KR920018907A - 반도체 리드 프레임 - Google Patents

반도체 리드 프레임 Download PDF

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Publication number
KR920018907A
KR920018907A KR1019910004605A KR910004605A KR920018907A KR 920018907 A KR920018907 A KR 920018907A KR 1019910004605 A KR1019910004605 A KR 1019910004605A KR 910004605 A KR910004605 A KR 910004605A KR 920018907 A KR920018907 A KR 920018907A
Authority
KR
South Korea
Prior art keywords
protected
leads
length
semiconductor
semiconductor leadframe
Prior art date
Application number
KR1019910004605A
Other languages
English (en)
Inventor
오선주
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019910004605A priority Critical patent/KR920018907A/ko
Priority to GB9115389A priority patent/GB2254186A/en
Priority to CN91105645A priority patent/CN1065351A/zh
Priority to DE4124269A priority patent/DE4124269A1/de
Publication of KR920018907A publication Critical patent/KR920018907A/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

내용 없음

Description

반도체 리드 프레임
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제2도는 (가),(나)는 이 발명에 따른 반도체 리드프레임의 요부를 나타낸 평면도 및 변형상태를 나타낸 도면이다.

Claims (1)

  1. 다이패드와 리드들로 이루어져 반도체 칩이 집착되는 반도체 리드프레임에 있어서, 상기 다이패드(11)가 패키지의 조립공정중에 발생되는 물리적 간섭으로 부터 보호되도록 다이패드(11)의 길이(L11)에 대하여 리드(14)들의 길이(L12)를 동일하거나 길게 형성함을 특징으로 하는 반도체 리드 프레임.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019910004605A 1991-03-23 1991-03-23 반도체 리드 프레임 KR920018907A (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1019910004605A KR920018907A (ko) 1991-03-23 1991-03-23 반도체 리드 프레임
GB9115389A GB2254186A (en) 1991-03-23 1991-07-17 Semiconductor lead frame
CN91105645A CN1065351A (zh) 1991-03-23 1991-07-22 半导体引线架
DE4124269A DE4124269A1 (de) 1991-03-23 1991-07-22 Halbleiterleitungsrahmen

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019910004605A KR920018907A (ko) 1991-03-23 1991-03-23 반도체 리드 프레임

Publications (1)

Publication Number Publication Date
KR920018907A true KR920018907A (ko) 1992-10-22

Family

ID=19312419

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910004605A KR920018907A (ko) 1991-03-23 1991-03-23 반도체 리드 프레임

Country Status (4)

Country Link
KR (1) KR920018907A (ko)
CN (1) CN1065351A (ko)
DE (1) DE4124269A1 (ko)
GB (1) GB2254186A (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102142419B (zh) * 2010-02-03 2013-04-10 亿光电子工业股份有限公司 双边导线架结构

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1206759A (en) * 1967-07-20 1970-09-30 Standard Telephones Cables Ltd Semiconductor devices
JPS5521128A (en) * 1978-08-02 1980-02-15 Hitachi Ltd Lead frame used for semiconductor device and its assembling
GB2093401B (en) * 1981-01-17 1985-07-17 Sanyo Electric Co Composite film
JPS5966157A (ja) * 1982-10-08 1984-04-14 Fujitsu Ltd 半導体装置及びその製造方法
JPS59125644A (ja) * 1982-12-29 1984-07-20 Fujitsu Ltd 半導体装置
US4567545A (en) * 1983-05-18 1986-01-28 Mettler Rollin W Jun Integrated circuit module and method of making same
US4534105A (en) * 1983-08-10 1985-08-13 Rca Corporation Method for grounding a pellet support pad in an integrated circuit device
FR2581480A1 (fr) * 1985-04-10 1986-11-07 Ebauches Electroniques Sa Unite electronique notamment pour carte a microcircuits et carte comprenant une telle unite
US4937656A (en) * 1988-04-22 1990-06-26 Mitsubishi Denki Kabushiki Kaisha Semiconductor device

Also Published As

Publication number Publication date
DE4124269A1 (de) 1992-09-24
CN1065351A (zh) 1992-10-14
GB2254186A (en) 1992-09-30
GB9115389D0 (en) 1991-09-04

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