DE3481064D1 - Epoxydharzzusammensetzung. - Google Patents

Epoxydharzzusammensetzung.

Info

Publication number
DE3481064D1
DE3481064D1 DE8484112269T DE3481064T DE3481064D1 DE 3481064 D1 DE3481064 D1 DE 3481064D1 DE 8484112269 T DE8484112269 T DE 8484112269T DE 3481064 T DE3481064 T DE 3481064T DE 3481064 D1 DE3481064 D1 DE 3481064D1
Authority
DE
Germany
Prior art keywords
resin composition
epoxy resin
epoxy
composition
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8484112269T
Other languages
English (en)
Inventor
Isamu Tanaka
Hiroshi Kikuchi
Akira Tomizawa
Hitoshi Oka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP58190756A external-priority patent/JPS6082673A/ja
Priority claimed from JP14424084A external-priority patent/JPS6123666A/ja
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of DE3481064D1 publication Critical patent/DE3481064D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/224—Anti-weld compositions; Braze stop-off compositions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1605—Process or apparatus coating on selected surface areas by masking
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0166—Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
DE8484112269T 1983-10-14 1984-10-12 Epoxydharzzusammensetzung. Expired - Lifetime DE3481064D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP58190756A JPS6082673A (ja) 1983-10-14 1983-10-14 耐めつき性ソルダレジストインク組成物
JP14424084A JPS6123666A (ja) 1984-07-13 1984-07-13 耐めつきソルダレジストインク組成物

Publications (1)

Publication Number Publication Date
DE3481064D1 true DE3481064D1 (de) 1990-02-22

Family

ID=26475718

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8484112269T Expired - Lifetime DE3481064D1 (de) 1983-10-14 1984-10-12 Epoxydharzzusammensetzung.

Country Status (4)

Country Link
US (1) US4555532A (de)
EP (1) EP0138209B1 (de)
KR (1) KR860001555B1 (de)
DE (1) DE3481064D1 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3564957D1 (en) * 1984-06-23 1988-10-20 Shikoku Chem Epoxy resin composition
JPS61210076A (ja) * 1985-03-14 1986-09-18 Shikoku Chem Corp 新規な２−置換−４，６−ジアミノ−ｓ−トリアジン・イソシアヌル酸付加物、該付加物の合成方法及び該付加物を用いるポリエポキシ樹脂の硬化方法
DE3588111T2 (de) * 1985-06-29 1996-10-31 Asahi Chem Res Lab Kunststoffzusammensetzung für Lötschutztinte
JPH06103783B2 (ja) * 1987-03-16 1994-12-14 日本シイエムケイ株式会社 プリント配線板のソルダーレジスト用印刷インク
CA1326096C (en) * 1988-08-19 1994-01-11 Katugi Kitagawa Epoxy resin powder coating composition with excellent adhesibility
JPH07119273B2 (ja) 1990-05-30 1995-12-20 ソマール株式会社 エポキシ樹脂組成物の製造方法
GB2259916A (en) * 1991-09-27 1993-03-31 Coates Brothers Plc Solder-resist, heat-curable compositions
US5585421A (en) * 1994-03-31 1996-12-17 Somar Corporation Composition dispensable at high speed for bonding electric parts to printed wiring boards
SG71684A1 (en) * 1995-10-23 2000-04-18 Ibiden Co Ltd Multilayer printed circuit board method of producing multilayer printed circut board and resin filler
ATE239012T1 (de) * 1997-12-12 2003-05-15 Abbott Lab Triazin angiogenese-inhibitoren
US6150362A (en) * 1997-12-12 2000-11-21 Henkin; Jack Triazine angiogenesis inhibitors
EP2053908B1 (de) * 1999-08-12 2011-12-21 Ibiden Co., Ltd. Mehrschichtdruckleiterplatte mit Lötstoppresistzusammensetzung
KR100623607B1 (ko) * 1999-12-31 2006-09-12 주식회사 케이씨씨 무용제형 에폭시 중후막형 바닥재 피막조성물
JP4510066B2 (ja) 2007-11-06 2010-07-21 日東電工株式会社 配線回路基板の製造方法および検査方法
EP3035122B1 (de) 2014-12-16 2019-03-20 ATOTECH Deutschland GmbH Verfahren zur Feinleiterherstellung
KR101927631B1 (ko) * 2017-07-27 2018-12-10 주식회사 케이씨씨 에폭시 수지 조성물 및 이를 포함하는 반도체 장치

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3923571A (en) * 1970-12-27 1975-12-02 Nissan Motor Method of using an epoxy-resin-imidazole solder mixture
JPS5137200B2 (de) * 1973-06-06 1976-10-14
JPS5135519B2 (de) * 1973-07-18 1976-10-02
US4205156A (en) * 1977-03-18 1980-05-27 Shikoku Chemicals Corporation Novel imidazole-isocyanuric acid adducts and utilization thereof
JPS53127540A (en) * 1977-04-13 1978-11-07 Hitachi Ltd Adhesive composition
JPS55165916A (en) * 1979-06-11 1980-12-24 Shikoku Chem Corp Epoxy resin composition
US4273686A (en) * 1979-08-30 1981-06-16 American Cyanamid Company Epoxy based synthetic solder
JPS5952893B2 (ja) * 1979-12-05 1984-12-21 松下電器産業株式会社 エポキシ樹脂組成物
JPS5822061B2 (ja) * 1980-04-09 1983-05-06 四国化成工業株式会社 燃料フィルタ−用接着剤
JPS57164118A (en) * 1981-04-03 1982-10-08 Daicel Chem Ind Ltd Epoxy resin composition
JPS57195117A (en) * 1981-05-27 1982-11-30 Sumitomo Bakelite Co Ltd Epoxy resin composition and its preparation
JPS58147416A (ja) * 1982-02-26 1983-09-02 Hitachi Ltd エポキシ樹脂組成物
JPS58225121A (ja) * 1982-06-23 1983-12-27 Sanyurejin Kk エポキシ樹脂組成物及びそれを用いる電子部品の封止方法

Also Published As

Publication number Publication date
EP0138209A3 (en) 1986-09-17
EP0138209A2 (de) 1985-04-24
US4555532A (en) 1985-11-26
KR860001555B1 (ko) 1986-10-04
EP0138209B1 (de) 1990-01-17
KR850003153A (ko) 1985-06-13

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Legal Events

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