DE3689022T2 - Epoxyharzzusammensetzung. - Google Patents

Epoxyharzzusammensetzung.

Info

Publication number
DE3689022T2
DE3689022T2 DE86113812T DE3689022T DE3689022T2 DE 3689022 T2 DE3689022 T2 DE 3689022T2 DE 86113812 T DE86113812 T DE 86113812T DE 3689022 T DE3689022 T DE 3689022T DE 3689022 T2 DE3689022 T2 DE 3689022T2
Authority
DE
Germany
Prior art keywords
resin composition
epoxy resin
epoxy
composition
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE86113812T
Other languages
English (en)
Other versions
DE3689022D1 (de
Inventor
Kunio Shin-Etsu Chemical Itoh
Toshio Shin-Etsu Chem Shiobara
Koji Shin-Etsu Che Futatsumori
Kazutoshi Shin-Etsu Tomiyoshi
Hisashi Shin-Etsu Chem Shimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP22421185A external-priority patent/JPS62116654A/ja
Priority claimed from JP22421085A external-priority patent/JPS6284147A/ja
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Application granted granted Critical
Publication of DE3689022D1 publication Critical patent/DE3689022D1/de
Publication of DE3689022T2 publication Critical patent/DE3689022T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/027—Polycondensates containing more than one epoxy group per molecule obtained by epoxidation of unsaturated precursor, e.g. polymer or monomer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
DE86113812T 1985-10-07 1986-10-06 Epoxyharzzusammensetzung. Expired - Lifetime DE3689022T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP22421185A JPS62116654A (ja) 1985-10-07 1985-10-07 エポキシ樹脂組成物
JP22421085A JPS6284147A (ja) 1985-10-07 1985-10-07 エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
DE3689022D1 DE3689022D1 (de) 1993-10-21
DE3689022T2 true DE3689022T2 (de) 1994-04-21

Family

ID=26525916

Family Applications (2)

Application Number Title Priority Date Filing Date
DE86113812T Expired - Lifetime DE3689022T2 (de) 1985-10-07 1986-10-06 Epoxyharzzusammensetzung.
DE4006450A Withdrawn DE4006450A1 (de) 1985-10-07 1990-03-01 Polyimidharzmassen und damit eingekapselte halbleiterbauelemente

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE4006450A Withdrawn DE4006450A1 (de) 1985-10-07 1990-03-01 Polyimidharzmassen und damit eingekapselte halbleiterbauelemente

Country Status (3)

Country Link
US (2) US4877822A (de)
EP (1) EP0218228B1 (de)
DE (2) DE3689022T2 (de)

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0218228B1 (de) * 1985-10-07 1993-09-15 Shin-Etsu Chemical Co., Ltd. Epoxyharzzusammensetzung
EP0308812A3 (de) * 1987-09-24 1989-04-26 BASF Aktiengesellschaft Zähe Bismaleimidharzsysteme
US4954580A (en) * 1987-12-01 1990-09-04 Ciba-Geigy Corporation Epoxysiloxanes
US5157061A (en) * 1988-04-05 1992-10-20 Mitsubishi Denki Kabushiki Kaisha Epoxy resin containing an epoxy resin-modified silicone oil flexibilizer
US5235005A (en) * 1988-07-05 1993-08-10 Shin-Etsu Chemical Co., Ltd. Polyimide resin composition and semiconductor device encapsulated therewith
JPH0627180B2 (ja) * 1988-07-05 1994-04-13 信越化学工業株式会社 エポキシ樹脂組成物及び半導体装置
DE68928275T2 (de) * 1988-11-25 1998-01-15 Kanegafuchi Chemical Ind Härtbare Zweikomponentenzusammensetzung, enthaltend Epoxidharz und ein Silizium umfassendes elastomerisches Polymer
US5041358A (en) * 1989-04-17 1991-08-20 International Business Machines Corporation Negative photoresist and use thereof
JPH062797B2 (ja) * 1989-05-17 1994-01-12 信越化学工業株式会社 エポキシ樹脂組成物
US5034445A (en) * 1989-05-26 1991-07-23 Genesee Polymers Corporation Stabilized polysiloxane fluids and a process for making same
US5034446A (en) * 1989-05-26 1991-07-23 Genesee Polymers Corporation Stabilized polysiloxane fluids and a process for making the same
US5102960A (en) * 1989-09-11 1992-04-07 Bayer Aktiengesellschaft Silicon-epoxy resin composition
US5206312A (en) * 1989-11-20 1993-04-27 The Dow Chemical Company Aromatic hydroxyl-containing compounds containing organosiloxane moieties, epoxy compounds and cured products thereof
KR950009152B1 (ko) * 1990-01-25 1995-08-16 신에쓰 가가꾸 고오교 가부시끼가이샤 에폭시 수지 조성물 및 반도체 장치
JPH04300914A (ja) * 1991-03-29 1992-10-23 Shin Etsu Chem Co Ltd エポキシ樹脂組成物及び半導体装置
JP2526747B2 (ja) * 1991-05-21 1996-08-21 信越化学工業株式会社 エポキシ樹脂組成物及び半導体装置
JP2570002B2 (ja) * 1991-05-29 1997-01-08 信越化学工業株式会社 フリップチップ用封止材及び半導体装置
EP0630943B1 (de) * 1993-06-21 1998-01-28 Nippon Paint Co., Ltd. Härtbare Harzzusammensetzung
JP3147677B2 (ja) * 1994-09-30 2001-03-19 株式会社村田製作所 液状エポキシ樹脂組成物
DE19724025A1 (de) * 1997-06-06 1998-12-10 Siemens Ag Drucksensor-Bauelement und Verfahren zur Herstellung
DE19724026A1 (de) * 1997-06-06 1998-12-10 Siemens Ag Drucksensor-Bauelement und Verfahren zur Herstellung
DE69922577T2 (de) * 1998-05-07 2005-12-01 Shin-Etsu Chemical Co., Ltd. Epoxydharzzusammensetzungen und damit eingekapselte Halbleiteranordnungen
US6376923B1 (en) 1999-06-08 2002-04-23 Shin-Etsu Chemical Co., Ltd. Flip-chip type semiconductor device sealing material and flip-chip type semiconductor device
US6376100B1 (en) 1999-06-09 2002-04-23 Shin Etsu-Chemical Co., Ltd. Flip-chip type semiconductor device underfill material and flip-chip type semiconductor device
US6429238B1 (en) 1999-06-10 2002-08-06 Shin-Etsu Chemical Co., Ltd. Flip-chip type semiconductor device sealing material and flip-chip type semiconductor device
US6323263B1 (en) 1999-11-11 2001-11-27 Shin-Etsu Chemical Co., Ltd. Semiconductor sealing liquid epoxy resin compositions
US6733902B2 (en) * 2001-08-16 2004-05-11 Shin-Etsu Chemical Co., Ltd. Liquid epoxy resin composition and semiconductor device
US7501473B2 (en) 2003-07-16 2009-03-10 Dow Corning Corporation Aminofunctional silicone resins and emulsions containing them
US20060205861A1 (en) * 2003-07-16 2006-09-14 Glenn Gordon Coating compositions comprising epoxy resins and aminofunctional silicone resins
PL1651704T3 (pl) * 2003-07-16 2012-01-31 Dow Corning Kompozycje powłokowe zawierające żywice silikonowe z aminowymi grupami funkcyjnymi
EP1519389A1 (de) * 2003-09-18 2005-03-30 Rohm And Haas Company Elektrisch isolerende Pulverbeschichtungen und Zusammensetzungen und Verfahren zu deren Herstellung
US7858697B2 (en) * 2003-10-10 2010-12-28 Dow Corning Corporation Carbinol functional silicone resins
CN100556929C (zh) * 2003-10-10 2009-11-04 陶氏康宁公司 含有醇官能的有机硅树脂的聚氨酯组合物
CN101048464B (zh) * 2004-10-25 2011-04-20 陶氏康宁公司 含有醇官能的有机硅树脂或者酸酐官能的有机硅树脂的涂料组合物
US7807012B2 (en) * 2004-10-25 2010-10-05 Dow Corning Corporation Moldable compositions containing carbinol functional silicone resins or anhydride functional silicone resins
CN1962802A (zh) * 2005-11-07 2007-05-16 信越化学工业株式会社 半导体密封用环氧树脂组合物及半导体装置
JP5306592B2 (ja) 2006-12-04 2013-10-02 東レ・ダウコーニング株式会社 硬化性エポキシ樹脂組成物、硬化物、およびその用途
JP5547369B2 (ja) * 2007-09-28 2014-07-09 東レ・ダウコーニング株式会社 硬化性液状エポキシ樹脂組成物およびその硬化物
JP6260475B2 (ja) * 2013-08-20 2018-01-17 信越化学工業株式会社 オルガノシロキサン変性ノボラック樹脂及びその製造方法
US9513550B2 (en) 2013-08-20 2016-12-06 Shin-Etsu Chemical Co., Ltd. Positive resist composition and pattern forming process
JP6300744B2 (ja) * 2015-02-27 2018-03-28 信越化学工業株式会社 半導体封止用樹脂組成物及び半導体装置
JP6613901B2 (ja) 2016-01-07 2019-12-04 信越化学工業株式会社 エポキシ変性シリコーン樹脂及びその製造方法、硬化性組成物及び電子部品
JP2019085534A (ja) * 2017-11-10 2019-06-06 信越化学工業株式会社 シリコーン変性エポキシ樹脂組成物及び半導体装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB906544A (de) *
NL96555C (de) * 1954-04-30
US2819245A (en) * 1955-03-07 1958-01-07 Dow Corning Siloxane-epoxide resin reaction products
US4125510A (en) * 1977-03-01 1978-11-14 Dow Corning Corporation Method of improving crack resistance of siloxane molding compositions
JPS6056171B2 (ja) * 1980-03-17 1985-12-09 信越化学工業株式会社 エポキシ樹脂組成物
JPS5821417A (ja) * 1981-07-29 1983-02-08 Shin Etsu Chem Co Ltd 硬化性エポキシ樹脂組成物
JPS59129252A (ja) * 1983-01-14 1984-07-25 Matsushita Electric Works Ltd エポキシ樹脂成形材料
JPS60115619A (ja) * 1983-11-28 1985-06-22 Toray Silicone Co Ltd 熱硬化性エポキシ樹脂組成物
CA1235245A (en) * 1984-12-26 1988-04-12 Toshifumi Hirose Curable resinous composition comprising epoxy resin and silicon-containing elastomeric polymer
JPS61271319A (ja) * 1985-05-24 1986-12-01 Shin Etsu Chem Co Ltd 半導体封止用エポキシ樹脂組成物
US4614766A (en) * 1985-09-27 1986-09-30 Ppg Industries, Inc. Compositions containing resins having air-oxidizable groups and epoxy groups and epoxy-reactive silicon-containing compounds having hydrolyzable groups
EP0218228B1 (de) * 1985-10-07 1993-09-15 Shin-Etsu Chemical Co., Ltd. Epoxyharzzusammensetzung

Also Published As

Publication number Publication date
EP0218228B1 (de) 1993-09-15
US5053445A (en) 1991-10-01
EP0218228A3 (en) 1989-05-24
EP0218228A2 (de) 1987-04-15
DE4006450A1 (de) 1991-09-05
DE3689022D1 (de) 1993-10-21
US4877822A (en) 1989-10-31

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Legal Events

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