DE3687998T2 - Wärmehärtbare Harzzusammensetzung. - Google Patents

Wärmehärtbare Harzzusammensetzung.

Info

Publication number
DE3687998T2
DE3687998T2 DE86302136T DE3687998T DE3687998T2 DE 3687998 T2 DE3687998 T2 DE 3687998T2 DE 86302136 T DE86302136 T DE 86302136T DE 3687998 T DE3687998 T DE 3687998T DE 3687998 T2 DE3687998 T2 DE 3687998T2
Authority
DE
Germany
Prior art keywords
resin composition
thermosetting resin
thermosetting
composition
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE86302136T
Other languages
English (en)
Other versions
DE3687998D1 (de
Inventor
Yoshitsugu Morita
Akihiko Shirahata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
Original Assignee
Toray Silicone Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Silicone Co Ltd filed Critical Toray Silicone Co Ltd
Publication of DE3687998D1 publication Critical patent/DE3687998D1/de
Application granted granted Critical
Publication of DE3687998T2 publication Critical patent/DE3687998T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L87/00—Compositions of unspecified macromolecular compounds, obtained otherwise than by polymerisation reactions only involving unsaturated carbon-to-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
DE86302136T 1985-03-29 1986-03-24 Wärmehärtbare Harzzusammensetzung. Expired - Fee Related DE3687998T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60067947A JPS61225253A (ja) 1985-03-29 1985-03-29 熱硬化性樹脂組成物

Publications (2)

Publication Number Publication Date
DE3687998D1 DE3687998D1 (de) 1993-04-22
DE3687998T2 true DE3687998T2 (de) 1993-10-07

Family

ID=13359647

Family Applications (1)

Application Number Title Priority Date Filing Date
DE86302136T Expired - Fee Related DE3687998T2 (de) 1985-03-29 1986-03-24 Wärmehärtbare Harzzusammensetzung.

Country Status (5)

Country Link
US (1) US4663397A (de)
EP (1) EP0201176B1 (de)
JP (1) JPS61225253A (de)
KR (1) KR930012219B1 (de)
DE (1) DE3687998T2 (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4849469A (en) * 1985-02-28 1989-07-18 Ici Americas Inc. Void control in thermoplastics containing silicone interpenetrating polymer networks
JPS62232460A (ja) * 1986-04-01 1987-10-12 Toray Silicone Co Ltd 熱硬化性樹脂組成物
JPS62257939A (ja) * 1986-05-02 1987-11-10 Shin Etsu Chem Co Ltd シリコ−ンエラストマ−球状微粉末の製造方法
JPS62270617A (ja) * 1986-05-20 1987-11-25 Mitsui Toatsu Chem Inc 半導体封止用樹脂組成物
US5166050A (en) * 1986-08-20 1992-11-24 Bristol-Myers Squibb Company Monoclonal antibodies and peptides useful in treating and diagnosing HIV infections
JPS63183958A (ja) * 1986-09-04 1988-07-29 Toray Silicone Co Ltd 熱硬化性樹脂組成物
JPS6451467A (en) * 1987-08-21 1989-02-27 Toray Silicone Co Curable resin composition
CA1311328C (en) * 1987-08-26 1992-12-08 Koji Shimizu Finely divided silicone rubber additive material and method for producing same
JPH0674332B2 (ja) * 1987-08-27 1994-09-21 東レ・ダウコーニング・シリコーン株式会社 シリコ−ンゴム粒状物およびその製造方法
JP2656785B2 (ja) * 1988-02-24 1997-09-24 日東電工株式会社 光デイスク
JP2643518B2 (ja) * 1989-02-10 1997-08-20 東レ株式会社 プリプレグ
DE69223384T2 (de) * 1991-11-18 1998-06-25 Dow Corning Mit Silikonkautschukpulver modifizierte Polyphenylenetherharze
JP3367964B2 (ja) * 1992-04-21 2003-01-20 東レ・ダウコーニング・シリコーン株式会社 硬化性樹脂組成物
US5508323A (en) * 1992-06-29 1996-04-16 Dow Corning Corporation Method for imparting fire retardancy to organic resins
US5391594A (en) * 1992-06-29 1995-02-21 Dow Corning Corporation Method for imparting fire retardancy to organic resins
US5412014A (en) * 1992-06-29 1995-05-02 Dow Corning Corporation Fire retardant resin compositions
JP3464527B2 (ja) * 1994-05-27 2003-11-10 東レ・ダウコーニング・シリコーン株式会社 硬化性樹脂組成物および硬化樹脂
JPH1025417A (ja) * 1996-07-08 1998-01-27 Toray Dow Corning Silicone Co Ltd 硬化性液状組成物、その硬化物、および電子部品
US7295999B1 (en) 2000-12-20 2007-11-13 Jpmorgan Chase Bank, N.A. System and method for determining eligibility and enrolling members in various programs
WO2005017995A1 (en) 2003-08-08 2005-02-24 Dow Corning Corporation Process for fabricating electronic components using liquid injection molding
WO2006041645A2 (en) * 2004-10-08 2006-04-20 Dow Corning Corporation Lithography processes using phase change compositions
US8541487B2 (en) 2008-08-04 2013-09-24 Ranee Spradlin Materials, methods and compositions for a composite building material
TWI466554B (zh) * 2010-03-23 2014-12-21 Acer Inc 感知無線電之多通道媒體接取控制方法
JP5794207B2 (ja) * 2012-06-07 2015-10-14 信越化学工業株式会社 付加硬化型シリコーンエマルジョン組成物及び剥離フィルム
CN112079992B (zh) * 2020-09-23 2022-07-05 四川大学 耐烧蚀有机硅/环氧树脂基碳纤维复合材料及其制备方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5225409B2 (de) * 1971-08-09 1977-07-07
JPS5241774B2 (de) * 1974-05-21 1977-10-20
JPS5214643A (en) * 1975-07-24 1977-02-03 Shin Etsu Chem Co Ltd Fillers for use in synthetic resins
JPS5236534A (en) * 1975-09-18 1977-03-19 Nat Res Inst Metals Arc welding process for controlling molten pond by gaseous jet stream
US4087478A (en) * 1976-04-14 1978-05-02 Dow Corning Corporation Siloxane copolymers and thread finisher prepared therewith
JPS5314643A (en) * 1976-07-27 1978-02-09 Tonan Tankou Kk Forging die containing knockinggout unit
GB1604414A (en) * 1977-07-27 1981-12-09 Raychem Ltd Silicone resin
JPS58196040A (ja) * 1982-05-10 1983-11-15 Mitsubishi Electric Corp 半導体素子用封止樹脂
JPS58219218A (ja) * 1982-06-15 1983-12-20 Toray Silicone Co Ltd 熱硬化性エポキシ樹脂組成物
JPS5996122A (ja) * 1982-11-22 1984-06-02 Toray Silicone Co Ltd 熱硬化性エポキシ樹脂組成物
JPS60115619A (ja) * 1983-11-28 1985-06-22 Toray Silicone Co Ltd 熱硬化性エポキシ樹脂組成物
US4537829A (en) * 1984-09-20 1985-08-27 Dow Corning Corporation Curable silicone compositions comprising resins
JPS61159754A (ja) * 1984-12-29 1986-07-19 Toshiba Silicone Co Ltd 樹脂封止型半導体装置

Also Published As

Publication number Publication date
JPS61225253A (ja) 1986-10-07
EP0201176B1 (de) 1993-03-17
KR860007330A (ko) 1986-10-10
US4663397A (en) 1987-05-05
DE3687998D1 (de) 1993-04-22
EP0201176A3 (en) 1988-09-28
JPH0511147B2 (de) 1993-02-12
KR930012219B1 (ko) 1993-12-24
EP0201176A2 (de) 1986-11-12

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee