DE60020516D1 - Epoxidharzzusammensetzung und halbleitervorrichtung - Google Patents

Epoxidharzzusammensetzung und halbleitervorrichtung

Info

Publication number
DE60020516D1
DE60020516D1 DE60020516T DE60020516T DE60020516D1 DE 60020516 D1 DE60020516 D1 DE 60020516D1 DE 60020516 T DE60020516 T DE 60020516T DE 60020516 T DE60020516 T DE 60020516T DE 60020516 D1 DE60020516 D1 DE 60020516D1
Authority
DE
Germany
Prior art keywords
semiconductor device
resin composition
epoxy resin
epoxy
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60020516T
Other languages
English (en)
Other versions
DE60020516T2 (de
Inventor
Hiromi Oki
Yoshiyuki Go
Sumiya Miyake
Yoshihito Akiyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Application granted granted Critical
Publication of DE60020516D1 publication Critical patent/DE60020516D1/de
Publication of DE60020516T2 publication Critical patent/DE60020516T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/688—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing phosphorus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
DE60020516T 1999-07-22 2000-03-10 Epoxidharzzusammensetzung und halbleitervorrichtung Expired - Fee Related DE60020516T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP20749899 1999-07-22
JP20749899 1999-07-22
PCT/JP2000/001448 WO2001007501A1 (fr) 1999-07-22 2000-03-10 Composition de resine epoxyde et dispositif semi-conducteur

Publications (2)

Publication Number Publication Date
DE60020516D1 true DE60020516D1 (de) 2005-07-07
DE60020516T2 DE60020516T2 (de) 2006-05-04

Family

ID=16540720

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60020516T Expired - Fee Related DE60020516T2 (de) 1999-07-22 2000-03-10 Epoxidharzzusammensetzung und halbleitervorrichtung

Country Status (8)

Country Link
US (1) US6664344B1 (de)
EP (1) EP1130041B1 (de)
KR (1) KR100629665B1 (de)
CN (1) CN1105132C (de)
DE (1) DE60020516T2 (de)
MY (1) MY123645A (de)
TW (1) TW526214B (de)
WO (1) WO2001007501A1 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003082976A1 (en) * 2002-03-28 2003-10-09 Sumitomo Bakelite Company Limited Thermosetting resin composition and epoxy resin molding material using the composition and semiconductor device
JP4569076B2 (ja) * 2002-06-05 2010-10-27 住友ベークライト株式会社 硬化促進剤、エポキシ樹脂組成物および半導体装置
SG131750A1 (en) * 2002-09-18 2007-05-28 Sumitomo Bakelite Co Thermosetting resin composition, epoxy resin molding material and semiconductor device
EP1400567B1 (de) * 2002-09-18 2006-03-08 Sumitomo Bakelite Co., Ltd. Thermoreaktive Harzzusammensetzung, Epoxy-Harz Formmasse und Halbleitergerät
SG158878A1 (en) * 2005-01-20 2010-02-26 Sumitomo Bakelite Co Epoxy resin composition, method of rendering the same latent, and semiconductor device
CN101133097B (zh) * 2005-01-26 2011-11-09 日立化成工业株式会社 固化促进剂、固化性树脂组合物及电子器件装置
CN101955629B (zh) * 2009-07-16 2011-12-07 中芯国际集成电路制造(上海)有限公司 可用作半导体封装材料的环氧树脂组合物
CN114276653B (zh) * 2021-12-30 2024-01-26 江苏中科科化新材料股份有限公司 环氧树脂组合物及其应用、环氧树脂及其制备方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5458795A (en) * 1977-10-19 1979-05-11 Hitachi Ltd Preparation of curing agent for epoxy resin
JPS54113256A (en) * 1978-02-24 1979-09-04 Hitachi Ltd Production of resin seal semiconductor device
US4340761A (en) * 1980-11-24 1982-07-20 The Dow Chemical Company Preparation of phosphonium phenoxide salts
JPS58119654A (ja) 1982-01-08 1983-07-16 Toshiba Corp 樹脂封止型半導体装置
JPS6054458A (ja) 1983-09-06 1985-03-28 Toshiba Corp 樹脂封止型半導体装置
JPS63248823A (ja) 1987-04-02 1988-10-17 Toshiba Corp エポキシ樹脂組成物及び樹脂封止型半導体装置
JPH02240133A (ja) 1989-03-15 1990-09-25 Denki Kagaku Kogyo Kk 半導体封止用エポキシ樹脂組成物
JPH02240132A (ja) 1989-03-15 1990-09-25 Denki Kagaku Kogyo Kk 半導体封止用エポキシ樹脂組成物
JPH082943B2 (ja) 1990-04-17 1996-01-17 信越化学工業株式会社 エポキシ樹脂組成物
US5188767A (en) 1990-04-27 1993-02-23 Hitachi Chemical Co., Ltd. Electroconductive resin paste containing mixed epoxy resin and electroconductive metal powder
JP3233382B2 (ja) 1993-12-20 2001-11-26 住友ベークライト株式会社 樹脂組成物
JP3274265B2 (ja) 1993-12-20 2002-04-15 住友ベークライト株式会社 エポキシ樹脂組成物
DE4420012A1 (de) * 1994-06-08 1995-12-14 Basf Ag Verfahren zur Herstellung von strahlungshärtbaren Acrylaten
JPH07330787A (ja) * 1994-06-13 1995-12-19 Sumitomo Bakelite Co Ltd テトラ置換ホスホニウム有機酸塩の合成法
JPH0841290A (ja) * 1994-07-27 1996-02-13 Sumitomo Bakelite Co Ltd 樹脂組成物
JP3254619B2 (ja) * 1995-01-30 2002-02-12 住友ベークライト株式会社 リン系潜伏性触媒の合成法
JPH09124772A (ja) * 1995-10-30 1997-05-13 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物
JP3478315B2 (ja) 1995-12-06 2003-12-15 日立化成工業株式会社 半導体封止用エポキシ樹脂組成物及び該樹脂組成物で封止した半導体装置
JP3217266B2 (ja) 1996-06-11 2001-10-09 住友ベークライト株式会社 潜伏性触媒及び該触媒を配合してなる熱硬化性樹脂組成物
JPH10245432A (ja) 1997-03-06 1998-09-14 Toray Ind Inc エポキシ樹脂組成物および半導体装置
JPH10279670A (ja) 1997-04-01 1998-10-20 Toray Ind Inc エポキシ樹脂組成物および半導体装置
JPH1121431A (ja) * 1997-07-04 1999-01-26 Hitachi Chem Co Ltd 電子部品封止用エポキシ樹脂成形材料及び電子部品装置

Also Published As

Publication number Publication date
DE60020516T2 (de) 2006-05-04
KR20010079864A (ko) 2001-08-22
WO2001007501A1 (fr) 2001-02-01
EP1130041A4 (de) 2001-12-12
CN1105132C (zh) 2003-04-09
EP1130041B1 (de) 2005-06-01
TW526214B (en) 2003-04-01
EP1130041A1 (de) 2001-09-05
KR100629665B1 (ko) 2006-09-29
CN1319112A (zh) 2001-10-24
US6664344B1 (en) 2003-12-16
MY123645A (en) 2006-05-31

Similar Documents

Publication Publication Date Title
DE69821573D1 (de) Epoxidharzzusammensetzung und damit eingekapselte Halbleiteranordnungen
DE60044993D1 (de) Epoxydharzzusammensetzung zur Einkapselung von Halbleitern und Halbleiterbauelement
DE69727869D1 (de) Anorganischer Füllstoff, Epoxyharzzusammensetzung und Halbleitervorrichtung
DE60034070D1 (de) Integrierte Halbleitervorrichtung
DE60036594D1 (de) Feldeffekt-Halbleiterbauelement
SG111042A1 (en) Thermosetting resin composition and semiconductor device using the same
DE60043326D1 (de) Halbleiterspeicheranordnung und elektronisches Gerät
DE60130065D1 (de) Elektronisches Bauteil und Halbleitervorrichtung
DE69922577D1 (de) Epoxydharzzusammensetzungen und damit eingekapselte Halbleiteranordnungen
DE69840353D1 (de) Epoxidharzzusammensetzung geeignet zur Verkapselung von Halbleiteranordnungen und harzverkapselte Halbleiteranordnungen
DE60000958D1 (de) Epoxidharzzusammensetzung und ihre Verwendung
DE69722106D1 (de) Epoxidharzzusammensetzung und damit eingekapselte Halbleiteranordnungen
DE69937739D1 (de) Halbleitervorrichtung
DE60224957D1 (de) Harzzusammensetzung zur Einkapselung von Halbleitern und diese enthaltende Halbleiteranordnungen
DE60000900T2 (de) Klebstoff und Halbleiterbauelemente
DE69603531D1 (de) Epoxyharz, Harzzusammensetzung und Harz-verkapselte Halbleitervorrichtung
DE60005959D1 (de) Halbleiteranordnung
DE69839714D1 (de) Kunststoffpackung und Halbleiteranordnung
DE60001434D1 (de) Klebstoff und Halbleiterbauelemente
DE60008047D1 (de) Feldeffekt-Halbleiteranordnung
DE60020516D1 (de) Epoxidharzzusammensetzung und halbleitervorrichtung
DE60019144D1 (de) Halbleitervorrichtung
DE69939949D1 (de) Polymer und epoxyharzzusammensetzungen
DE60041030D1 (de) Halbleiterbauelement
DE69817054D1 (de) Epoxidharzzusammensetzung und eine harzverkapselte Halbleiteranordnung

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee