DE3662054D1 - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
DE3662054D1
DE3662054D1 DE8686105284T DE3662054T DE3662054D1 DE 3662054 D1 DE3662054 D1 DE 3662054D1 DE 8686105284 T DE8686105284 T DE 8686105284T DE 3662054 T DE3662054 T DE 3662054T DE 3662054 D1 DE3662054 D1 DE 3662054D1
Authority
DE
Germany
Prior art keywords
resin composition
epoxy resin
epoxy
composition
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8686105284T
Other languages
English (en)
Inventor
Kazuo Yatsuda
Toshiharu Ando
Yoshifumi Idabashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Application granted granted Critical
Publication of DE3662054D1 publication Critical patent/DE3662054D1/de
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4246—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
    • C08G59/4269—Macromolecular compounds obtained by reactions other than those involving unsaturated carbon-to-carbon bindings
    • C08G59/4276—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
DE8686105284T 1985-07-18 1986-04-16 Epoxy resin composition Expired DE3662054D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60159139A JPS6220555A (ja) 1985-07-18 1985-07-18 エポキシ樹脂組成物

Publications (1)

Publication Number Publication Date
DE3662054D1 true DE3662054D1 (en) 1989-03-16

Family

ID=15687101

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8686105284T Expired DE3662054D1 (en) 1985-07-18 1986-04-16 Epoxy resin composition

Country Status (6)

Country Link
US (1) US4677144A (de)
EP (1) EP0211147B1 (de)
JP (1) JPS6220555A (de)
KR (1) KR900000454B1 (de)
CN (1) CN1004487B (de)
DE (1) DE3662054D1 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3855530T2 (de) * 1987-10-05 1997-02-06 Ici Composite Inc Polymermasse
US4972031A (en) * 1988-10-05 1990-11-20 Imperial Chemical Industries Plc Plastic moulding composition comprising an uncured or partly cured thermoset resin precursor and a polyarylsulphone
US5162450A (en) * 1989-02-17 1992-11-10 General Electric Company Curable dielectric polyphenylene ether-polyepoxide compositions
US5213886A (en) * 1989-02-17 1993-05-25 General Electric Company Curable dielectric polyphenylene ether-polyepoxide compositions
WO1991018957A1 (en) * 1990-06-08 1991-12-12 Minnesota Mining And Manufacturing Company Reworkable adhesive for electronic applications
NL9402233A (nl) * 1994-12-29 1996-08-01 3P Licensing Bv Werkwijze voor het omhullen van een elektronische component, een aldus omhulde elektronische component en daarvoor bestemd kunststofmateriaal.
US5834565A (en) * 1996-11-12 1998-11-10 General Electric Company Curable polyphenylene ether-thermosetting resin composition and process
US6197898B1 (en) 1997-11-18 2001-03-06 General Electric Company Melt-mixing thermoplastic and epoxy resin above Tg or Tm of thermoplastic with curing agent
US7867319B2 (en) * 2008-04-01 2011-01-11 Honeywell International Inc. Filled epoxy tubesheet
BRPI1015324A2 (pt) 2009-05-05 2019-04-09 Huntsman Advanced Materials (Switzerland) Gmbh sistema curável, método para a fabricação de um produto curado, produto curado, e, usos do produto curado e do sistema curável
CN101864262A (zh) * 2009-11-03 2010-10-20 上海上大瑞沪微系统集成技术有限公司 柔性导电胶
CN104853865B (zh) * 2012-12-13 2017-11-14 渡边佳代 填充剂及填充剂的密封结构的制造方法
CN108215233B (zh) * 2017-12-11 2019-12-24 湖北耐创新材料洁具有限公司 一种树脂和矿物混合浇注件的压力成型工艺

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1169613A (en) * 1967-02-21 1969-11-05 Ciba Ltd Epoxide Resin Compositions
GB1306231A (de) * 1969-10-24 1973-02-07
US3819472A (en) * 1973-03-13 1974-06-25 Du Pont Coating composition of an aromatic polysulfone resin, an epoxy resin, and n-cyclohexyl toluene sulfonamide
JPS5331904A (en) * 1976-09-06 1978-03-25 Nippon Telegr & Teleph Corp <Ntt> Informing system for facsimile communication result
EP0151553A3 (de) * 1984-02-03 1987-05-27 Ciba-Geigy Ag Epoxiharz/Polysulfon-Formmassen für gehärtete Produkte mit ausgezeichneter Riss- und Feuchtigkeitsbeständigkeit
JPS60243113A (ja) * 1984-05-17 1985-12-03 Sumitomo Chem Co Ltd 強靭性に優れたエポキシ樹脂組成物

Also Published As

Publication number Publication date
JPS6220555A (ja) 1987-01-29
CN86104577A (zh) 1987-02-11
EP0211147B1 (de) 1989-02-08
KR870001261A (ko) 1987-03-12
EP0211147A1 (de) 1987-02-25
KR900000454B1 (ko) 1990-01-30
CN1004487B (zh) 1989-06-14
US4677144A (en) 1987-06-30

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee