JPS6420644A - Resin-sealed hybrid integrated circuit - Google Patents

Resin-sealed hybrid integrated circuit

Info

Publication number
JPS6420644A
JPS6420644A JP17672987A JP17672987A JPS6420644A JP S6420644 A JPS6420644 A JP S6420644A JP 17672987 A JP17672987 A JP 17672987A JP 17672987 A JP17672987 A JP 17672987A JP S6420644 A JPS6420644 A JP S6420644A
Authority
JP
Japan
Prior art keywords
resin
integrated circuit
hybrid integrated
elastic modulus
expansion coefficient
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17672987A
Other languages
Japanese (ja)
Inventor
Hiroshi Suzuki
Shigeo Kurosawa
Takashi Urano
Hiroki Koujima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP17672987A priority Critical patent/JPS6420644A/en
Publication of JPS6420644A publication Critical patent/JPS6420644A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To prevent a resin layer and a substrate from cracking and to enhance sealing reliability by sealing a circuit on which electronic components are placed with resin composition having a specific elastic modulus or linear expansion coefficient. CONSTITUTION:A chip type capacitor 3, a semiconductor element 4 and a resistance element 2 are placed on a circuit substrate 1, and sealed with resin 5. The resin 5 includes resin composition having 5X10<3>-1X10<2>kg/cm<2> of elastic modulus or 1.5X10<-5> deg.C<-1> of linear expansion coefficient. The composition includes polyester oil type rubber containing no filler, quartz glass, or epoxy resin containing zirconium filler, etc.
JP17672987A 1987-07-15 1987-07-15 Resin-sealed hybrid integrated circuit Pending JPS6420644A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17672987A JPS6420644A (en) 1987-07-15 1987-07-15 Resin-sealed hybrid integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17672987A JPS6420644A (en) 1987-07-15 1987-07-15 Resin-sealed hybrid integrated circuit

Publications (1)

Publication Number Publication Date
JPS6420644A true JPS6420644A (en) 1989-01-24

Family

ID=16018763

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17672987A Pending JPS6420644A (en) 1987-07-15 1987-07-15 Resin-sealed hybrid integrated circuit

Country Status (1)

Country Link
JP (1) JPS6420644A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03232258A (en) * 1989-12-28 1991-10-16 Nitto Denko Corp Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03232258A (en) * 1989-12-28 1991-10-16 Nitto Denko Corp Semiconductor device

Similar Documents

Publication Publication Date Title
JPS6436496A (en) Carrier element incorporated into identification card
HK1008913A1 (en) Adhesive sheet for semiconductor connecting substrate, adhesive-backed tape for tab, adhesive-backedtape for wire-bonding connection, semiconductor connecting substrate, and semiconductor device.
KR860002139A (en) Epoxy resin composition for semiconductor sealing and resin-sealed semiconductor device using the same
DE69305012T2 (en) Chip carrier with a protective layer for the circuit surface
EP0867475A3 (en) Epoxy resin composition to seal semiconductors and resin-sealed semiconductor device
US4888226A (en) Silicone gel electronic device encapsulant
US5165956A (en) Method of encapsulating an electronic device with a silicone encapsulant
MY112121A (en) Data word indicator in a system for assembling transport data packets.
KR960001604B1 (en) Semiconductor device with an encapsulation package
KR910003009A (en) Sealing methods, microelectronic devices made therefrom, and thermally curable compositions
DE68913053D1 (en) Personal data card and process for its construction.
Kuwata et al. Low-stress resin encapsulants for semiconductor devices
DE68924521D1 (en) EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR ARRANGEMENTS.
KR850003830A (en) Printed Circuit Structure with EPROM IC Chip
KR840008535A (en) Electronic devices with a multi-layered wiring structure
EP0388473A4 (en) Silicone-epoxy resin composition and conductive adhesive prepared therefrom
JPS6420644A (en) Resin-sealed hybrid integrated circuit
JPS649214A (en) Epoxy resin composition for sealing semiconductor
JPS5740963A (en) Resin-sealed semiconductor device
KR960007653A (en) Surface protective film, resin encapsulated semiconductor device having same, and manufacturing method thereof
JPS6484739A (en) Resin sealed semiconductor device
Emerson et al. Robust encapsulation of hybrid devices
JPS55158653A (en) Hybrid integrated circuit device
DE3881382D1 (en) SEMICONDUCTOR CHIP CONNECTED TO A SUBSTRATE.
JPS5414676A (en) Carrier tape and electronic parts using it