DE60111433D1 - Lötverfahren und Lötvorrichtung - Google Patents

Lötverfahren und Lötvorrichtung

Info

Publication number
DE60111433D1
DE60111433D1 DE60111433T DE60111433T DE60111433D1 DE 60111433 D1 DE60111433 D1 DE 60111433D1 DE 60111433 T DE60111433 T DE 60111433T DE 60111433 T DE60111433 T DE 60111433T DE 60111433 D1 DE60111433 D1 DE 60111433D1
Authority
DE
Germany
Prior art keywords
soldering
soldering device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60111433T
Other languages
English (en)
Other versions
DE60111433T2 (de
Inventor
Eishu Nagata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of DE60111433D1 publication Critical patent/DE60111433D1/de
Application granted granted Critical
Publication of DE60111433T2 publication Critical patent/DE60111433T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE60111433T 2000-01-18 2001-01-18 Lötverfahren und Lötvorrichtung Expired - Lifetime DE60111433T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000009028A JP4346054B2 (ja) 2000-01-18 2000-01-18 ハンダ付け方法およびハンダ付け装置
JP2000009028 2000-01-18

Publications (2)

Publication Number Publication Date
DE60111433D1 true DE60111433D1 (de) 2005-07-21
DE60111433T2 DE60111433T2 (de) 2005-11-03

Family

ID=18537227

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60111433T Expired - Lifetime DE60111433T2 (de) 2000-01-18 2001-01-18 Lötverfahren und Lötvorrichtung

Country Status (4)

Country Link
US (2) US6457634B2 (de)
EP (1) EP1118414B1 (de)
JP (1) JP4346054B2 (de)
DE (1) DE60111433T2 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4502496B2 (ja) * 2000-11-16 2010-07-14 富士通株式会社 Ｂｇａ実装時におけるはんだ形状評価方法及びｂｇａ実装時におけるはんだ形状評価装置及びｂｇａ実装時におけるはんだ形状評価プログラムを収納したコンピュータ読み取り可能な記録媒体
US7316062B2 (en) * 2004-05-27 2008-01-08 Honeywell International Inc. Solder extraction tool and method
JP5184359B2 (ja) * 2006-08-21 2013-04-17 満男 海老澤 半田鏝、それを用いて電子機器を製造する方法、及び製造装置
KR101418384B1 (ko) * 2012-09-21 2014-08-07 주식회사 탑 엔지니어링 자동 용접 유닛 및 이를 갖는 자동 용접 설비
US9243726B2 (en) 2012-10-03 2016-01-26 Aarne H. Reid Vacuum insulated structure with end fitting and method of making same
US9463918B2 (en) 2014-02-20 2016-10-11 Aarne H. Reid Vacuum insulated articles and methods of making same
JP6004029B1 (ja) * 2015-03-26 2016-10-05 株式会社アンド 半田処理装置
US10497908B2 (en) 2015-08-24 2019-12-03 Concept Group, Llc Sealed packages for electronic and energy storage devices
US10065256B2 (en) * 2015-10-30 2018-09-04 Concept Group Llc Brazing systems and methods
US11702271B2 (en) 2016-03-04 2023-07-18 Concept Group Llc Vacuum insulated articles with reflective material enhancement
KR101798790B1 (ko) * 2016-11-14 2017-11-16 부경대학교 산학협력단 솔라셀 모듈 제작을 위한 솔더링 노즐, 솔라셀 와이어 솔더링 시스템 및 이를 이용하는 솔라셀 상호연결 방법
KR20200010162A (ko) 2016-11-15 2020-01-30 컨셉트 그룹 엘엘씨 미세 다공성 절연재를 갖는 향상된 진공-절연된 물품
US11008153B2 (en) 2016-11-15 2021-05-18 Concept Group Llp Multiply-insulated assemblies
JP1586728S (de) * 2017-02-10 2017-09-25
US10307850B2 (en) * 2017-08-24 2019-06-04 Micron Technology, Inc. Solder removal from semiconductor devices
JP2020531764A (ja) 2017-08-25 2020-11-05 コンセプト グループ エルエルシー 複合的ジオメトリおよび複合的材料の断熱部品
CN114101828B (zh) * 2021-12-06 2023-03-24 江苏华普泰克石油装备有限公司 一种用于三相分离器的钎焊加工装置
CN114571108B (zh) * 2021-12-13 2023-12-26 杭叉集团股份有限公司 一种电池模组吸烟式焊接工装
CN114083191B (zh) * 2022-01-24 2022-04-19 快克智能装备股份有限公司 焊接装置及其焊接方法
CN114336211B (zh) * 2022-03-14 2022-05-17 深圳市华星联科技有限公司 一种排插多点位自动焊接设备及其加工工艺
CN117066752B (zh) * 2023-10-18 2023-12-19 广州汉源微电子封装材料有限公司 一种高平稳性高可靠性的限高型预成形焊片及其制备方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2348081C2 (de) 1973-09-25 1984-08-09 Hans 5500 Trier Jaklin Verwendung einer Bariumverbindung als Zusatz zu Beton- und Mörtelmischungen
JPH0777665B2 (ja) 1986-05-16 1995-08-23 栄修 永田 ハンダ付け方法およびハンダ付け装置
US4934309A (en) * 1988-04-15 1990-06-19 International Business Machines Corporation Solder deposition system
JP2726936B2 (ja) * 1989-01-10 1998-03-11 栄修 永田 ハンダ付け方法およびハンダ付け装置
US5042708A (en) * 1990-09-24 1991-08-27 International Business Machines Corporation Solder placement nozzle assembly
JP3314088B2 (ja) 1992-06-08 2002-08-12 栄修 永田 ハンダ付け方法およびハンダ付け装置
US5316700A (en) * 1992-11-02 1994-05-31 Wesley-Jessen Corporation Method and apparatus for removing excess lens forming material
US5358169A (en) * 1994-01-14 1994-10-25 Caddock Electronics, Inc. Method of soldering leads to electrical components
JP3307777B2 (ja) * 1994-07-07 2002-07-24 栄修 永田 ハンダ付け方法および装置
DE59605457D1 (de) * 1995-07-01 2000-07-27 Esec Sa Verfahren und Einrichtung zum Austragen von flüssigem Lot

Also Published As

Publication number Publication date
US6659335B2 (en) 2003-12-09
EP1118414B1 (de) 2005-06-15
EP1118414A3 (de) 2002-04-10
US6457634B2 (en) 2002-10-01
US20020170946A1 (en) 2002-11-21
US20010030225A1 (en) 2001-10-18
JP4346054B2 (ja) 2009-10-14
EP1118414A2 (de) 2001-07-25
JP2001203446A (ja) 2001-07-27
DE60111433T2 (de) 2005-11-03

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Legal Events

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