DE69821573D1 - Epoxidharzzusammensetzung und damit eingekapselte Halbleiteranordnungen - Google Patents

Epoxidharzzusammensetzung und damit eingekapselte Halbleiteranordnungen

Info

Publication number
DE69821573D1
DE69821573D1 DE69821573T DE69821573T DE69821573D1 DE 69821573 D1 DE69821573 D1 DE 69821573D1 DE 69821573 T DE69821573 T DE 69821573T DE 69821573 T DE69821573 T DE 69821573T DE 69821573 D1 DE69821573 D1 DE 69821573D1
Authority
DE
Germany
Prior art keywords
resin composition
epoxy resin
semiconductor devices
encapsulated semiconductor
encapsulated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69821573T
Other languages
English (en)
Other versions
DE69821573T2 (de
Inventor
Shinichi Iwasaki
Masatoshi Iji
Yukihiro Kiuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Sumitomo Bakelite Co Ltd
Original Assignee
NEC Corp
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Sumitomo Bakelite Co Ltd filed Critical NEC Corp
Application granted granted Critical
Publication of DE69821573D1 publication Critical patent/DE69821573D1/de
Publication of DE69821573T2 publication Critical patent/DE69821573T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/04—Epoxynovolacs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12528—Semiconductor component
DE69821573T 1997-11-10 1998-11-09 Epoxidharzzusammensetzung und damit eingekapselte Halbleiteranordnungen Expired - Lifetime DE69821573T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP9306847A JPH11140277A (ja) 1997-11-10 1997-11-10 エポキシ樹脂組成物及びこれを用いた半導体装置
JP30684797 1997-11-10

Publications (2)

Publication Number Publication Date
DE69821573D1 true DE69821573D1 (de) 2004-03-18
DE69821573T2 DE69821573T2 (de) 2004-12-16

Family

ID=17961979

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69821573T Expired - Lifetime DE69821573T2 (de) 1997-11-10 1998-11-09 Epoxidharzzusammensetzung und damit eingekapselte Halbleiteranordnungen

Country Status (7)

Country Link
US (1) US6242110B1 (de)
EP (1) EP0915118B1 (de)
JP (1) JPH11140277A (de)
KR (1) KR100524248B1 (de)
DE (1) DE69821573T2 (de)
MY (1) MY115618A (de)
SG (1) SG87012A1 (de)

Families Citing this family (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3349963B2 (ja) * 1998-10-21 2002-11-25 日本電気株式会社 難燃性エポキシ樹脂組成物及びそれを用いた半導体装置
WO2001018115A1 (en) * 1999-09-06 2001-03-15 Sumitomo Bakelite Company Limited Epoxy resin composition and semiconductor device
JP3460820B2 (ja) * 1999-12-08 2003-10-27 日本電気株式会社 難燃性エポキシ樹脂組成物
JP4743932B2 (ja) * 2000-02-17 2011-08-10 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置
US6610406B2 (en) 2000-03-23 2003-08-26 Henkel Locktite Corporation Flame retardant molding compositions
US6432540B1 (en) 2000-03-23 2002-08-13 Loctite Corporation Flame retardant molding compositions
JP4622030B2 (ja) * 2000-04-03 2011-02-02 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置
JP2002121357A (ja) * 2000-10-12 2002-04-23 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP4639461B2 (ja) * 2000-11-14 2011-02-23 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置
KR100414202B1 (ko) * 2000-12-08 2004-01-07 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물
JP4635360B2 (ja) * 2001-03-28 2011-02-23 住友ベークライト株式会社 半導体装置
DE60214093T2 (de) 2001-07-12 2007-10-04 Dainippon Ink And Chemicals, Inc. Epoxidharzzusammensetzung, daraus hergestellter gehärteter Gegenstand, neues Epoxidharz, neue Phenolverbindung, und Verfahren zu deren Herstellung
JP2003026779A (ja) * 2001-07-17 2003-01-29 Shin Etsu Chem Co Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
JP5098125B2 (ja) * 2001-07-30 2012-12-12 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置
KR20030057107A (ko) * 2001-12-28 2003-07-04 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물
JP3627736B2 (ja) * 2002-10-11 2005-03-09 住友ベークライト株式会社 エポキシ樹脂組成物並びにこれを用いた半導体装置
TWI320421B (en) * 2003-02-18 2010-02-11 Sumitomo Bakelite Co Epoxy resin composition and semiconductor device
US7291684B2 (en) * 2003-03-11 2007-11-06 Sumitomo Bakelite Co., Ltd. Resin composition for encapsulating semiconductor chip and semiconductor device therewith
WO2005003208A1 (ja) * 2003-07-03 2005-01-13 Nec Corporation エポキシ樹脂組成物
JP2005120228A (ja) * 2003-10-16 2005-05-12 Nitto Denko Corp 光半導体素子封止用エポキシ樹脂組成物およびそれを用いた光半導体装置
KR100870809B1 (ko) 2004-03-03 2008-11-27 히다치 가세고교 가부시끼가이샤 봉지용 에폭시 수지 성형 재료 및 전자 부품 장치
KR101090653B1 (ko) 2004-03-16 2011-12-07 스미토모 베이클라이트 가부시키가이샤 에폭시 수지 조성물 및 반도체장치
US7431990B2 (en) 2004-05-27 2008-10-07 Sumitomo Bakelite Co Resin composition for encapsulating semiconductor chip and semiconductor device therewith
US7956136B2 (en) 2004-07-22 2011-06-07 Sumitomo Bakelite Company, Ltd. Resin composition for semiconductor encapsulation and semiconductor device
MY148463A (en) 2004-07-29 2013-04-30 Sumitomo Bakelite Co Epoxy resin composition and semiconductor device
KR100561575B1 (ko) * 2004-12-21 2006-03-20 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물
KR100561569B1 (ko) * 2004-12-21 2006-03-20 제일모직주식회사 반도체 소자 봉지제용 에폭시 수지 조성물
KR100673752B1 (ko) * 2004-12-27 2007-01-24 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물
WO2006076604A2 (en) * 2005-01-14 2006-07-20 Cabot Corporation Processes for planarizing substrates and encapsulating printable electronic features
CN101137716B (zh) 2005-03-16 2011-04-20 住友电木株式会社 环氧树脂组合物和半导体器件
JP4998271B2 (ja) * 2006-01-25 2012-08-15 日立化成工業株式会社 フェノール樹脂及び樹脂組成物
JP2007332319A (ja) * 2006-06-19 2007-12-27 Nippon Kayaku Co Ltd 真空パネル基板用シール剤
TWI278463B (en) * 2006-09-04 2007-04-11 Chang Chun Plastics Co Ltd Flame retardant resin composition
CN101153107B (zh) * 2006-09-28 2011-02-16 长春人造树脂厂股份有限公司 难燃性树脂组成物
KR101522436B1 (ko) 2007-03-23 2015-05-21 스미토모 베이클리트 컴퍼니 리미티드 반도체 봉지용 수지 조성물 및 이것을 이용한 반도체 장치
TW200842135A (en) * 2007-04-23 2008-11-01 Chang Chun Plastics Co Ltd Flame retardant resin composition
AR063177A1 (es) 2007-05-23 2008-12-30 Mi Llc Uso de emulsiones epoxicas inversas para la estabilizacion de perforaciones de pozos
BRPI0813210A2 (pt) 2007-08-02 2014-12-23 Dow Global Technologies Inc "processo para amortecer vibrações num artigo, compósito tendo propriedades de amortecimento melhoradas em temperaturas elevadas e composição termofixa tendo propriedades de amortecimento melhoradas em temperaturas elevadas"
WO2009018193A1 (en) 2007-08-02 2009-02-05 Dow Global Technologies Inc. Amphiphilic block copolymers and inorganic nanofillers to enhance performance of thermosetting polymers
US20090092727A1 (en) * 2007-10-04 2009-04-09 Daniel Perlman Water-dispersible phytosterol-surfactant conglomerate particles
EP2244871A1 (de) 2007-11-29 2010-11-03 Dow Global Technologies Inc. Mikrowellenerhitzbare aromatische monovinyl-polymere
US8742018B2 (en) 2008-01-08 2014-06-03 Dow Global Technologies Llc High Tg epoxy systems for composite applications
EP2268697B1 (de) 2008-04-14 2014-01-29 Dow Global Technologies LLC Expoxid-imidazol-katalysatoren für pulverbeschichtungsanwendungen
KR101564957B1 (ko) * 2008-11-06 2015-11-13 니폰 가야꾸 가부시끼가이샤 페놀 수지 혼합물, 에폭시 수지 혼합물, 에폭시 수지 조성물, 및 경화물
CN102197339B (zh) * 2008-11-07 2015-03-04 住友电木株式会社 感光性树脂组合物、感光性粘接膜以及光接收装置
EP2389406A1 (de) 2008-12-16 2011-11-30 Dow Global Technologies LLC Homogene bismaleinimid - triazin - epoxidharz-zusammensetzungen, die zur herstellung von elektrischen laminaten nützlich sind
JP6102913B2 (ja) * 2012-03-16 2017-03-29 住友ベークライト株式会社 封止用樹脂組成物およびこれを用いた電子装置
JP5673613B2 (ja) * 2012-06-27 2015-02-18 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置
US10107064B2 (en) 2013-06-06 2018-10-23 Halliburton Energy Services, Inc. Changeable well seal tool
KR102172755B1 (ko) 2013-06-26 2020-11-02 디아이씨 가부시끼가이샤 페놀성 수산기 함유 화합물, 페놀 수지, 경화성 조성물, 그 경화물, 반도체 봉지 재료, 및 프린트 배선 기판
CN105339409B (zh) 2013-06-26 2017-09-22 Dic株式会社 环氧化合物、环氧树脂、固化性组合物、其固化物、半导体密封材料以及印刷电路基板
US9546243B2 (en) 2013-07-17 2017-01-17 Air Products And Chemicals, Inc. Amines and polymeric phenols and usage thereof as curing agents in one component epoxy resin compositions
KR102413139B1 (ko) * 2014-07-01 2022-06-27 우베 가부시키가이샤 알릴에테르 변성 비페닐아르알킬노볼락 수지, 알릴 변성 비페닐아르알킬노볼락 수지, 그 제조 방법, 및 그것을 사용한 조성물
CN104804378A (zh) * 2015-04-29 2015-07-29 海太半导体（无锡）有限公司 一种半导体塑封材料
JP6896591B2 (ja) * 2017-11-14 2021-06-30 Ｅｎｅｏｓ株式会社 プリプレグ、繊維強化複合材料及び成形体
JP2021059651A (ja) 2019-10-04 2021-04-15 昭和電工株式会社 硬化性樹脂組成物、その硬化物及び該硬化物を含む構造体

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1169045A (en) * 1967-07-21 1969-10-29 Midland Silicones Ltd Novel Epoxylated Phenolic Resins
EP0501734B1 (de) 1991-02-26 1997-10-15 Toray Industries, Inc. Epoxyharzzusammensetzung zur Verkapselung einer Halbleiteranordnung
JPH04300914A (ja) * 1991-03-29 1992-10-23 Shin Etsu Chem Co Ltd エポキシ樹脂組成物及び半導体装置
JP2526747B2 (ja) * 1991-05-21 1996-08-21 信越化学工業株式会社 エポキシ樹脂組成物及び半導体装置
JP2768088B2 (ja) * 1991-10-03 1998-06-25 信越化学工業株式会社 熱硬化性樹脂組成物及び半導体装置
US5358980A (en) * 1991-10-03 1994-10-25 Shin-Etsu Chemical Company, Limited Naphthol novolac epoxy resin compositions and semiconductor devices encapsulated therewith
JPH0597970A (ja) 1991-10-07 1993-04-20 Shin Etsu Chem Co Ltd 熱硬化性樹脂組成物及び半導体装置
JP2951092B2 (ja) * 1991-12-13 1999-09-20 住友ベークライト株式会社 エポキシ樹脂組成物
JP2658752B2 (ja) * 1992-07-06 1997-09-30 信越化学工業株式会社 エポキシ樹脂組成物及び半導体装置
JP3537224B2 (ja) * 1995-07-21 2004-06-14 株式会社東芝 エポキシ樹脂系組成物及び樹脂封止型半導体装置

Also Published As

Publication number Publication date
MY115618A (en) 2003-07-31
JPH11140277A (ja) 1999-05-25
DE69821573T2 (de) 2004-12-16
KR19990044940A (ko) 1999-06-25
KR100524248B1 (ko) 2005-12-21
EP0915118B1 (de) 2004-02-11
SG87012A1 (en) 2002-03-19
US6242110B1 (en) 2001-06-05
EP0915118A1 (de) 1999-05-12

Similar Documents

Publication Publication Date Title
DE69821573D1 (de) Epoxidharzzusammensetzung und damit eingekapselte Halbleiteranordnungen
DE69722106D1 (de) Epoxidharzzusammensetzung und damit eingekapselte Halbleiteranordnungen
DE69840353D1 (de) Epoxidharzzusammensetzung geeignet zur Verkapselung von Halbleiteranordnungen und harzverkapselte Halbleiteranordnungen
DE69922577D1 (de) Epoxydharzzusammensetzungen und damit eingekapselte Halbleiteranordnungen
DE69727869D1 (de) Anorganischer Füllstoff, Epoxyharzzusammensetzung und Halbleitervorrichtung
DE69803267D1 (de) Epoxidharzzusammensetzungen für die versiegelung von halbleitern und halbleitervorrichtung
DE69922868D1 (de) Epoxidharzzusammensetzungen zur Einkapselung von Halbleitern und damit eingekapselte Halbleiterbauteile
DE69637488D1 (de) Halbleiter und Halbleitermodul
DE69603531T2 (de) Epoxyharz, Harzzusammensetzung und Harz-verkapselte Halbleitervorrichtung
DE69841416D1 (de) Integrierte Halbleiterschaltungsanordnung und Packungstruktur dafür
DE69202608T2 (de) Epoxydharzzusammensetzungen und damit eingekapselte Halbleiteranordnungen.
DE69809623D1 (de) Logische MOS-Schaltung und Halbleitervorrichtung
DE60044993D1 (de) Epoxydharzzusammensetzung zur Einkapselung von Halbleitern und Halbleiterbauelement
DE69534483D1 (de) Leiterrahmen und Halbleiterbauelement
KR960012451A (ko) 반도체 장치 및 리드프레임
DE69115058T2 (de) Epoxyharzzusammensetzung und damit verkapselte Halbleiteranordnung.
SG73590A1 (en) Latent catalyst thermosetting resin composition comprising the catalyst epoxy resin molding material comprising the catalyst and semiconductor device
DE69839714D1 (de) Kunststoffpackung und Halbleiteranordnung
DE69828737D1 (de) Polyfunktionelle Cyanatharzzusammensetzung und eine damit verkapselte Halbleiteranordnung
DE69738366D1 (de) Pull-Up-Schaltung und damit ausgerüstete Halbleitervorrichtung
DE69817054D1 (de) Epoxidharzzusammensetzung und eine harzverkapselte Halbleiteranordnung
DE69939949D1 (de) Polymer und epoxyharzzusammensetzungen
DE60020516D1 (de) Epoxidharzzusammensetzung und halbleitervorrichtung
HK1027370A1 (en) Semiconductor sealing epoxy resin composition and semiconductor device using the same
KR960010764A (ko) 에폭시 수지 조성물 및 수지 봉지형 반도체 장치

Legal Events

Date Code Title Description
8364 No opposition during term of opposition