EP0388473A4 - Silicone-epoxy resin composition and conductive adhesive prepared therefrom - Google Patents

Silicone-epoxy resin composition and conductive adhesive prepared therefrom

Info

Publication number
EP0388473A4
EP0388473A4 EP19890909855 EP89909855A EP0388473A4 EP 0388473 A4 EP0388473 A4 EP 0388473A4 EP 19890909855 EP19890909855 EP 19890909855 EP 89909855 A EP89909855 A EP 89909855A EP 0388473 A4 EP0388473 A4 EP 0388473A4
Authority
EP
European Patent Office
Prior art keywords
epoxy resin
silicone
conductive adhesive
resin composition
adhesive prepared
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP19890909855
Other languages
French (fr)
Other versions
EP0388473A1 (en
Inventor
Akio C-401 Royal Shikayama Ohura
Masakazu E1-5 Hirose
Tetsuya Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP30652288A external-priority patent/JPH02151624A/en
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Publication of EP0388473A1 publication Critical patent/EP0388473A1/en
Publication of EP0388473A4 publication Critical patent/EP0388473A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/306—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/54—Inorganic substances

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

A silicone-epoxy resin composition of this invention comprises a silicone-epoxy resin of general formula (I) and a curing agent. It has an excellent compatibility with an epoxy resin or curing agent and a high curing rate and, when cured, offers well-balanced flexibility, humidity resistance and heat resistance. Hence, it is effective for the bonding and sealing of electric or electronic components requiring a low stress. For example, a conductive adhesive prepared by adding a conductive filler to this composition can exhibit an excellent performance in the bonding of large-sized ICs or LSIs or in assembling quartz oscillators.
EP19890909855 1988-09-02 1989-09-01 Silicone-epoxy resin composition and conductive adhesive prepared therefrom Withdrawn EP0388473A4 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP221555/88 1988-09-02
JP22155588 1988-09-02
JP306522/88 1988-12-02
JP30652288A JPH02151624A (en) 1988-12-02 1988-12-02 New silicone-epoxy compound

Publications (2)

Publication Number Publication Date
EP0388473A1 EP0388473A1 (en) 1990-09-26
EP0388473A4 true EP0388473A4 (en) 1992-03-04

Family

ID=26524381

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19890909855 Withdrawn EP0388473A4 (en) 1988-09-02 1989-09-01 Silicone-epoxy resin composition and conductive adhesive prepared therefrom

Country Status (2)

Country Link
EP (1) EP0388473A4 (en)
WO (1) WO1990002768A1 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5227093A (en) * 1991-11-29 1993-07-13 Dow Corning Corporation Curable organosiloxane compositions yielding electrically conductive materials
US5700581A (en) * 1996-06-26 1997-12-23 International Business Machines Corporation Solvent-free epoxy based adhesives for semiconductor chip attachment and process
US6465550B1 (en) 2000-08-08 2002-10-15 Dow Corning Corporation Silicone composition and electrically conductive, cured silicone product
US7312261B2 (en) * 2004-05-11 2007-12-25 International Business Machines Corporation Thermal interface adhesive and rework
CN102286261B (en) * 2011-07-14 2014-07-09 上海本诺电子材料有限公司 Epoxy functional organic silicon conductive adhesive for amino curing system for light emitting diode (LED)
TWI424797B (en) * 2011-09-01 2014-01-21 Ind Tech Res Inst Flexible substrate structure and method of fabricating the same
CN109503644A (en) * 2018-09-30 2019-03-22 江苏和和新材料股份有限公司 A kind of preparation process, product and the application of biology base epoxy
CN109467677A (en) * 2018-09-30 2019-03-15 江苏和和新材料股份有限公司 A kind of biobased epoxy resin composition and its preparing the application in epoxy resin glue film
CN109400638A (en) * 2018-09-30 2019-03-01 浙江大学 A kind of eugenol base epoxy and its preparation process and application
CN109456463A (en) * 2018-09-30 2019-03-12 江苏和和新材料股份有限公司 A kind of phenolic hydroxyl group epoxidation technique
CN113046020B (en) * 2021-03-29 2022-12-09 浙江元通线缆制造有限公司 Waterproof glue, preparation method thereof and application thereof to watertight cable

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1251034B (en) * 1967-09-28 Deutsche Akademie der Wissenschaften zu Berlin Berlin Adlershof Process for the production of silicon-containing epoxy compounds
BE742710A (en) * 1967-08-23 1970-06-05
EP0319472A2 (en) * 1987-12-01 1989-06-07 Ciba-Geigy Ag Epoxy siloxanes

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59172571A (en) * 1983-03-18 1984-09-29 Hitachi Chem Co Ltd Electrically conductive adhesive
JPS59212250A (en) * 1983-05-17 1984-12-01 三菱電機株式会社 Manufacture of thermal insulator

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1251034B (en) * 1967-09-28 Deutsche Akademie der Wissenschaften zu Berlin Berlin Adlershof Process for the production of silicon-containing epoxy compounds
BE742710A (en) * 1967-08-23 1970-06-05
EP0319472A2 (en) * 1987-12-01 1989-06-07 Ciba-Geigy Ag Epoxy siloxanes

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
See also references of WO9002768A1 *
WORLD PATENTS INDEX LATEST Derwent Publications Ltd., London, GB; AN 85-015747 & JP-A-59 212 250 (MITSUBISHI ELECTRIC) 1 February 1984 *

Also Published As

Publication number Publication date
EP0388473A1 (en) 1990-09-26
WO1990002768A1 (en) 1990-03-22

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