KR920015495A - 반도체장치 및 그의 제조방법 - Google Patents
반도체장치 및 그의 제조방법 Download PDFInfo
- Publication number
- KR920015495A KR920015495A KR1019920000276A KR920000276A KR920015495A KR 920015495 A KR920015495 A KR 920015495A KR 1019920000276 A KR1019920000276 A KR 1019920000276A KR 920000276 A KR920000276 A KR 920000276A KR 920015495 A KR920015495 A KR 920015495A
- Authority
- KR
- South Korea
- Prior art keywords
- semiconductor device
- film
- purity silicon
- ladder polymer
- formula
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims description 7
- 238000004519 manufacturing process Methods 0.000 title claims 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 3
- 229910052710 silicon Inorganic materials 0.000 claims 3
- 239000010703 silicon Substances 0.000 claims 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 2
- 229910052782 aluminium Inorganic materials 0.000 claims 2
- 229920000642 polymer Polymers 0.000 claims 2
- 230000001681 protective effect Effects 0.000 claims 2
- 239000002635 aromatic organic solvent Substances 0.000 claims 1
- 238000001816 cooling Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 229920006254 polymer film Polymers 0.000 claims 1
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
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Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Formation Of Insulating Films (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Silicon Polymers (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 1실시예의 반도체장치의 단면도
Claims (2)
- 반도체소자 및 이 반도체소자에 형성한 다음식(1)으로 표시되는 고순도 실리콘 래더포리마(silicon ladder polymer)의 경화막으로 형성되는 응력완충 보호막을 구비한 반도체장치.(식중, n은 중량평균 분자량이 10만∼20만으로 되는 정수이다.)
- 알루미늄(aluminum)막을 형성한 반도체소자에 상기 제1항기재의 식(1)에 표시되는 고순도 실리콘 래더포리마막을 형성하고, 상기 알루미늄을 노출되도록, 방향족계 유기용제에 의해 상기 고순도 실리콘 래더포리마막을 현상하고, 승온속도 20℃/min이상으로 승온하여 경화하고, 냉각속도 20℃/min이상으로 냉각하여 응력완충 보호막을 얻는 반도체장치의 제조방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3010908A JPH04261049A (ja) | 1991-01-31 | 1991-01-31 | 半導体装置およびその製造方法 |
JP91-010908 | 1991-01-31 | ||
JP91-10908 | 1991-01-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR920015495A true KR920015495A (ko) | 1992-08-27 |
KR950006431B1 KR950006431B1 (ko) | 1995-06-15 |
Family
ID=11763389
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019920000276A KR950006431B1 (ko) | 1991-01-31 | 1992-01-10 | 반도체장치 및 그의 제조방법 |
Country Status (5)
Country | Link |
---|---|
US (1) | US5180691A (ko) |
JP (1) | JPH04261049A (ko) |
KR (1) | KR950006431B1 (ko) |
DE (1) | DE4202290C2 (ko) |
IT (1) | IT1258835B (ko) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3383329B2 (ja) * | 1992-08-27 | 2003-03-04 | 株式会社東芝 | 半導体装置の製造方法 |
JP2923408B2 (ja) * | 1992-12-21 | 1999-07-26 | 三菱電機株式会社 | 高純度シリコーンラダーポリマーの製造方法 |
JPH0799271A (ja) * | 1993-06-16 | 1995-04-11 | Mitsubishi Electric Corp | 半導体装置 |
JP3214186B2 (ja) * | 1993-10-07 | 2001-10-02 | 三菱電機株式会社 | 半導体装置の製造方法 |
DE4432294A1 (de) * | 1994-09-12 | 1996-03-14 | Telefunken Microelectron | Verfahren zur Reduzierung der Oberflächenrekombinationsgeschwindigkeit in Silizium |
US5600151A (en) * | 1995-02-13 | 1997-02-04 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device comprising a semiconductor substrate, an element formed thereon, and a stress-buffering film made of a silicone ladder resin |
KR100216991B1 (ko) * | 1996-09-11 | 1999-09-01 | 윤종용 | 접착층이 형성된 리드 프레임 |
TW480636B (en) * | 1996-12-04 | 2002-03-21 | Seiko Epson Corp | Electronic component and semiconductor device, method for manufacturing and mounting thereof, and circuit board and electronic equipment |
EP0890981B1 (en) * | 1997-07-11 | 2003-02-12 | Robert Bosch Gmbh | Enhanced underfill adhesion of flip chips |
US5869219A (en) * | 1997-11-05 | 1999-02-09 | Taiwan Semiconductor Manufacturing Co. Ltd. | Method for depositing a polyimide film |
DE19827593A1 (de) * | 1998-06-20 | 1999-12-23 | Abb Patent Gmbh | Verfahren zur Ertüchtigung von Freileitungsisolatoren |
US6110815A (en) * | 1998-06-23 | 2000-08-29 | Lsi Logic Corporation | Electroplating fixture for high density substrates |
US6599995B2 (en) * | 2001-05-01 | 2003-07-29 | Korea Institute Of Science And Technology | Polyalkylaromaticsilsesquioxane and preparation method thereof |
US7091131B2 (en) * | 2002-03-21 | 2006-08-15 | Micron Technology, Inc. | Method of forming integrated circuit structures in silicone ladder polymer |
US20040102022A1 (en) * | 2002-11-22 | 2004-05-27 | Tongbi Jiang | Methods of fabricating integrated circuitry |
Family Cites Families (16)
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NL241488A (ko) * | 1958-07-21 | 1900-01-01 | ||
US3792012A (en) * | 1972-03-17 | 1974-02-12 | Gen Electric | Silicone resin useful in molding compositions |
JPS5336997B2 (ko) * | 1973-10-12 | 1978-10-05 | ||
DE2548060C2 (de) * | 1975-10-27 | 1984-06-20 | Siemens AG, 1000 Berlin und 8000 München | Halbleitervorrichtung und Verfahren zu ihrer Herstellung |
JPS56118334A (en) * | 1980-02-22 | 1981-09-17 | Fujitsu Ltd | Semiconductor device |
JPS56150830A (en) * | 1980-04-25 | 1981-11-21 | Hitachi Ltd | Semiconductor device |
JPH0783075B2 (ja) * | 1986-03-14 | 1995-09-06 | 三菱電機株式会社 | 半導体装置の製造方法 |
JPS63104450A (ja) * | 1986-10-22 | 1988-05-09 | Hitachi Ltd | 保護膜の窓開法 |
JPS63213347A (ja) * | 1987-02-27 | 1988-09-06 | Mitsubishi Electric Corp | 半導体装置 |
JPH0192224A (ja) * | 1987-04-20 | 1989-04-11 | Mitsubishi Electric Corp | 高純度フェニルシリコーンラダーポリマーの製造法 |
JPS63269554A (ja) * | 1987-04-27 | 1988-11-07 | Mitsubishi Electric Corp | 半導体装置 |
US4827326A (en) * | 1987-11-02 | 1989-05-02 | Motorola, Inc. | Integrated circuit having polyimide/metal passivation layer and method of manufacture using metal lift-off |
JP2503565B2 (ja) * | 1988-01-21 | 1996-06-05 | 三菱電機株式会社 | 半導体装置の製造方法 |
JP2597396B2 (ja) * | 1988-12-21 | 1997-04-02 | ローム株式会社 | シリコーンゴム膜のパターン形成方法 |
US5081202A (en) * | 1989-11-17 | 1992-01-14 | Mitsubishi Denki Kabushiki Kaisha | High purity phenyl silicone ladder polymer and method for producing the same |
JP2613128B2 (ja) * | 1990-10-01 | 1997-05-21 | 三菱電機株式会社 | 半導体装置 |
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1991
- 1991-01-31 JP JP3010908A patent/JPH04261049A/ja active Pending
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1992
- 1992-01-10 KR KR1019920000276A patent/KR950006431B1/ko not_active IP Right Cessation
- 1992-01-28 DE DE4202290A patent/DE4202290C2/de not_active Expired - Fee Related
- 1992-01-30 IT ITMI920178A patent/IT1258835B/it active IP Right Grant
- 1992-01-30 US US07/827,220 patent/US5180691A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
IT1258835B (it) | 1996-02-29 |
ITMI920178A0 (it) | 1992-01-30 |
DE4202290A1 (de) | 1992-08-13 |
KR950006431B1 (ko) | 1995-06-15 |
JPH04261049A (ja) | 1992-09-17 |
ITMI920178A1 (it) | 1993-07-30 |
DE4202290C2 (de) | 2001-07-19 |
US5180691A (en) | 1993-01-19 |
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