DE3480600D1 - Harzzusammensetzung. - Google Patents

Harzzusammensetzung.

Info

Publication number
DE3480600D1
DE3480600D1 DE8484111291T DE3480600T DE3480600D1 DE 3480600 D1 DE3480600 D1 DE 3480600D1 DE 8484111291 T DE8484111291 T DE 8484111291T DE 3480600 T DE3480600 T DE 3480600T DE 3480600 D1 DE3480600 D1 DE 3480600D1
Authority
DE
Germany
Prior art keywords
resin composition
resin
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8484111291T
Other languages
English (en)
Inventor
Shuichi C O Kabushiki K Suzuki
Moriyasu C O Kabushiki Ka Wada
Shuzi C O Kabushiki Kais Hyasa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Application granted granted Critical
Publication of DE3480600D1 publication Critical patent/DE3480600D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/075Silicon-containing compounds
    • G03F7/0755Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62Alcohols or phenols
    • C08G59/625Hydroxyacids
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62Alcohols or phenols
    • C08G59/625Hydroxyacids
    • C08G59/626Lactones
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/50Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/46Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes silicones

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Polyethers (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Silicon Polymers (AREA)
DE8484111291T 1983-09-22 1984-09-21 Harzzusammensetzung. Expired - Lifetime DE3480600D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58174162A JPS6067531A (ja) 1983-09-22 1983-09-22 樹脂組成物

Publications (1)

Publication Number Publication Date
DE3480600D1 true DE3480600D1 (de) 1990-01-04

Family

ID=15973777

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8484111291T Expired - Lifetime DE3480600D1 (de) 1983-09-22 1984-09-21 Harzzusammensetzung.

Country Status (4)

Country Link
US (1) US4599155A (de)
EP (1) EP0139234B1 (de)
JP (1) JPS6067531A (de)
DE (1) DE3480600D1 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4822716A (en) * 1985-12-27 1989-04-18 Kabushiki Kaisha Toshiba Polysilanes, Polysiloxanes and silicone resist materials containing these compounds
US4738899A (en) * 1986-07-08 1988-04-19 Claire Bluestein Transparent abrasion-resistant flexible polymeric coating
CA1296124C (en) * 1986-11-06 1992-02-18 Shinji Nakano Paint resin
US4954534A (en) * 1987-07-23 1990-09-04 Ricoh Company, Ltd. Photodecomposing organosilicon compounds and photopolymerizable epoxy resin compositions containing the organosilicon compounds
JPH02173647A (ja) * 1988-12-27 1990-07-05 Hitachi Ltd パタン形成材料及びそれを用いたパタン形成方法
US5118559A (en) * 1989-05-31 1992-06-02 Minnesota Mining And Manufacturing Company Fluorescent degree of cure monitors
US5047444A (en) * 1989-05-31 1991-09-10 Minnesota Mining And Manufacturing Company Fluorescent degree of cure monitors
US5182316A (en) * 1989-05-31 1993-01-26 Minnesota Mining And Manufacturing Company Fluorescent degree of cure monitors
EP0467561B1 (de) * 1990-07-05 1995-10-18 Kabushiki Kaisha Toshiba Lichtempfindliche Harzzusammensetzung zum Herstellen eines Polyimidfilmmusters
DE4125201C1 (de) * 1991-07-30 1992-10-01 Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung Ev, 8000 Muenchen, De
DE4133494C2 (de) * 1991-10-09 1996-03-28 Fraunhofer Ges Forschung Dentalharzmasse, Verfahren zu deren Herstellung und deren Verwendung
DE19619046A1 (de) * 1996-05-02 1997-11-06 Ivoclar Ag Verwendung einer Zusammensetzung als Dentalmaterial und Dentalmaterial
US6124076A (en) 1998-07-01 2000-09-26 Lucent Technologies Inc. Material exhibiting compensation for polymerization-induced shrinkage and recording medium formed therefrom
JP5707662B2 (ja) * 2008-01-25 2015-04-30 デクセリアルズ株式会社 熱硬化型エポキシ樹脂組成物
JP6144667B2 (ja) 2014-12-25 2017-06-07 トヨタ自動車株式会社 摺動部材およびその製造方法
WO2017081963A1 (ja) * 2015-11-10 2017-05-18 株式会社ダイセル 表面処理キット並びに複合成形体及びその製造方法
JP2017089494A (ja) * 2015-11-10 2017-05-25 株式会社ダイセル 自動車部品及びその製造方法
JP2018176516A (ja) * 2017-04-11 2018-11-15 株式会社ダイセル 積層体並びに複合成形体及びその製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4387215A (en) * 1973-03-30 1983-06-07 Bailey William J Polycyclic ring-opened polymers
US4066747A (en) * 1976-04-08 1978-01-03 Alza Corporation Polymeric orthoesters housing beneficial drug for controlled release therefrom
CH652731A5 (en) * 1979-06-21 1985-11-29 Tokyo Shibaura Electric Co Epoxy resin-based compositions
US4335367A (en) * 1979-08-17 1982-06-15 Tokyo Shibaura Denki Kabushiki Kaisha Electrically insulated coil
JPS6030337B2 (ja) * 1979-09-27 1985-07-16 株式会社日立製作所 熱硬化性樹脂組成物
JPS5672007A (en) * 1979-11-15 1981-06-16 Toagosei Chem Ind Co Ltd Polymerizable composition
US4368314A (en) * 1980-08-29 1983-01-11 Toagoesi Chemical Industry Co., Ltd. Curable composition comprising spiro-orthoester compound
US4434103A (en) * 1981-09-18 1984-02-28 General Electric Company Substituted silicon-oxygen-aluminum oligomers and preparation thereof
JPS5857428A (ja) * 1981-09-30 1983-04-05 Toshiba Corp 光重合組成物
JPS58174418A (ja) * 1982-04-07 1983-10-13 Toshiba Corp 光重合組成物
JPS5918725A (ja) * 1982-07-22 1984-01-31 Toshiba Corp 低収縮性熱硬化性樹脂組成物
JPS5949227A (ja) * 1982-09-14 1984-03-21 Toshiba Corp 光重合組成物

Also Published As

Publication number Publication date
JPS6067531A (ja) 1985-04-17
US4599155A (en) 1986-07-08
JPH0563488B2 (de) 1993-09-10
EP0139234A2 (de) 1985-05-02
EP0139234A3 (en) 1986-10-01
EP0139234B1 (de) 1989-11-29

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee