AR025677A1 - Una composicion de resina epoxi y un dispositivo semiconductor del tipo de encapsulacion con resina - Google Patents

Una composicion de resina epoxi y un dispositivo semiconductor del tipo de encapsulacion con resina

Info

Publication number
AR025677A1
AR025677A1 ARP000104843A ARP000104843A AR025677A1 AR 025677 A1 AR025677 A1 AR 025677A1 AR P000104843 A ARP000104843 A AR P000104843A AR P000104843 A ARP000104843 A AR P000104843A AR 025677 A1 AR025677 A1 AR 025677A1
Authority
AR
Argentina
Prior art keywords
composition
epoxy resin
resin
encapsulation
type
Prior art date
Application number
ARP000104843A
Other languages
English (en)
Original Assignee
Shell Int Research
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shell Int Research filed Critical Shell Int Research
Publication of AR025677A1 publication Critical patent/AR025677A1/es

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/687—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)

Abstract

Una composicion de resina epoxi que permite obtener un producto curado con un curado rápido, una excelente fluidez, un nivel de absorcion de la humedad yde adhesion bajos y, un dispositivo semiconductor del tipo con encapsulacion de resina que poseeuna excelente resistencia a la rajadura de suelda que estáencapsulado con esta composicion. Una composicion de resina epoxi que comprende una mezcla de: (a) una resina epoxi, (b) un compuesto con dos o más gruposhidroxilo fenolicos en promedio enuna molécula y, (c) un catalizador de polimerizacion cationico para la resina epoxi, como los componentes esenciales y, undispositivo semiconductor encapsulado con esta composicion.
ARP000104843A 1999-09-17 2000-09-15 Una composicion de resina epoxi y un dispositivo semiconductor del tipo de encapsulacion con resina AR025677A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30147999A JP4417494B2 (ja) 1999-09-17 1999-09-17 エポキシ樹脂組成物および樹脂封止型半導体装置

Publications (1)

Publication Number Publication Date
AR025677A1 true AR025677A1 (es) 2002-12-11

Family

ID=17897412

Family Applications (1)

Application Number Title Priority Date Filing Date
ARP000104843A AR025677A1 (es) 1999-09-17 2000-09-15 Una composicion de resina epoxi y un dispositivo semiconductor del tipo de encapsulacion con resina

Country Status (4)

Country Link
JP (1) JP4417494B2 (es)
AR (1) AR025677A1 (es)
AU (1) AU7905100A (es)
WO (1) WO2001021697A1 (es)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE60023752T2 (de) * 1999-12-13 2006-04-20 Dow Global Technologies, Inc., Midland Feuerhemmende phosporenthaltende epoxidharzzusammensetzung
DE102005040126A1 (de) * 2005-08-25 2007-03-01 Altana Electrical Insulation Gmbh Überzugsmasse
JPWO2013118509A1 (ja) * 2012-02-10 2015-05-11 三井化学株式会社 有機ｅｌ素子用の面封止剤、これを用いた有機ｅｌデバイス、及びその製造方法
JP6434748B2 (ja) * 2014-08-29 2018-12-05 積水化学工業株式会社 有機エレクトロルミネッセンス表示素子用封止剤

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2055843A (en) * 1979-07-20 1981-03-11 Ciba Geigy Ag Curable epoxide resin mixtures and their use in corrosion resistant coatings
JPS598767A (ja) * 1982-07-06 1984-01-18 Mitsui Petrochem Ind Ltd 塗料用組成物
GB8603701D0 (en) * 1986-02-14 1986-03-19 Dow Chemical Rheinwerk Gmbh Epoxy resins
EP0611796A1 (de) * 1993-02-18 1994-08-24 Ciba-Geigy Ag Halogenfreie, hochgefüllte Epoxidharz-Giessmassen
JP2875479B2 (ja) * 1994-09-08 1999-03-31 日本ペルノックス株式会社 半導体の封止方法
JP2000212395A (ja) * 1999-01-28 2000-08-02 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置

Also Published As

Publication number Publication date
JP2001081156A (ja) 2001-03-27
JP4417494B2 (ja) 2010-02-17
WO2001021697A1 (en) 2001-03-29
AU7905100A (en) 2001-04-24

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