키 다나카
Original Assignee
토레이 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP1041058A external-priority patent/JP2560469B2/ja
Priority claimed from JP1041057A external-priority patent/JPH0730236B2/ja
Application filed by 토레이 가부시키가이샤 filed Critical 토레이 가부시키가이샤
Publication of KR900013007A publication Critical patent/KR900013007A/ko
Application granted granted Critical
Publication of KR960012452B1 publication Critical patent/KR960012452B1/ko

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L91/00—Compositions of oils, fats or waxes; Compositions of derivatives thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1019900001990A 1989-02-20 1990-02-19 반도체-캡슐화 에폭시 수지 조성물 KR960012452B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP1041058A JP2560469B2 (ja) 1989-02-20 1989-02-20 エポキシ系樹脂組成物
JP1041057A JPH0730236B2 (ja) 1989-02-20 1989-02-20 半導体封止用エポキシ樹脂組成物
JP?41058/1989 1989-02-20
JP?41057/1989 1989-02-20

Publications (2)

Publication Number Publication Date
KR900013007A true KR900013007A (ko) 1990-09-03
KR960012452B1 KR960012452B1 (ko) 1996-09-20

Family

ID=26380589

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900001990A KR960012452B1 (ko) 1989-02-20 1990-02-19 반도체-캡슐화 에폭시 수지 조성물

Country Status (3)

Country Link
EP (1) EP0384707B1 (ko)
KR (1) KR960012452B1 (ko)
DE (1) DE69023019T2 (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0501734B1 (en) * 1991-02-26 1997-10-15 Toray Industries, Inc. Epoxy resin composition for encapsulating a semiconductor device
US5294835A (en) * 1992-07-28 1994-03-15 Nitto Denko Corporation Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same
US6214905B1 (en) 1997-12-23 2001-04-10 Cookson Singapore Pte Ltd C/O Alpha Metals, Inc. Epoxy mold compound and method
JP3739600B2 (ja) * 1999-07-06 2006-01-25 太陽インキ製造株式会社 液状熱硬化性樹脂組成物及びそれを用いたプリント配線板の永久穴埋め方法
WO2001010955A1 (fr) * 1999-08-06 2001-02-15 Toray Industries, Inc. Composition de resine epoxy et dispositif a semi-conducteur
US20030201548A1 (en) 2000-09-25 2003-10-30 Ryoichi Ikezawa Epoxy resin molding material for sealing
JP7043225B2 (ja) * 2017-11-08 2022-03-29 株式会社東芝 半導体装置
CN114250050B (zh) * 2021-11-30 2023-05-30 深圳市郎搏万先进材料有限公司 一种环氧树脂组合物及其制备和在igbt半导体封装上的应用

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0651786B2 (ja) * 1985-09-30 1994-07-06 株式会社東芝 半導体装置封止用エポキシ樹脂組成物
JPS6296569A (ja) * 1985-10-24 1987-05-06 Denki Kagaku Kogyo Kk 半導体封止用樹脂組成物
JPS62161865A (ja) * 1986-01-10 1987-07-17 Nitto Electric Ind Co Ltd エポキシ樹脂粉体塗料及びこれによる塗膜が形成された塗装鋼材
JPS63110212A (ja) * 1986-10-27 1988-05-14 Toshiba Chem Corp 封止用樹脂組成物
JPH0791446B2 (ja) * 1987-03-31 1995-10-04 株式会社東芝 樹脂封止半導体装置
JPH06104712B2 (ja) * 1987-04-08 1994-12-21 東レ株式会社 半導体封止用樹脂組成物
JP2503067B2 (ja) * 1989-02-20 1996-06-05 東レ株式会社 エポキシ組成物
JP2843612B2 (ja) * 1989-09-21 1999-01-06 東レ・ダウコーニング・シリコーン株式会社 エポキシ樹脂組成物

Also Published As

Publication number Publication date
EP0384707A2 (en) 1990-08-29
EP0384707A3 (en) 1992-01-08
DE69023019D1 (de) 1995-11-23
KR960012452B1 (ko) 1996-09-20
DE69023019T2 (de) 1996-04-18
EP0384707B1 (en) 1995-10-18

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