SG87012A1 - Epoxy resin composition and semiconductor device using the same - Google Patents

Epoxy resin composition and semiconductor device using the same

Info

Publication number
SG87012A1
SG87012A1 SG9804621A SG1998004621A SG87012A1 SG 87012 A1 SG87012 A1 SG 87012A1 SG 9804621 A SG9804621 A SG 9804621A SG 1998004621 A SG1998004621 A SG 1998004621A SG 87012 A1 SG87012 A1 SG 87012A1
Authority
SG
Singapore
Prior art keywords
same
semiconductor device
resin composition
epoxy resin
epoxy
Prior art date
Application number
SG9804621A
Other languages
English (en)
Inventor
Iwasaki Shinichi
Iji Masatoshi
Kiuchi Yukihiro
Original Assignee
Sumitomo Bakelite Co
Nec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co, Nec Corp filed Critical Sumitomo Bakelite Co
Publication of SG87012A1 publication Critical patent/SG87012A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/04—Epoxynovolacs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12528—Semiconductor component
SG9804621A 1997-11-10 1998-11-10 Epoxy resin composition and semiconductor device using the same SG87012A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9306847A JPH11140277A (ja) 1997-11-10 1997-11-10 エポキシ樹脂組成物及びこれを用いた半導体装置

Publications (1)

Publication Number Publication Date
SG87012A1 true SG87012A1 (en) 2002-03-19

Family

ID=17961979

Family Applications (1)

Application Number Title Priority Date Filing Date
SG9804621A SG87012A1 (en) 1997-11-10 1998-11-10 Epoxy resin composition and semiconductor device using the same

Country Status (7)

Country Link
US (1) US6242110B1 (de)
EP (1) EP0915118B1 (de)
JP (1) JPH11140277A (de)
KR (1) KR100524248B1 (de)
DE (1) DE69821573T2 (de)
MY (1) MY115618A (de)
SG (1) SG87012A1 (de)

Families Citing this family (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3349963B2 (ja) * 1998-10-21 2002-11-25 日本電気株式会社 難燃性エポキシ樹脂組成物及びそれを用いた半導体装置
EP1137708A1 (de) * 1999-09-06 2001-10-04 Sumitomo Bakelite Co., Ltd. Epoxidharzzusammensetzung und halbleiteranordnung
JP3460820B2 (ja) * 1999-12-08 2003-10-27 日本電気株式会社 難燃性エポキシ樹脂組成物
JP4743932B2 (ja) * 2000-02-17 2011-08-10 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置
US6432540B1 (en) 2000-03-23 2002-08-13 Loctite Corporation Flame retardant molding compositions
US6610406B2 (en) 2000-03-23 2003-08-26 Henkel Locktite Corporation Flame retardant molding compositions
JP4622030B2 (ja) * 2000-04-03 2011-02-02 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置
JP2002121357A (ja) * 2000-10-12 2002-04-23 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP4639461B2 (ja) * 2000-11-14 2011-02-23 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置
KR100414202B1 (ko) * 2000-12-08 2004-01-07 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물
JP4635360B2 (ja) * 2001-03-28 2011-02-23 住友ベークライト株式会社 半導体装置
US6784228B2 (en) 2001-07-12 2004-08-31 Dainippon Ink And Chemicals, Inc. Epoxy resin composition, cured article thereof, novel epoxy resin, novel phenol compound, and process for preparing the same
JP2003026779A (ja) * 2001-07-17 2003-01-29 Shin Etsu Chem Co Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
JP5098125B2 (ja) * 2001-07-30 2012-12-12 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置
KR20030057107A (ko) * 2001-12-28 2003-07-04 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물
JP3627736B2 (ja) * 2002-10-11 2005-03-09 住友ベークライト株式会社 エポキシ樹脂組成物並びにこれを用いた半導体装置
JP4692885B2 (ja) * 2003-02-18 2011-06-01 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置
US7291684B2 (en) * 2003-03-11 2007-11-06 Sumitomo Bakelite Co., Ltd. Resin composition for encapsulating semiconductor chip and semiconductor device therewith
WO2005003208A1 (ja) * 2003-07-03 2005-01-13 Nec Corporation エポキシ樹脂組成物
JP2005120228A (ja) 2003-10-16 2005-05-12 Nitto Denko Corp 光半導体素子封止用エポキシ樹脂組成物およびそれを用いた光半導体装置
US7846998B2 (en) 2004-03-03 2010-12-07 Hitachi Chemical Co., Ltd. Sealant epoxy-resin molding material, and electronic component device
KR101090653B1 (ko) 2004-03-16 2011-12-07 스미토모 베이클라이트 가부시키가이샤 에폭시 수지 조성물 및 반도체장치
US7431990B2 (en) 2004-05-27 2008-10-07 Sumitomo Bakelite Co Resin composition for encapsulating semiconductor chip and semiconductor device therewith
WO2006009147A1 (ja) 2004-07-22 2006-01-26 Sumitomo Bakelite Company, Ltd. 半導体封止用樹脂組成物および半導体装置
MY148463A (en) * 2004-07-29 2013-04-30 Sumitomo Bakelite Co Epoxy resin composition and semiconductor device
KR100561569B1 (ko) * 2004-12-21 2006-03-20 제일모직주식회사 반도체 소자 봉지제용 에폭시 수지 조성물
KR100561575B1 (ko) * 2004-12-21 2006-03-20 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물
KR100673752B1 (ko) * 2004-12-27 2007-01-24 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물
US20060160373A1 (en) * 2005-01-14 2006-07-20 Cabot Corporation Processes for planarizing substrates and encapsulating printable electronic features
JP5487540B2 (ja) 2005-03-16 2014-05-07 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置
EP1978045B1 (de) * 2006-01-25 2015-05-20 Hitachi Chemical Co., Ltd. Phenolharz und harzzusammensetzungen
JP2007332319A (ja) * 2006-06-19 2007-12-27 Nippon Kayaku Co Ltd 真空パネル基板用シール剤
TWI278463B (en) * 2006-09-04 2007-04-11 Chang Chun Plastics Co Ltd Flame retardant resin composition
CN101153107B (zh) * 2006-09-28 2011-02-16 长春人造树脂厂股份有限公司 难燃性树脂组成物
WO2008117522A1 (ja) 2007-03-23 2008-10-02 Sumitomo Bakelite Co., Ltd. 半導体封止用樹脂組成物およびこれを用いる半導体装置
TW200842135A (en) * 2007-04-23 2008-11-01 Chang Chun Plastics Co Ltd Flame retardant resin composition
CA2606537C (en) 2007-05-23 2010-12-21 M-I Llc Use of invert epoxy emulsions for wellbore stabilization
US8404310B2 (en) 2007-08-02 2013-03-26 Dow Global Technologies Llc Thermoset dampener material
WO2009018193A1 (en) 2007-08-02 2009-02-05 Dow Global Technologies Inc. Amphiphilic block copolymers and inorganic nanofillers to enhance performance of thermosetting polymers
US20090092727A1 (en) * 2007-10-04 2009-04-09 Daniel Perlman Water-dispersible phytosterol-surfactant conglomerate particles
EP2244871A1 (de) 2007-11-29 2010-11-03 Dow Global Technologies Inc. Mikrowellenerhitzbare aromatische monovinyl-polymere
WO2009089145A1 (en) 2008-01-08 2009-07-16 Dow Global Technologies Inc. High tg epoxy systems for composite application
US20110028602A1 (en) 2008-04-14 2011-02-03 Joseph Gan Epoxy-imidazole catalysts useful for powder coating applications
CN102209742B (zh) * 2008-11-06 2013-03-27 日本化药株式会社 酚醛树脂混合物、环氧树脂混合物、环氧树脂组合物及固化物
US20110221017A1 (en) * 2008-11-07 2011-09-15 Sumitomo Bakelite Company, Ltd. Photosensitive resin composition, photosensitive adhesive film, and light-receiving device
KR101318456B1 (ko) 2008-12-16 2013-10-16 다우 글로벌 테크놀로지스 엘엘씨 전기 라미네이트의 제조에 유용한 균질한 비스말레이미드-트리아진-에폭시 조성물
SG11201403633QA (en) * 2012-03-16 2014-10-30 Sumitomo Bakelite Co Resin composition for encapsulation and electronic device using thesame
JP5673613B2 (ja) * 2012-06-27 2015-02-18 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置
WO2014197834A1 (en) 2013-06-06 2014-12-11 Halliburton Energy Services, Inc. Fluid loss well treatment
JP5679248B1 (ja) 2013-06-26 2015-03-04 Dic株式会社 エポキシ化合物、エポキシ樹脂、硬化性組成物、その硬化物、半導体封止材料、及びプリント配線基板
CN105339362B (zh) 2013-06-26 2017-09-01 Dic株式会社 含酚性羟基化合物、酚醛树脂、固化性组合物、其固化物、半导体密封材料、及印刷电路基板
US9546243B2 (en) 2013-07-17 2017-01-17 Air Products And Chemicals, Inc. Amines and polymeric phenols and usage thereof as curing agents in one component epoxy resin compositions
JP6659539B2 (ja) * 2014-07-01 2020-03-04 明和化成株式会社 アリルエーテル変性ビフェニルアラルキルノボラック樹脂、アリル変性ビフェニルアラルキルノボラック樹脂、その製造方法、及びそれを用いた組成物
CN104804378A (zh) * 2015-04-29 2015-07-29 海太半导体（无锡）有限公司 一种半导体塑封材料
JP6896591B2 (ja) * 2017-11-14 2021-06-30 Ｅｎｅｏｓ株式会社 プリプレグ、繊維強化複合材料及び成形体
JP2021059651A (ja) 2019-10-04 2021-04-15 昭和電工株式会社 硬化性樹脂組成物、その硬化物及び該硬化物を含む構造体

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05218239A (ja) * 1991-12-13 1993-08-27 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物
US5298548A (en) * 1991-05-21 1994-03-29 Shin-Etsu Chemical Co., Ltd. Epoxy resin composition and semiconductor devices encapsulated therewith
US5312878A (en) * 1991-10-07 1994-05-17 Shin-Etsu Chemical Company, Limited Naphthalene containing epoxy resin cured with a dicyclopentadiene phenolic resin

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1169045A (en) * 1967-07-21 1969-10-29 Midland Silicones Ltd Novel Epoxylated Phenolic Resins
EP0501734B1 (de) 1991-02-26 1997-10-15 Toray Industries, Inc. Epoxyharzzusammensetzung zur Verkapselung einer Halbleiteranordnung
JPH04300914A (ja) * 1991-03-29 1992-10-23 Shin Etsu Chem Co Ltd エポキシ樹脂組成物及び半導体装置
US5358980A (en) * 1991-10-03 1994-10-25 Shin-Etsu Chemical Company, Limited Naphthol novolac epoxy resin compositions and semiconductor devices encapsulated therewith
JP2768088B2 (ja) * 1991-10-03 1998-06-25 信越化学工業株式会社 熱硬化性樹脂組成物及び半導体装置
JP2658752B2 (ja) * 1992-07-06 1997-09-30 信越化学工業株式会社 エポキシ樹脂組成物及び半導体装置
JP3537224B2 (ja) * 1995-07-21 2004-06-14 株式会社東芝 エポキシ樹脂系組成物及び樹脂封止型半導体装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5298548A (en) * 1991-05-21 1994-03-29 Shin-Etsu Chemical Co., Ltd. Epoxy resin composition and semiconductor devices encapsulated therewith
US5312878A (en) * 1991-10-07 1994-05-17 Shin-Etsu Chemical Company, Limited Naphthalene containing epoxy resin cured with a dicyclopentadiene phenolic resin
JPH05218239A (ja) * 1991-12-13 1993-08-27 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物

Also Published As

Publication number Publication date
KR100524248B1 (ko) 2005-12-21
JPH11140277A (ja) 1999-05-25
KR19990044940A (ko) 1999-06-25
EP0915118A1 (de) 1999-05-12
DE69821573T2 (de) 2004-12-16
DE69821573D1 (de) 2004-03-18
US6242110B1 (en) 2001-06-05
EP0915118B1 (de) 2004-02-11
MY115618A (en) 2003-07-31

Similar Documents

Publication Publication Date Title
SG87012A1 (en) Epoxy resin composition and semiconductor device using the same
SG55369A1 (en) Inorganic filler epoxy resin composition and semiconductor device
HK1003684A1 (en) Chip carrier and semiconductor device using the same
SG111042A1 (en) Thermosetting resin composition and semiconductor device using the same
SG76582A1 (en) Level conversion circuit and semiconductor integrated circuit device employing the level conversion circuit
EP0620242A3 (de) Epoxygruppen enthaltendes Siliconharz und Massen auf seiner Basis.
EP0951071A4 (de) Halbleitervorrichtung
SG105463A1 (en) Lead frame and resin package and photoelectron device using the same
SG60109A1 (en) Epoxy resin composition and semiconductor device encapsulated therewith
EP0484157A3 (en) Maleimide resin composition and resin encapsulated semiconductor device manufactured using the composition
SG70032A1 (en) Polyphenylene sulfide resin composition and resin-encapsulated semiconductor device
SG78295A1 (en) Flame-retardant resin composition and semiconductor sealant using the same
EP0739877A3 (de) Epoxyharz, Harzzusammensetzung und Harz-verkapselte Halbleitervorrichtung
SG73590A1 (en) Latent catalyst thermosetting resin composition comprising the catalyst epoxy resin molding material comprising the catalyst and semiconductor device
SG65738A1 (en) Semiconductor device and electronic device having the same
EP0836226A4 (de) Halbleitervorrichtung
GB2323968B (en) Semiconductor device
TW467401U (en) Lead frame and the semiconductor device utilizing the lead frame
SG87781A1 (en) Polyfunctional cyanate resin composition and resin-encapsulated type semiconductor device
HK1027370A1 (en) Semiconductor sealing epoxy resin composition and semiconductor device using the same
SG90029A1 (en) Epoxy resin composition and resin-encapsulated semiconductor device
EP1130041A4 (de) Epoxidharzzusammensetzung und halbleitervorrichtung
SG85624A1 (en) Epoxy resin composition and resin-encapsulated semiconductor device
EP0855719A4 (de) Halbleiteranordnung
SG64845A1 (en) Epoxy resin composition and resin-encapsulated semiconductor device