KR910003775A - 반도체장치의 땜납 도포방법 - Google Patents

반도체장치의 땜납 도포방법 Download PDF

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Publication number
KR910003775A
KR910003775A KR1019900010746A KR900010746A KR910003775A KR 910003775 A KR910003775 A KR 910003775A KR 1019900010746 A KR1019900010746 A KR 1019900010746A KR 900010746 A KR900010746 A KR 900010746A KR 910003775 A KR910003775 A KR 910003775A
Authority
KR
South Korea
Prior art keywords
semiconductor device
coating method
solder coating
solder
granular
Prior art date
Application number
KR1019900010746A
Other languages
English (en)
Inventor
마사미치 신도
Original Assignee
아오이 죠이치
가부시키가이샤 도시바
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아오이 죠이치, 가부시키가이샤 도시바 filed Critical 아오이 죠이치
Publication of KR910003775A publication Critical patent/KR910003775A/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof

Abstract

내용 없음.

Description

반도체장치의 땜납 도포방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 따른 반도체장치의 땜납 도포방법에 의해 도포되는 반도체칩 수지밀봉완료 리드프레임 몸체를 나타낸 도면이다.

Claims (1)

  1. 표면에 플럭스가 코팅된 다수의 입상땜납(粒狀땜납)을 형성하고, 그 입상 땜납을 정전도포법(靜電塗布法)에 의해 반도체장치의 금속부에 도포하는 것을 특징으로 하는 반도체장치의 땜납 도포방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019900010746A 1989-07-19 1990-07-16 반도체장치의 땜납 도포방법 KR910003775A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1-186635 1989-07-19
JP1186635A JPH0760881B2 (ja) 1989-07-19 1989-07-19 半導体装置の半田塗布方法

Publications (1)

Publication Number Publication Date
KR910003775A true KR910003775A (ko) 1991-02-28

Family

ID=16192035

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900010746A KR910003775A (ko) 1989-07-19 1990-07-16 반도체장치의 땜납 도포방법

Country Status (2)

Country Link
JP (1) JPH0760881B2 (ko)
KR (1) KR910003775A (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2592757B2 (ja) * 1992-10-30 1997-03-19 昭和電工株式会社 はんだ回路基板及びその形成方法
US5556023A (en) * 1992-10-30 1996-09-17 Showa Denko K.K. Method of forming solder film
US5529682A (en) * 1995-06-26 1996-06-25 Motorola, Inc. Method for making semiconductor devices having electroplated leads
KR970064335A (ko) * 1996-02-01 1997-09-12 빈센트 비. 인그라시아 프린트된 와이어링 보드 단자상에 전도층을 형성하는 방법 및 장치
JP4450578B2 (ja) * 2003-07-30 2010-04-14 東海東洋アルミ販売株式会社 接合方法及び接合装置

Also Published As

Publication number Publication date
JPH0350853A (ja) 1991-03-05
JPH0760881B2 (ja) 1995-06-28

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