DE3886587D1 - Epoxyharzzusammensetzung. - Google Patents

Epoxyharzzusammensetzung.

Info

Publication number
DE3886587D1
DE3886587D1 DE88108718T DE3886587T DE3886587D1 DE 3886587 D1 DE3886587 D1 DE 3886587D1 DE 88108718 T DE88108718 T DE 88108718T DE 3886587 T DE3886587 T DE 3886587T DE 3886587 D1 DE3886587 D1 DE 3886587D1
Authority
DE
Germany
Prior art keywords
resin composition
epoxy resin
epoxy
composition
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE88108718T
Other languages
English (en)
Other versions
DE3886587T2 (de
Inventor
Kunio Itoh
Toshio Shiobara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Publication of DE3886587D1 publication Critical patent/DE3886587D1/de
Application granted granted Critical
Publication of DE3886587T2 publication Critical patent/DE3886587T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
    • C08G8/28—Chemically modified polycondensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S525/00—Synthetic resins or natural rubbers -- part of the class 520 series
    • Y10S525/922—Polyepoxide polymer having been reacted to yield terminal ethylenic unsaturation
DE3886587T 1987-06-03 1988-05-31 Epoxyharzzusammensetzung. Expired - Fee Related DE3886587T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62139447A JPH0618985B2 (ja) 1987-06-03 1987-06-03 エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
DE3886587D1 true DE3886587D1 (de) 1994-02-10
DE3886587T2 DE3886587T2 (de) 1994-07-21

Family

ID=15245417

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3886587T Expired - Fee Related DE3886587T2 (de) 1987-06-03 1988-05-31 Epoxyharzzusammensetzung.

Country Status (5)

Country Link
US (1) US4876298A (de)
EP (1) EP0293843B1 (de)
JP (1) JPH0618985B2 (de)
KR (1) KR930003510B1 (de)
DE (1) DE3886587T2 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0781098B2 (ja) * 1986-12-05 1995-08-30 ソマール株式会社 熱硬化性エポキシ樹脂粉体塗料
JP2643518B2 (ja) * 1989-02-10 1997-08-20 東レ株式会社 プリプレグ
JP2787326B2 (ja) * 1989-03-03 1998-08-13 関西ペイント株式会社 硬化性組成物
US5260376A (en) * 1989-03-03 1993-11-09 Kansai Paint Company, Limited Resin composition, curable composition and coating composition
JPH03157448A (ja) * 1989-11-15 1991-07-05 Mitsubishi Electric Corp 半導体封止用エポキシ樹脂組成物
US5827907A (en) * 1993-08-30 1998-10-27 Ibm Corporation Homo-, co- or multicomponent thermoplastic polymer dispersed in a thermoset resin
JP3478669B2 (ja) * 1995-06-13 2003-12-15 キヤノン株式会社 溶剤易溶性のフッ素含有エポキシ樹脂組成物およびそれを用いた表面処理方法
JP3489369B2 (ja) * 1997-01-31 2004-01-19 松下電器産業株式会社 ゴキブリ忌避剤含有電子部品材料を用いた電子部品
FR2867183B1 (fr) * 2004-03-04 2007-09-14 Cit Alcatel Revetement de fibre de faible indice de refraction
KR101128969B1 (ko) * 2007-05-23 2012-03-27 디아이씨 가부시끼가이샤 함불소 노볼락형 수지, 불소계 계면활성제, 불소계 계면활성제 조성물 및 수지 조성물
WO2011140402A2 (en) 2010-05-05 2011-11-10 Tyco Electronics Services Gmbh Potting for electronic components
JP6583669B2 (ja) * 2015-08-03 2019-10-02 パナソニックＩｐマネジメント株式会社 Ｌｅｄモジュール

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL280258A (de) * 1961-09-07
JPS6056171B2 (ja) * 1980-03-17 1985-12-09 信越化学工業株式会社 エポキシ樹脂組成物
JPS56163120A (en) * 1980-05-21 1981-12-15 Hitachi Ltd Epoxy resin composition
JPS5821417A (ja) * 1981-07-29 1983-02-08 Shin Etsu Chem Co Ltd 硬化性エポキシ樹脂組成物
JPS59149921A (ja) * 1983-02-16 1984-08-28 Nippon Telegr & Teleph Corp <Ntt> フイ−ドスル−用樹脂封止材
US4720515A (en) * 1985-05-17 1988-01-19 Denki Kagaku Kogyo Kabushiki Kaisha Epoxy resin composition for encapsulating semiconductor
JPS61287967A (ja) * 1985-06-14 1986-12-18 Asahi Glass Co Ltd 樹脂付着防止剤
JPS6241218A (ja) * 1985-08-19 1987-02-23 Mitsubishi Electric Corp 半導体封止用エポキシ樹脂組成物
JPS62101625A (ja) * 1985-10-29 1987-05-12 Mitsubishi Electric Corp 半導体封止用エポキシ樹脂組成物
JPS62106922A (ja) * 1985-11-06 1987-05-18 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物
JPH072888B2 (ja) * 1986-05-27 1995-01-18 旭硝子株式会社 エポキシ樹脂組成物
JPS6357632A (ja) * 1986-08-29 1988-03-12 Hitachi Ltd エポキシ樹脂組成物、半導体装置用封止剤及び積層板用材料
IT1199770B (it) * 1986-12-16 1988-12-30 Ausimont Spa Resine epossidiche ottenute mediante coreticolazione di prepolimeri epossidici fluorurati e prepolimeri epossidici non fluorurati
JPS63183917A (ja) * 1987-01-26 1988-07-29 Denki Kagaku Kogyo Kk エポキシ樹脂組成物

Also Published As

Publication number Publication date
EP0293843B1 (de) 1993-12-29
KR890000586A (ko) 1989-03-15
JPS63304021A (ja) 1988-12-12
KR930003510B1 (ko) 1993-05-01
JPH0618985B2 (ja) 1994-03-16
US4876298A (en) 1989-10-24
EP0293843A2 (de) 1988-12-07
EP0293843A3 (en) 1989-09-20
DE3886587T2 (de) 1994-07-21

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee