KR950005871A - 액체 에폭시 수지 조성물 - Google Patents
액체 에폭시 수지 조성물 Download PDFInfo
- Publication number
- KR950005871A KR950005871A KR1019940020646A KR19940020646A KR950005871A KR 950005871 A KR950005871 A KR 950005871A KR 1019940020646 A KR1019940020646 A KR 1019940020646A KR 19940020646 A KR19940020646 A KR 19940020646A KR 950005871 A KR950005871 A KR 950005871A
- Authority
- KR
- South Korea
- Prior art keywords
- epoxy resin
- weight
- parts
- resin composition
- molecule
- Prior art date
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
- C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
- C08G59/1455—Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
- C08G59/066—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/12—Polycondensates containing more than one epoxy group per molecule of polycarboxylic acids with epihalohydrins or precursors thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
- C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
- C08G59/1444—Monoalcohols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
Abstract
적어도 하기 성분들; ⒜100중량부의 결정성 에폭시 수지, ⒝한 분자 내에 둘 이상의 페놀성 히드록실기 및/또는 카르복실기를 갖는 3-20중량부의 화합물 및 ⒞한 분자 내에 하나의 페놀성 히드록실기 또는 카르복실기를 갖는 3-20중량부의 화합물을 반응시킴으로써 얻을 수 있는 에폭시 수지가 기재되어 있다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
Claims (7)
- 적어도 하기 성분들; ⒜ 100중량부의 결정성 에폭시 수지, ⒝ 한 분자내에 둘 이상의 페놀성 히드록실기 및/또는 카르복실기를 갖는 3-20중량부의 화합물 및 ⒞ 한 분자내에 하나의 페놀성 히드록실기 또는 카르복실기를 갖는 3-20중량부의 화합물을 반응시킴으로써 얻을 수 있는 에폭시 수지.
- 제1항에 있어서, 결정성 에폭시 수지는 하기 구조식(Ⅰ)의 비페놀-형 에폭시 수지인 에폭시 수지.상기 식에서 각각의 R은 독립적으로 수소 원자, 1-10개 탄소 원자를 갖는 알킬기, 페닐기 또는 할로겐 원자일 수 있으며 n은 평균 0-2의 수이다.
- 제1 또는 2항에 청구된 바와 같은 100중량부의 에폭시 수지 및 20-300중량부의 액체 비스페놀-형 에폭시 수지로 구성되는 에폭시 수지 조성물.
- 제1항 또는 제2항에 청구된 바와 같은 에폭시 수지 또는 제3항에 청구된 바와 같은 에폭시 수지 조성물을 에폭시 수지 경화 화합물과 혼합시킴으로써 얻을 수 있는 경화가능 에폭시 수지 조성물.
- 접착제, 캐스팅, 시일런트, 적층물 및 성형품을 위한 배합물내 제4항에 청구된 바와 같은 경화가능 에폭시 수지 조성물의 사용.
- 경화된 제4항에 청구된 바와 같은 경화 가능 에폭시 수지 조성물로 구성되는 제품.
- ⒜100중량부의 결정성 에폭시 수지, ⒝한 분자 내에 둘 이상의 페놀성 히드록실기 및/또는 카르복실기를 갖는 3-20중량부의 화합물 및 ⒞한 분자내에 하나의 페놀성 히드록실기 또는 카르복실기를 갖는 3-20중량부의 화합물을 승온에서 반응시킴으로써 에폭시 수지를 제조하는 방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP226714/93 | 1993-08-20 | ||
JP22671493A JP3428695B2 (ja) | 1993-08-20 | 1993-08-20 | 変性液状エポキシ樹脂組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR950005871A true KR950005871A (ko) | 1995-03-20 |
KR100327919B1 KR100327919B1 (ko) | 2002-06-22 |
Family
ID=16849489
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019940020646A KR100327919B1 (ko) | 1993-08-20 | 1994-08-19 | 에폭시수지,에폭시수지조성물및상기에폭시수지조성물로구성되는제품 |
Country Status (7)
Country | Link |
---|---|
US (1) | US5623031A (ko) |
EP (1) | EP0640635A1 (ko) |
JP (1) | JP3428695B2 (ko) |
KR (1) | KR100327919B1 (ko) |
CN (1) | CN1106420A (ko) |
MY (1) | MY115318A (ko) |
TW (1) | TW260693B (ko) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
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JP3637987B2 (ja) * | 1995-11-20 | 2005-04-13 | ジャパンエポキシレジン株式会社 | 注型用エポキシ樹脂及びエポキシ樹脂組成物 |
JPH10204257A (ja) * | 1997-01-24 | 1998-08-04 | Shin Etsu Chem Co Ltd | エポキシ樹脂組成物及び半導体装置 |
JP3409279B2 (ja) * | 1997-11-11 | 2003-05-26 | 株式会社日本触媒 | 硬化性樹脂および樹脂組成物 |
US20040161545A1 (en) * | 2000-11-28 | 2004-08-19 | Shipley Company, L.L.C. | Adhesion method |
EP1209253A3 (en) | 2000-11-28 | 2004-02-25 | Shipley Co. L.L.C. | Process for treating adhesion promoted metal surfaces with epoxy resins |
JP5095909B2 (ja) * | 2003-06-24 | 2012-12-12 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | 触媒組成物および析出方法 |
EP1795558B1 (en) | 2004-09-29 | 2009-12-02 | Nissan Chemical Industries, Ltd. | Modified epoxy resin composition |
US20080153976A1 (en) * | 2004-12-21 | 2008-06-26 | Nippon Kayaku Kabushiki Kaisha | Epoxy Resin, Epoxy Resin Composition, And Cured Material Thereof |
CN101522747B (zh) * | 2006-08-17 | 2012-07-04 | 日本化药株式会社 | 变性液性环氧树脂、以及使用该树脂的环氧树脂组成物及其硬化物 |
TW200923006A (en) * | 2007-07-11 | 2009-06-01 | Nissan Chemical Ind Ltd | Liquid epoxy resin forming formulation containing inorganic particles |
JP5377020B2 (ja) | 2009-03-23 | 2013-12-25 | 太陽ホールディングス株式会社 | 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板 |
KR20130061132A (ko) | 2010-04-16 | 2013-06-10 | 발스파 소싱 인코포레이티드 | 패키징 용품을 위한 코팅 조성물 및 코팅 방법 |
KR102135072B1 (ko) | 2011-02-07 | 2020-07-20 | 에스더블유아이엠씨 엘엘씨 | 용기 및 기타 물품을 위한 코팅 조성물 및 코팅 방법 |
BR112015002731B1 (pt) | 2012-08-09 | 2021-11-30 | Swimc Llc | Sistema de revestimento de múltiplas camadas, artigo, e, método |
CN104540907B (zh) | 2012-08-09 | 2018-04-10 | Swimc有限公司 | 用于容器和其它物品的组合物以及使用相同组合物的方法 |
JP6221634B2 (ja) * | 2013-10-30 | 2017-11-01 | Tdk株式会社 | 樹脂組成物、樹脂シート、樹脂硬化物および基板 |
EP3085721B1 (en) | 2013-12-17 | 2018-07-18 | Nissan Chemical Industries, Ltd. | High-solubility modified epoxy resin composition |
WO2015160788A1 (en) | 2014-04-14 | 2015-10-22 | Valspar Sourcing, Inc. | Methods of preparing compositions for containers and other articles and methods of using same |
JP6525305B2 (ja) * | 2014-09-19 | 2019-06-05 | 互応化学工業株式会社 | 硬化性組成物及び被覆配線板の製造方法 |
TWI614275B (zh) | 2015-11-03 | 2018-02-11 | Valspar Sourcing Inc | 用於製備聚合物的液體環氧樹脂組合物 |
US10787755B2 (en) | 2017-06-05 | 2020-09-29 | The Boeing Company | Method and apparatus for manufacturing carbon fibers |
WO2020234615A1 (en) | 2019-05-19 | 2020-11-26 | Robinson Alex P G | Method of forming a pattern resist for euv |
CN111735738A (zh) * | 2020-07-01 | 2020-10-02 | 道生天合材料科技(上海)股份有限公司 | 一种液体环氧树脂结晶倾向性的测定方法 |
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US5385990A (en) * | 1992-11-02 | 1995-01-31 | Lord Corporation | Structural adhesive composition having high temperature resistance |
-
1993
- 1993-08-20 JP JP22671493A patent/JP3428695B2/ja not_active Expired - Fee Related
-
1994
- 1994-08-18 MY MYPI94002165A patent/MY115318A/en unknown
- 1994-08-19 EP EP94202370A patent/EP0640635A1/en not_active Ceased
- 1994-08-19 KR KR1019940020646A patent/KR100327919B1/ko not_active IP Right Cessation
- 1994-08-19 CN CN94109560A patent/CN1106420A/zh active Pending
- 1994-08-26 TW TW083107845A patent/TW260693B/zh not_active IP Right Cessation
-
1996
- 1996-01-11 US US08/585,380 patent/US5623031A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0762060A (ja) | 1995-03-07 |
JP3428695B2 (ja) | 2003-07-22 |
CN1106420A (zh) | 1995-08-09 |
MY115318A (en) | 2003-05-31 |
US5623031A (en) | 1997-04-22 |
EP0640635A1 (en) | 1995-03-01 |
KR100327919B1 (ko) | 2002-06-22 |
TW260693B (ko) | 1995-10-21 |
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