DE60131511D1 - Halbleiterverarbeitungsmodul und Vorrichtung - Google Patents

Halbleiterverarbeitungsmodul und Vorrichtung

Info

Publication number
DE60131511D1
DE60131511D1 DE60131511T DE60131511T DE60131511D1 DE 60131511 D1 DE60131511 D1 DE 60131511D1 DE 60131511 T DE60131511 T DE 60131511T DE 60131511 T DE60131511 T DE 60131511T DE 60131511 D1 DE60131511 D1 DE 60131511D1
Authority
DE
Germany
Prior art keywords
processing module
semiconductor processing
semiconductor
module
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60131511T
Other languages
English (en)
Other versions
DE60131511T2 (de
Inventor
Takayuki Yamagishi
Masaei Suwada
Takeshi Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASM Japan KK
Original Assignee
ASM Japan KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASM Japan KK filed Critical ASM Japan KK
Publication of DE60131511D1 publication Critical patent/DE60131511D1/de
Application granted granted Critical
Publication of DE60131511T2 publication Critical patent/DE60131511T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Robotics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE60131511T 2000-08-22 2001-08-21 Halbleiterverarbeitungsmodul und Vorrichtung Expired - Fee Related DE60131511T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2000251455 2000-08-22
JP2000251455 2000-08-22
JP2001196802A JP4753224B2 (ja) 2000-08-22 2001-06-28 ガスラインシステム
JP2001196802 2001-06-28

Publications (2)

Publication Number Publication Date
DE60131511D1 true DE60131511D1 (de) 2008-01-03
DE60131511T2 DE60131511T2 (de) 2008-10-23

Family

ID=26598258

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60131511T Expired - Fee Related DE60131511T2 (de) 2000-08-22 2001-08-21 Halbleiterverarbeitungsmodul und Vorrichtung

Country Status (4)

Country Link
EP (1) EP1182695B1 (de)
JP (1) JP4753224B2 (de)
KR (1) KR100789461B1 (de)
DE (1) DE60131511T2 (de)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003243481A (ja) * 2002-02-21 2003-08-29 Asm Japan Kk 半導体製造装置及びメンテナンス方法
US7959395B2 (en) 2002-07-22 2011-06-14 Brooks Automation, Inc. Substrate processing apparatus
US7988398B2 (en) 2002-07-22 2011-08-02 Brooks Automation, Inc. Linear substrate transport apparatus
JP4712379B2 (ja) * 2002-07-22 2011-06-29 ブルックス オートメーション インコーポレイテッド 基板処理装置
US7368368B2 (en) * 2004-08-18 2008-05-06 Cree, Inc. Multi-chamber MOCVD growth apparatus for high performance/high throughput
US9576824B2 (en) 2005-02-22 2017-02-21 Spts Technologies Limited Etching chamber with subchamber
US7422636B2 (en) * 2005-03-25 2008-09-09 Tokyo Electron Limited Plasma enhanced atomic layer deposition system having reduced contamination
KR100688836B1 (ko) * 2005-05-11 2007-03-02 삼성에스디아이 주식회사 촉매 화학기상증착장치
CN100452945C (zh) * 2007-06-20 2009-01-14 中微半导体设备(上海)有限公司 包含多个处理平台的去耦合反应离子刻蚀室
US8322299B2 (en) 2006-05-17 2012-12-04 Taiwan Semiconductor Manufacturing Co., Ltd. Cluster processing apparatus for metallization processing in semiconductor manufacturing
KR101217516B1 (ko) * 2006-07-11 2013-01-02 주성엔지니어링(주) 클러스터 툴
KR100846107B1 (ko) * 2007-02-13 2008-07-15 세메스 주식회사 다수의 가스 스틱을 구비하는 반도체 제조 설비
KR100839189B1 (ko) * 2007-03-06 2008-06-17 세메스 주식회사 반도체 제조장치 및 반도체 제조장치의 공정챔버에 기판을이송하는 방법
KR100858890B1 (ko) * 2007-03-28 2008-09-17 세메스 주식회사 기판 처리 장치와 기판 처리 방법
WO2009117839A1 (en) * 2008-03-25 2009-10-01 Oc Oerlikon Balzers Ag Processing chamber
US8602706B2 (en) 2009-08-17 2013-12-10 Brooks Automation, Inc. Substrate processing apparatus
DE102012100929A1 (de) 2012-02-06 2013-08-08 Roth & Rau Ag Substratbearbeitungsanlage
JP5497091B2 (ja) * 2012-03-26 2014-05-21 東京エレクトロン株式会社 基板処理方法
US9960072B2 (en) * 2015-09-29 2018-05-01 Asm Ip Holding B.V. Variable adjustment for precise matching of multiple chamber cavity housings
US10770272B2 (en) * 2016-04-11 2020-09-08 Applied Materials, Inc. Plasma-enhanced anneal chamber for wafer outgassing
CN107644832B (zh) * 2016-07-20 2023-09-29 朗姆研究公司 用于系统维护期间储存和组织mca特征和晶片传送销的设计
JP6844263B2 (ja) * 2017-01-05 2021-03-17 東京エレクトロン株式会社 基板処理装置
KR101930456B1 (ko) * 2018-05-03 2018-12-18 주식회사 유진테크 기판 처리 시스템
CN112725747B (zh) * 2019-10-29 2022-10-18 中国电子科技集团公司第四十八研究所 一种磁控溅射机台
CN112779510B (zh) * 2019-11-11 2022-11-11 中国电子科技集团公司第四十八研究所 一种磁控溅射镀膜设备
US11664247B2 (en) * 2020-10-16 2023-05-30 Applied Materials, Inc. Dynamic interface for providing a symmetric radio frequency return path
US11887884B2 (en) 2020-10-16 2024-01-30 Applied Materials, Inc. Pre-loaded bowl mechanism for providing a symmetric radio frequency return path
US20230095095A1 (en) * 2021-09-27 2023-03-30 Applied Materials, Inc. Method of isolating the chamber volume to process volume with internal wafer transfer capability

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JPS61580A (ja) * 1984-06-14 1986-01-06 Ricoh Co Ltd プラズマｃｖｄ装置
US4657620A (en) * 1984-10-22 1987-04-14 Texas Instruments Incorporated Automated single slice powered load lock plasma reactor
JPS63232316A (ja) * 1987-03-20 1988-09-28 Fujitsu Ltd 蒸気圧制御装置
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TW295677B (de) * 1994-08-19 1997-01-11 Tokyo Electron Co Ltd
JP3453223B2 (ja) * 1994-08-19 2003-10-06 東京エレクトロン株式会社 処理装置
JPH08213442A (ja) * 1995-02-06 1996-08-20 Hitachi Ltd マルチチャンバプロセス装置
JP3650495B2 (ja) * 1995-12-12 2005-05-18 東京エレクトロン株式会社 半導体処理装置、その基板交換機構及び基板交換方法
KR100219368B1 (ko) * 1996-06-05 1999-09-01 이경수 반도체기판의 표면을 연마하는 반도체제조장치
JP3700879B2 (ja) * 1996-07-25 2005-09-28 古河電気工業株式会社 有機金属気相成長装置
JPH10172955A (ja) * 1996-12-06 1998-06-26 Shibaura Eng Works Co Ltd 真空処理装置
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JP3632812B2 (ja) * 1997-10-24 2005-03-23 シャープ株式会社 基板搬送移載装置
JP3215081B2 (ja) * 1997-12-02 2001-10-02 カンケンテクノ株式会社 半導体製造排ガスの除害装置及び除害方法
JPH11345770A (ja) * 1998-05-29 1999-12-14 Kokusai Electric Co Ltd 半導体製造装置
JP4256551B2 (ja) * 1998-12-25 2009-04-22 東京エレクトロン株式会社 真空処理システム
JP2000223547A (ja) * 1999-01-27 2000-08-11 Dainippon Screen Mfg Co Ltd 基板処理装置

Also Published As

Publication number Publication date
DE60131511T2 (de) 2008-10-23
EP1182695B1 (de) 2007-11-21
KR100789461B1 (ko) 2008-01-02
JP2002141293A (ja) 2002-05-17
KR20020015672A (ko) 2002-02-28
EP1182695A2 (de) 2002-02-27
JP4753224B2 (ja) 2011-08-24
EP1182695A3 (de) 2006-02-01

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