DE60140143D1 - Halbleiterbauelement und tragbare elektronische vorrichtung - Google Patents

Halbleiterbauelement und tragbare elektronische vorrichtung

Info

Publication number
DE60140143D1
DE60140143D1 DE60140143T DE60140143T DE60140143D1 DE 60140143 D1 DE60140143 D1 DE 60140143D1 DE 60140143 T DE60140143 T DE 60140143T DE 60140143 T DE60140143 T DE 60140143T DE 60140143 D1 DE60140143 D1 DE 60140143D1
Authority
DE
Germany
Prior art keywords
electronic device
semiconductor element
portable electronic
portable
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60140143T
Other languages
English (en)
Inventor
Akihide Shibata
Hiroshi Iwata
Seizo Kakimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Application granted granted Critical
Publication of DE60140143D1 publication Critical patent/DE60140143D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/76224—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials
    • H01L21/76229—Concurrent filling of a plurality of trenches having a different trench shape or dimension, e.g. rectangular and V-shaped trenches, wide and narrow trenches, shallow and deep trenches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
    • H01L21/8232—Field-effect technology
    • H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
    • H01L21/8238—Complementary field-effect transistors, e.g. CMOS
    • H01L21/823892—Complementary field-effect transistors, e.g. CMOS with a particular manufacturing method of the wells or tubs, e.g. twin tubs, high energy well implants, buried implanted layers for lateral isolation [BILLI]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
    • H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
    • H01L27/088—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
    • H01L27/092—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
    • H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
    • H01L27/088—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
    • H01L27/092—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors
    • H01L27/0921—Means for preventing a bipolar, e.g. thyristor, action between the different transistor regions, e.g. Latchup prevention

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Element Separation (AREA)
DE60140143T 2000-11-16 2001-11-13 Halbleiterbauelement und tragbare elektronische vorrichtung Expired - Lifetime DE60140143D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000349675A JP3950294B2 (ja) 2000-11-16 2000-11-16 半導体装置
PCT/JP2001/009887 WO2002041401A1 (fr) 2000-11-16 2001-11-13 Dispositif semi-conducteur et appareil electronique portable

Publications (1)

Publication Number Publication Date
DE60140143D1 true DE60140143D1 (de) 2009-11-19

Family

ID=18823032

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60140143T Expired - Lifetime DE60140143D1 (de) 2000-11-16 2001-11-13 Halbleiterbauelement und tragbare elektronische vorrichtung

Country Status (7)

Country Link
US (1) US6969893B2 (de)
EP (1) EP1343207B1 (de)
JP (1) JP3950294B2 (de)
KR (1) KR100560185B1 (de)
DE (1) DE60140143D1 (de)
TW (1) TW563243B (de)
WO (1) WO2002041401A1 (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7825488B2 (en) 2006-05-31 2010-11-02 Advanced Analogic Technologies, Inc. Isolation structures for integrated circuits and modular methods of forming the same
US8089129B2 (en) * 2002-08-14 2012-01-03 Advanced Analogic Technologies, Inc. Isolated CMOS transistors
US6936898B2 (en) * 2002-12-31 2005-08-30 Transmeta Corporation Diagonal deep well region for routing body-bias voltage for MOSFETS in surface well regions
DE10300687A1 (de) * 2003-01-10 2004-07-22 Infineon Technologies Ag Integrierte Halbleiterschaltung insbesondere Halbleiterspeicherschaltung und Herstellungsverfahren dafür
US7135753B2 (en) * 2003-12-05 2006-11-14 International Rectifier Corporation Structure and method for III-nitride monolithic power IC
US7304354B2 (en) 2004-02-17 2007-12-04 Silicon Space Technology Corp. Buried guard ring and radiation hardened isolation structures and fabrication methods
JP4578878B2 (ja) * 2004-07-27 2010-11-10 パナソニック株式会社 半導体集積回路
KR100797896B1 (ko) * 2004-11-12 2008-01-24 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 다양한 동작 전압들을 갖는 집적 회로들을 절연시키기 위한반도체 구조
JP2006228910A (ja) * 2005-02-16 2006-08-31 Matsushita Electric Ind Co Ltd 半導体装置
WO2006131986A1 (ja) * 2005-06-10 2006-12-14 Fujitsu Limited 半導体装置、半導体システム、および半導体装置の製造方法
US20070029621A1 (en) * 2005-08-05 2007-02-08 Nec Electronics Corporation Semiconductor integrated circuit device
JP5036719B2 (ja) 2005-10-14 2012-09-26 シリコン・スペース・テクノロジー・コーポレイション 耐放射線性のあるアイソレーション構造及びその製造方法
JP4890838B2 (ja) * 2005-11-17 2012-03-07 ルネサスエレクトロニクス株式会社 半導体集積回路のレイアウト設計方法、及びレイアウト設計ツール
US7479418B2 (en) * 2006-01-11 2009-01-20 International Business Machines Corporation Methods of applying substrate bias to SOI CMOS circuits
WO2008012899A1 (fr) * 2006-07-27 2008-01-31 Fujitsu Limited Dispositif de circuit à semi-conducteurs, système de dispositif de circuit à semi-conducteurs et procédé de fabrication pour le dispositif de circuit à semi-conducteurs
JP2009283867A (ja) * 2008-05-26 2009-12-03 Toshiba Corp 半導体装置
TWI474305B (zh) * 2008-07-31 2015-02-21 Sitronix Technology Corp The polarity switching structure of point conversion system
US8273617B2 (en) 2009-09-30 2012-09-25 Suvolta, Inc. Electronic devices and systems, and methods for making and using the same
US8421162B2 (en) 2009-09-30 2013-04-16 Suvolta, Inc. Advanced transistors with punch through suppression
JP2013511163A (ja) * 2009-11-17 2013-03-28 スボルタ，インコーポレーテッド 電子デバイス及びシステム、並びにその製造方法及び使用方法
JP2012114274A (ja) * 2010-11-25 2012-06-14 Elpida Memory Inc 半導体装置及びその製造方法
US8765607B2 (en) * 2011-06-01 2014-07-01 Freescale Semiconductor, Inc. Active tiling placement for improved latch-up immunity
US10038058B2 (en) 2016-05-07 2018-07-31 Silicon Space Technology Corporation FinFET device structure and method for forming same
US9831134B1 (en) 2016-09-28 2017-11-28 Taiwan Semiconductor Manufacturing Co., Ltd. Method of manufacturing a semiconductor device having deep wells
JP6776192B2 (ja) * 2017-06-28 2020-10-28 ルネサスエレクトロニクス株式会社 半導体装置及びその製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5984572A (ja) 1982-11-08 1984-05-16 Nec Corp 半導体装置
JPH06216346A (ja) 1992-11-30 1994-08-05 Sony Corp 半導体装置
JP3406949B2 (ja) 1995-01-31 2003-05-19 キヤノン株式会社 半導体集積回路装置
JPH1022462A (ja) * 1996-06-28 1998-01-23 Sharp Corp 半導体装置及びその製造方法
JPH10163342A (ja) 1996-12-04 1998-06-19 Sharp Corp 半導体装置
JPH10199968A (ja) 1997-01-10 1998-07-31 Sony Corp 半導体装置及び半導体装置の素子間分離溝の形成方法
JP4253052B2 (ja) * 1997-04-08 2009-04-08 株式会社東芝 半導体装置
JP3097652B2 (ja) 1998-03-31 2000-10-10 日本電気株式会社 半導体集積回路装置の製造方法
JP4333932B2 (ja) 1998-06-30 2009-09-16 シャープ株式会社 半導体装置および半導体装置を製造する方法
US6143593A (en) * 1998-09-29 2000-11-07 Conexant Systems, Inc. Elevated channel MOSFET
JP2000294624A (ja) * 1999-04-05 2000-10-20 Mitsubishi Electric Corp 半導体装置及びその製造方法

Also Published As

Publication number Publication date
KR20030051841A (ko) 2003-06-25
EP1343207A4 (de) 2008-01-23
US20040026743A1 (en) 2004-02-12
WO2002041401A1 (fr) 2002-05-23
EP1343207A1 (de) 2003-09-10
US6969893B2 (en) 2005-11-29
EP1343207B1 (de) 2009-10-07
JP3950294B2 (ja) 2007-07-25
KR100560185B1 (ko) 2006-03-13
TW563243B (en) 2003-11-21
JP2002158293A (ja) 2002-05-31

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