DE69022340D1 - Epoxydharzzusammensetzung. - Google Patents
Epoxydharzzusammensetzung.Info
- Publication number
- DE69022340D1 DE69022340D1 DE69022340T DE69022340T DE69022340D1 DE 69022340 D1 DE69022340 D1 DE 69022340D1 DE 69022340 T DE69022340 T DE 69022340T DE 69022340 T DE69022340 T DE 69022340T DE 69022340 D1 DE69022340 D1 DE 69022340D1
- Authority
- DE
- Germany
- Prior art keywords
- resin composition
- epoxy resin
- epoxy
- composition
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/544—Silicon-containing compounds containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/549—Silicon-containing compounds containing silicon in a ring
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1246203A JP2843612B2 (ja) | 1989-09-21 | 1989-09-21 | エポキシ樹脂組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69022340D1 true DE69022340D1 (de) | 1995-10-19 |
DE69022340T2 DE69022340T2 (de) | 1996-03-07 |
Family
ID=17145051
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69022340T Expired - Fee Related DE69022340T2 (de) | 1989-09-21 | 1990-09-20 | Epoxydharzzusammensetzung. |
Country Status (5)
Country | Link |
---|---|
US (1) | US5075357A (de) |
EP (1) | EP0418888B1 (de) |
JP (1) | JP2843612B2 (de) |
CA (1) | CA2025707A1 (de) |
DE (1) | DE69022340T2 (de) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR960012452B1 (ko) * | 1989-02-20 | 1996-09-20 | 토레이 가부시키가이샤 | 반도체-캡슐화 에폭시 수지 조성물 |
GB9019513D0 (en) * | 1990-09-06 | 1990-10-24 | Shell Int Research | Reinforced thermoplastic composites |
US5413379A (en) * | 1993-09-16 | 1995-05-09 | Honda Giken Kogyo Kabushiki Kaisha | Knee bolster structure |
JP3349963B2 (ja) * | 1998-10-21 | 2002-11-25 | 日本電気株式会社 | 難燃性エポキシ樹脂組成物及びそれを用いた半導体装置 |
JP2008305395A (ja) * | 2008-05-15 | 2008-12-18 | Psa Corp Ltd | 自動車両誘導システムの磁気センサ |
JP2015182978A (ja) * | 2014-03-25 | 2015-10-22 | 信越化学工業株式会社 | 有機ケイ素化合物及び接着性組成物並びに物品 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL111961C (de) * | 1957-10-21 | |||
US4282136A (en) * | 1979-04-09 | 1981-08-04 | Hunt Earl R | Flame retardant epoxy molding compound method and encapsulated device |
JPS59124923A (ja) * | 1982-12-29 | 1984-07-19 | Shin Etsu Chem Co Ltd | エポキシ樹脂組成物 |
US4929665A (en) * | 1987-01-20 | 1990-05-29 | Dainippon Ink And Chemicals, Inc. | Thermoplastic resin composition |
JPH0791446B2 (ja) * | 1987-03-31 | 1995-10-04 | 株式会社東芝 | 樹脂封止半導体装置 |
-
1989
- 1989-09-21 JP JP1246203A patent/JP2843612B2/ja not_active Expired - Fee Related
-
1990
- 1990-09-17 US US07/583,903 patent/US5075357A/en not_active Expired - Fee Related
- 1990-09-19 CA CA002025707A patent/CA2025707A1/en not_active Abandoned
- 1990-09-20 DE DE69022340T patent/DE69022340T2/de not_active Expired - Fee Related
- 1990-09-20 EP EP90118120A patent/EP0418888B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP2843612B2 (ja) | 1999-01-06 |
CA2025707A1 (en) | 1991-03-22 |
EP0418888B1 (de) | 1995-09-13 |
EP0418888A3 (en) | 1992-01-15 |
DE69022340T2 (de) | 1996-03-07 |
JPH03109417A (ja) | 1991-05-09 |
EP0418888A2 (de) | 1991-03-27 |
US5075357A (en) | 1991-12-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE3889950D1 (de) | Epoxyharzzusammensetzung. | |
DE68920092D1 (de) | Harzzusammensetzung. | |
DE3850373D1 (de) | Flexibilisierte Epoxidharzzusammensetzungen. | |
DE69119662D1 (de) | Epoxydharzzusammensetzung | |
DE69006422D1 (de) | Epoxyharzmasse. | |
DE68919151T2 (de) | Harzzusammensetzung. | |
DE68911340T2 (de) | Harzzusammensetzung. | |
DE3788620D1 (de) | Epoxydharzzusammensetzung. | |
DE68918544T2 (de) | Harzzusammensetzung. | |
DE68924798T2 (de) | Harzzusammensetzung. | |
DE3886587T2 (de) | Epoxyharzzusammensetzung. | |
DE68920062D1 (de) | Wärmehärtbare Epoxydharzzusammensetzung. | |
DE68920086T2 (de) | Hitzehärtbare Epoxidharz-Zusammensetzung. | |
DE68922986D1 (de) | Harzzusammensetzung. | |
DE68924531D1 (de) | Warmhärtende Kunstharzzusammensetzung. | |
DE68911597D1 (de) | Harzzusammensetzung. | |
DE69129146D1 (de) | Epoxydharzzusammensetzung | |
DE68920694T2 (de) | Epoxydharzzusammensetzung. | |
KR900013007A (ko) | 반도체-캡슐화 에폭시 수지 조성물 | |
DE3788677D1 (de) | Epoxyharz-Zusammensetzung. | |
DE58908253D1 (de) | Harzzusammensetzungen. | |
DE69022340D1 (de) | Epoxydharzzusammensetzung. | |
DE68905225D1 (de) | Polyimiaharzzusammensetzung. | |
DE3856311D1 (de) | Epoxydharzzusammensetzung | |
DE69121780D1 (de) | Epoxydharzzusammensetzung |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |