DE69115074D1 - Epoxyharzzusammensetzungen zum Einkapseln von Halbleiterelementen. - Google Patents

Epoxyharzzusammensetzungen zum Einkapseln von Halbleiterelementen.

Info

Publication number
DE69115074D1
DE69115074D1 DE69115074T DE69115074T DE69115074D1 DE 69115074 D1 DE69115074 D1 DE 69115074D1 DE 69115074 T DE69115074 T DE 69115074T DE 69115074 T DE69115074 T DE 69115074T DE 69115074 D1 DE69115074 D1 DE 69115074D1
Authority
DE
Germany
Prior art keywords
epoxy resin
semiconductor elements
resin compositions
encapsulating semiconductor
encapsulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69115074T
Other languages
English (en)
Other versions
DE69115074T2 (de
Inventor
Yasukuki Murata
Isako Konishi
Yoshinoi Nakanishi
Takuya Kurio
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shell Internationale Research Maatschappij BV
Original Assignee
Shell Internationale Research Maatschappij BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shell Internationale Research Maatschappij BV filed Critical Shell Internationale Research Maatschappij BV
Application granted granted Critical
Publication of DE69115074D1 publication Critical patent/DE69115074D1/de
Publication of DE69115074T2 publication Critical patent/DE69115074T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/688—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
DE69115074T 1990-02-16 1991-02-08 Epoxyharzzusammensetzungen zum Einkapseln von Halbleiterelementen. Expired - Fee Related DE69115074T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2033704A JP2767310B2 (ja) 1990-02-16 1990-02-16 半導体封止用エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
DE69115074D1 true DE69115074D1 (de) 1996-01-18
DE69115074T2 DE69115074T2 (de) 1996-08-29

Family

ID=12393809

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69115074T Expired - Fee Related DE69115074T2 (de) 1990-02-16 1991-02-08 Epoxyharzzusammensetzungen zum Einkapseln von Halbleiterelementen.

Country Status (9)

Country Link
US (1) US5089543A (de)
EP (1) EP0442568B1 (de)
JP (1) JP2767310B2 (de)
KR (1) KR910015651A (de)
CA (1) CA2036414A1 (de)
DE (1) DE69115074T2 (de)
ES (1) ES2080232T3 (de)
MY (1) MY104619A (de)
TW (1) TW213936B (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5362775A (en) * 1991-03-27 1994-11-08 Nippondenso Co., Ltd. Epoxy resin composition and cured product thereof
JP2576726B2 (ja) * 1991-08-29 1997-01-29 信越化学工業株式会社 エポキシ樹脂組成物
JP2626377B2 (ja) * 1991-11-05 1997-07-02 信越化学工業株式会社 エポキシ樹脂組成物及び半導体装置
JPH06199990A (ja) * 1992-11-10 1994-07-19 Sumitomo Chem Co Ltd エポキシ樹脂組成物および樹脂封止型半導体装置
JP2847632B2 (ja) * 1996-02-23 1999-01-20 旭チバ株式会社 耐熱性に優れたエポキシ樹脂の硬化方法およびエポキシ樹脂硬化物
KR100359904B1 (ko) * 2000-09-04 2002-11-07 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물
US6417322B1 (en) * 2000-09-25 2002-07-09 Essilor International Compagnie General D'optique Episulfide based polymerizable composition catalyzed by an (alkoxyphenyl)phosphine, articles made therefrom and process for making same
DE10051051A1 (de) * 2000-10-14 2002-04-18 Bosch Gmbh Robert Silikonmodifizierte Einkomponentenvergußmasse
TWI314153B (en) * 2002-07-12 2009-09-01 Mitsui Chemicals Inc Process for production of oxyalkylene derivative
US8206819B2 (en) * 2010-01-27 2012-06-26 Iteq Corporation Varnish, prepreg, and substrate thereof
JP6221382B2 (ja) * 2013-06-14 2017-11-01 日立化成株式会社 エポキシ樹脂組成物及び電子部品装置
MY181374A (en) * 2014-12-04 2020-12-21 Mitsubishi Chem Corp Tetramethylbiphenol type epoxy resin, epoxy resin composition, cured product, and semiconductor sealing material
JP2020143238A (ja) * 2019-03-07 2020-09-10 味の素株式会社 樹脂組成物

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4105634A (en) * 1976-08-11 1978-08-08 Celanese Corporation Production of thermosetting resinous polyepoxides
EP0041662B1 (de) * 1980-06-05 1984-04-11 Kabushiki Kaisha Toshiba Kunstharzeingekapseltes Halbleiterbauelement
JPH0320326A (ja) * 1989-06-16 1991-01-29 Mitsubishi Electric Corp 半導体封止用エポキシ樹脂組成物

Also Published As

Publication number Publication date
US5089543A (en) 1992-02-18
JP2767310B2 (ja) 1998-06-18
MY104619A (en) 1994-04-30
JPH03239718A (ja) 1991-10-25
TW213936B (de) 1993-10-01
DE69115074T2 (de) 1996-08-29
EP0442568A3 (en) 1992-11-25
CA2036414A1 (en) 1991-08-17
EP0442568B1 (de) 1995-12-06
ES2080232T3 (es) 1996-02-01
KR910015651A (ko) 1991-09-30
EP0442568A2 (de) 1991-08-21

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Legal Events

Date Code Title Description
8332 No legal effect for de
8370 Indication of lapse of patent is to be deleted
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee