SG115443A1 - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
SG115443A1
SG115443A1 SG200200341A SG200200341A SG115443A1 SG 115443 A1 SG115443 A1 SG 115443A1 SG 200200341 A SG200200341 A SG 200200341A SG 200200341 A SG200200341 A SG 200200341A SG 115443 A1 SG115443 A1 SG 115443A1
Authority
SG
Singapore
Prior art keywords
resin composition
epoxy resin
epoxy
composition
resin
Prior art date
Application number
SG200200341A
Inventor
Tat Hong Tan
Mogi Naoki
Original Assignee
Sumitomo Bakelite Singapore Pt
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Singapore Pt filed Critical Sumitomo Bakelite Singapore Pt
Priority to SG200200341A priority Critical patent/SG115443A1/en
Publication of SG115443A1 publication Critical patent/SG115443A1/en

Links

SG200200341A 2002-01-19 2002-01-19 Epoxy resin composition SG115443A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SG200200341A SG115443A1 (en) 2002-01-19 2002-01-19 Epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200200341A SG115443A1 (en) 2002-01-19 2002-01-19 Epoxy resin composition

Publications (1)

Publication Number Publication Date
SG115443A1 true SG115443A1 (en) 2005-10-28

Family

ID=35453602

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200200341A SG115443A1 (en) 2002-01-19 2002-01-19 Epoxy resin composition

Country Status (1)

Country Link
SG (1) SG115443A1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4719502A (en) * 1985-08-07 1988-01-12 Kabushiki Kaisha Toshiba Epoxy resin composition, and resin-sealed semiconductor device in which this composition is used
JPH11302503A (en) * 1998-04-17 1999-11-02 Toshiba Chem Corp Epoxy resin composition and device for sealing semiconductor
JP2001019832A (en) * 1999-07-06 2001-01-23 Nitto Denko Corp Epoxy resin composition for semiconductor sealing and semiconductor device sealed therewith
JP2001226565A (en) * 2000-12-25 2001-08-21 Nitto Denko Corp Semiconductor device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4719502A (en) * 1985-08-07 1988-01-12 Kabushiki Kaisha Toshiba Epoxy resin composition, and resin-sealed semiconductor device in which this composition is used
JPH11302503A (en) * 1998-04-17 1999-11-02 Toshiba Chem Corp Epoxy resin composition and device for sealing semiconductor
JP2001019832A (en) * 1999-07-06 2001-01-23 Nitto Denko Corp Epoxy resin composition for semiconductor sealing and semiconductor device sealed therewith
JP2001226565A (en) * 2000-12-25 2001-08-21 Nitto Denko Corp Semiconductor device

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