SG115443A1 - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- SG115443A1 SG115443A1 SG200200341A SG200200341A SG115443A1 SG 115443 A1 SG115443 A1 SG 115443A1 SG 200200341 A SG200200341 A SG 200200341A SG 200200341 A SG200200341 A SG 200200341A SG 115443 A1 SG115443 A1 SG 115443A1
- Authority
- SG
- Singapore
- Prior art keywords
- resin composition
- epoxy resin
- epoxy
- composition
- resin
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG200200341A SG115443A1 (en) | 2002-01-19 | 2002-01-19 | Epoxy resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG200200341A SG115443A1 (en) | 2002-01-19 | 2002-01-19 | Epoxy resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
SG115443A1 true SG115443A1 (en) | 2005-10-28 |
Family
ID=35453602
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200200341A SG115443A1 (en) | 2002-01-19 | 2002-01-19 | Epoxy resin composition |
Country Status (1)
Country | Link |
---|---|
SG (1) | SG115443A1 (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4719502A (en) * | 1985-08-07 | 1988-01-12 | Kabushiki Kaisha Toshiba | Epoxy resin composition, and resin-sealed semiconductor device in which this composition is used |
JPH11302503A (en) * | 1998-04-17 | 1999-11-02 | Toshiba Chem Corp | Epoxy resin composition and device for sealing semiconductor |
JP2001019832A (en) * | 1999-07-06 | 2001-01-23 | Nitto Denko Corp | Epoxy resin composition for semiconductor sealing and semiconductor device sealed therewith |
JP2001226565A (en) * | 2000-12-25 | 2001-08-21 | Nitto Denko Corp | Semiconductor device |
-
2002
- 2002-01-19 SG SG200200341A patent/SG115443A1/en unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4719502A (en) * | 1985-08-07 | 1988-01-12 | Kabushiki Kaisha Toshiba | Epoxy resin composition, and resin-sealed semiconductor device in which this composition is used |
JPH11302503A (en) * | 1998-04-17 | 1999-11-02 | Toshiba Chem Corp | Epoxy resin composition and device for sealing semiconductor |
JP2001019832A (en) * | 1999-07-06 | 2001-01-23 | Nitto Denko Corp | Epoxy resin composition for semiconductor sealing and semiconductor device sealed therewith |
JP2001226565A (en) * | 2000-12-25 | 2001-08-21 | Nitto Denko Corp | Semiconductor device |
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