DE60130065D1 - Elektronisches Bauteil und Halbleitervorrichtung - Google Patents

Elektronisches Bauteil und Halbleitervorrichtung

Info

Publication number
DE60130065D1
DE60130065D1 DE60130065T DE60130065T DE60130065D1 DE 60130065 D1 DE60130065 D1 DE 60130065D1 DE 60130065 T DE60130065 T DE 60130065T DE 60130065 T DE60130065 T DE 60130065T DE 60130065 D1 DE60130065 D1 DE 60130065D1
Authority
DE
Germany
Prior art keywords
semiconductor device
electronic component
electronic
component
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60130065T
Other languages
English (en)
Other versions
DE60130065T2 (de
Inventor
Tasao Soga
Hanae Hata
Tetsuya Nakatsuka
Masato Nakamura
Yuji Fujita
Toshiharu Ishida
Masahide Okamoto
Koji Serizawa
Toshihiro Hachiya
Hideki Kusuno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of DE60130065D1 publication Critical patent/DE60130065D1/de
Publication of DE60130065T2 publication Critical patent/DE60130065T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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US20020066583A1 (en) 2002-06-06
US6555052B2 (en) 2003-04-29
US6774490B2 (en) 2004-08-10
EP1163971A1 (de) 2001-12-19
KR20010112054A (ko) 2001-12-20
EP1163971B1 (de) 2007-08-22
TWI228439B (en) 2005-03-01
KR100407448B1 (ko) 2003-11-28

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