DE69115058T2 - Epoxyharzzusammensetzung und damit verkapselte Halbleiteranordnung. - Google Patents

Epoxyharzzusammensetzung und damit verkapselte Halbleiteranordnung.

Info

Publication number
DE69115058T2
DE69115058T2 DE69115058T DE69115058T DE69115058T2 DE 69115058 T2 DE69115058 T2 DE 69115058T2 DE 69115058 T DE69115058 T DE 69115058T DE 69115058 T DE69115058 T DE 69115058T DE 69115058 T2 DE69115058 T2 DE 69115058T2
Authority
DE
Germany
Prior art keywords
semiconductor device
resin composition
epoxy resin
encapsulated semiconductor
encapsulated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69115058T
Other languages
English (en)
Other versions
DE69115058D1 (de
Inventor
Toshio Shiobara
Kazutoshi Tomiyoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Publication of DE69115058D1 publication Critical patent/DE69115058D1/de
Application granted granted Critical
Publication of DE69115058T2 publication Critical patent/DE69115058T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/04—Epoxynovolacs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
DE69115058T 1990-01-25 1991-01-24 Epoxyharzzusammensetzung und damit verkapselte Halbleiteranordnung. Expired - Fee Related DE69115058T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1559690 1990-01-25

Publications (2)

Publication Number Publication Date
DE69115058D1 DE69115058D1 (de) 1996-01-18
DE69115058T2 true DE69115058T2 (de) 1996-08-08

Family

ID=11893100

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69115058T Expired - Fee Related DE69115058T2 (de) 1990-01-25 1991-01-24 Epoxyharzzusammensetzung und damit verkapselte Halbleiteranordnung.

Country Status (4)

Country Link
US (1) US5190995A (de)
EP (1) EP0439171B1 (de)
KR (1) KR950009152B1 (de)
DE (1) DE69115058T2 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2780559B2 (ja) * 1991-01-25 1998-07-30 信越化学工業株式会社 アリル基又はプロペニル基を持つナフタレン誘導体
JPH04300914A (ja) * 1991-03-29 1992-10-23 Shin Etsu Chem Co Ltd エポキシ樹脂組成物及び半導体装置
JPH04300915A (ja) * 1991-03-29 1992-10-23 Shin Etsu Chem Co Ltd エポキシ樹脂組成物及び半導体装置
JP2526747B2 (ja) * 1991-05-21 1996-08-21 信越化学工業株式会社 エポキシ樹脂組成物及び半導体装置
JP2669247B2 (ja) * 1992-02-13 1997-10-27 信越化学工業株式会社 熱硬化性樹脂組成物
US5908881A (en) * 1996-11-29 1999-06-01 Sumitomo Bakelite Company Limited Heat-conductive paste
JPH10245473A (ja) * 1997-03-03 1998-09-14 Yuka Shell Epoxy Kk エポキシ樹脂組成物
DE19804595A1 (de) * 1998-02-05 1999-08-12 Siemens Ag Thermisch härtbare Ein-Komponenten-Underfill-Masse
KR100562454B1 (ko) * 1998-07-21 2006-03-21 신에쓰 가가꾸 고교 가부시끼가이샤 반도체 봉지용 에폭시 수지 조성물 및 반도체 장치
US6784024B2 (en) * 2000-01-18 2004-08-31 Micron Technology, Inc. Die attach curing method for semiconductor device
WO2003101164A1 (en) * 2002-05-23 2003-12-04 3M Innovative Properties Company Nanoparticle filled underfill
US7943706B2 (en) * 2005-03-24 2011-05-17 Shin-Etsu Chemical Co., Ltd. Semiconductor encapsulating epoxy resin composition and semiconductor device
PL2029656T5 (pl) * 2006-06-16 2014-08-29 Huntsman Adv Mat Switzerland Układ powłoki
US8828806B2 (en) * 2009-06-01 2014-09-09 Shin-Etsu Chemical Co., Ltd. Dam composition for use with multilayer semiconductor package underfill material, and fabrication of multilayer semiconductor package using the same

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3290269A (en) * 1963-04-01 1966-12-06 Koppers Co Inc Naphthyldimethylene spaced phenyl glycidyl ethers
US4418383A (en) * 1980-06-30 1983-11-29 International Business Machines Corporation Data flow component for processor and microprocessor systems
US4376147A (en) * 1981-08-31 1983-03-08 Clopay Corporation Plastic film having a matte finish
JPS59230017A (ja) * 1983-05-25 1984-12-24 Agency Of Ind Science & Technol 新規ポリグリシジルエ−テル及びその製法
JPS60260611A (ja) * 1984-06-08 1985-12-23 Mitsubishi Petrochem Co Ltd 高分子量クレゾ−ルノボラツク樹脂の製造方法
JPS61141724A (ja) * 1984-12-12 1986-06-28 Agency Of Ind Science & Technol ポリグリシジルエ−テル組成物
US4720515A (en) * 1985-05-17 1988-01-19 Denki Kagaku Kogyo Kabushiki Kaisha Epoxy resin composition for encapsulating semiconductor
US4902732A (en) * 1985-09-30 1990-02-20 Shin-Etsu Chemical Co., Ltd. Epoxy resin-based curable compositions
DE3689022T2 (de) * 1985-10-07 1994-04-21 Shinetsu Chemical Co Epoxyharzzusammensetzung.
JPS63226951A (ja) * 1987-03-16 1988-09-21 Shin Etsu Chem Co Ltd 樹脂封止型半導体装置
US4908424A (en) * 1987-10-09 1990-03-13 Shell Oil Company Bis-anthrols and bis-naphthols and diglycidyl ethers thereof
US5001174A (en) * 1988-12-08 1991-03-19 Sumitomo Bakelite Company Limited Epoxy resin composition for semiconductor sealing employing triphenylmethane based novolac epoxy resin
JPH0617440B2 (ja) * 1989-05-30 1994-03-09 新日鐵化学株式会社 新規エポキシ樹脂及びその製造法
JPH0390075A (ja) * 1989-09-01 1991-04-16 Nippon Steel Chem Co Ltd エポキシ樹脂及びその中間体並びにその製造法

Also Published As

Publication number Publication date
EP0439171A2 (de) 1991-07-31
US5190995A (en) 1993-03-02
EP0439171B1 (de) 1995-12-06
KR910014459A (ko) 1991-08-31
EP0439171A3 (en) 1992-07-08
DE69115058D1 (de) 1996-01-18
KR950009152B1 (ko) 1995-08-16

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee