DE60128768D1 - Polierverfahren und vorrichtung - Google Patents

Polierverfahren und vorrichtung

Info

Publication number
DE60128768D1
DE60128768D1 DE60128768T DE60128768T DE60128768D1 DE 60128768 D1 DE60128768 D1 DE 60128768D1 DE 60128768 T DE60128768 T DE 60128768T DE 60128768 T DE60128768 T DE 60128768T DE 60128768 D1 DE60128768 D1 DE 60128768D1
Authority
DE
Germany
Prior art keywords
polishing process
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60128768T
Other languages
English (en)
Other versions
DE60128768T2 (de
Inventor
Etsuo Kiuchi
Toshiyuki Hayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Publication of DE60128768D1 publication Critical patent/DE60128768D1/de
Application granted granted Critical
Publication of DE60128768T2 publication Critical patent/DE60128768T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/015—Temperature control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/14—Lapping plates for working plane surfaces characterised by the composition or properties of the plate materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/04—Headstocks; Working-spindles; Features relating thereto
    • B24B41/042—Balancing mechanisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/14—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
DE60128768T 2000-01-31 2001-01-29 Polierverfahren und vorrichtung Expired - Fee Related DE60128768T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000022591 2000-01-31
JP2000022591 2000-01-31
PCT/JP2001/000568 WO2001056742A1 (fr) 2000-01-31 2001-01-29 Dispositif et procede de polissage

Publications (2)

Publication Number Publication Date
DE60128768D1 true DE60128768D1 (de) 2007-07-19
DE60128768T2 DE60128768T2 (de) 2007-10-11

Family

ID=18548876

Family Applications (3)

Application Number Title Priority Date Filing Date
DE60136759T Expired - Fee Related DE60136759D1 (de) 2000-01-31 2001-01-29 Polierverfahren
DE60128768T Expired - Fee Related DE60128768T2 (de) 2000-01-31 2001-01-29 Polierverfahren und vorrichtung
DE60133231T Expired - Fee Related DE60133231T2 (de) 2000-01-31 2001-01-29 Polierverfahren

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE60136759T Expired - Fee Related DE60136759D1 (de) 2000-01-31 2001-01-29 Polierverfahren

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE60133231T Expired - Fee Related DE60133231T2 (de) 2000-01-31 2001-01-29 Polierverfahren

Country Status (6)

Country Link
US (2) US6827638B2 (de)
EP (3) EP1602444B1 (de)
KR (1) KR100729022B1 (de)
DE (3) DE60136759D1 (de)
TW (1) TWI291730B (de)
WO (1) WO2001056742A1 (de)

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KR20020010537A (ko) * 2000-07-27 2002-02-04 추후기재 화학적 기계적 평탄화 처리를 위한 폴리싱 표면 온도 조절시스템
JP4448297B2 (ja) * 2002-12-27 2010-04-07 株式会社荏原製作所 基板研磨装置及び基板研磨方法
CN101306512A (zh) * 2002-12-27 2008-11-19 株式会社荏原制作所 基片抛光设备
JP2005268566A (ja) * 2004-03-19 2005-09-29 Ebara Corp 化学機械研磨装置の基板把持機構のヘッド構造
DE102004017452A1 (de) * 2004-04-08 2005-11-03 Siltronic Ag Vorrichtung zur flächigen, abrasiven Bearbeitung eines scheibenförmigen Werkstücks
DE102005045339B4 (de) * 2005-09-22 2009-04-02 Siltronic Ag Epitaxierte Siliciumscheibe und Verfahren zur Herstellung von epitaxierten Siliciumscheiben
KR101004432B1 (ko) * 2008-06-10 2010-12-28 세메스 주식회사 매엽식 기판 처리 장치
JP5516184B2 (ja) * 2010-07-26 2014-06-11 信越化学工業株式会社 合成石英ガラス基板の製造方法
JP5404673B2 (ja) * 2011-02-25 2014-02-05 株式会社東芝 Ｃｍｐ装置、研磨パッド及びｃｍｐ方法
JP5628067B2 (ja) * 2011-02-25 2014-11-19 株式会社荏原製作所 研磨パッドの温度調整機構を備えた研磨装置
JP2013099814A (ja) * 2011-11-08 2013-05-23 Toshiba Corp 研磨方法及び研磨装置
US9418904B2 (en) 2011-11-14 2016-08-16 Taiwan Semiconductor Manufacturing Co., Ltd. Localized CMP to improve wafer planarization
US10065288B2 (en) 2012-02-14 2018-09-04 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing (CMP) platform for local profile control
US20130210173A1 (en) * 2012-02-14 2013-08-15 Taiwan Semiconductor Manufacturing Co., Ltd. Multiple Zone Temperature Control for CMP
US8860040B2 (en) 2012-09-11 2014-10-14 Dow Corning Corporation High voltage power semiconductor devices on SiC
US9018639B2 (en) * 2012-10-26 2015-04-28 Dow Corning Corporation Flat SiC semiconductor substrate
US9797064B2 (en) 2013-02-05 2017-10-24 Dow Corning Corporation Method for growing a SiC crystal by vapor deposition onto a seed crystal provided on a support shelf which permits thermal expansion
US9738991B2 (en) 2013-02-05 2017-08-22 Dow Corning Corporation Method for growing a SiC crystal by vapor deposition onto a seed crystal provided on a supporting shelf which permits thermal expansion
US9017804B2 (en) 2013-02-05 2015-04-28 Dow Corning Corporation Method to reduce dislocations in SiC crystal growth
US8940614B2 (en) 2013-03-15 2015-01-27 Dow Corning Corporation SiC substrate with SiC epitaxial film
JP6161999B2 (ja) * 2013-08-27 2017-07-12 株式会社荏原製作所 研磨方法および研磨装置
JP6237264B2 (ja) * 2014-01-24 2017-11-29 東京エレクトロン株式会社 縦型熱処理装置、熱処理方法及び記憶媒体
US9279192B2 (en) 2014-07-29 2016-03-08 Dow Corning Corporation Method for manufacturing SiC wafer fit for integration with power device manufacturing technology
JP2017037918A (ja) * 2015-08-07 2017-02-16 エスアイアイ・セミコンダクタ株式会社 研磨ヘッド、研磨ヘッドを有するｃｍｐ研磨装置およびそれを用いた半導体集積回路の製造方法
JP6376085B2 (ja) * 2015-09-03 2018-08-22 信越半導体株式会社 研磨方法及び研磨装置
CN105150106B (zh) * 2015-09-21 2017-05-17 上海工程技术大学 晶圆双面化学机械研磨抛光用冷却装置及方法
JP6312229B1 (ja) * 2017-06-12 2018-04-18 信越半導体株式会社 研磨方法及び研磨装置
US10777418B2 (en) 2017-06-14 2020-09-15 Rohm And Haas Electronic Materials Cmp Holdings, I Biased pulse CMP groove pattern
US10857648B2 (en) 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings Trapezoidal CMP groove pattern
US10586708B2 (en) 2017-06-14 2020-03-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Uniform CMP polishing method
US10857647B2 (en) * 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings High-rate CMP polishing method
US10861702B2 (en) * 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings Controlled residence CMP polishing method
CN108188900B (zh) * 2018-02-08 2021-07-20 张玲 废旧钢板磨削装置
CN108857600B (zh) * 2018-07-25 2023-07-14 浙江工业大学 一种基于光催化的钴基合金加工方法及加工平台
JP6746756B1 (ja) * 2019-05-24 2020-08-26 Ｔｏｗａ株式会社 吸着プレート、切断装置および切断方法
JP2023516871A (ja) 2020-06-29 2023-04-21 アプライド マテリアルズ インコーポレイテッド Ｃｍｐにおける温度及びスラリ流量の制御
CN113414672B (zh) * 2021-07-15 2022-02-11 安徽新境界自动化技术有限公司 一种八轴六联动打磨机器人本体结构

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JPS5454390A (en) 1977-10-08 1979-04-28 Shibayama Kikai Kk Cooling water temperature control system for polishing table
US4313284A (en) * 1980-03-27 1982-02-02 Monsanto Company Apparatus for improving flatness of polished wafers
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US4450652A (en) * 1981-09-04 1984-05-29 Monsanto Company Temperature control for wafer polishing
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US5127196A (en) * 1990-03-01 1992-07-07 Intel Corporation Apparatus for planarizing a dielectric formed over a semiconductor substrate
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JP2985490B2 (ja) * 1992-02-28 1999-11-29 信越半導体株式会社 研磨機の除熱方法
JPH06124931A (ja) * 1992-08-28 1994-05-06 Hitachi Cable Ltd 基板貼付用接着剤及び基板の研磨方法
US5607718A (en) * 1993-03-26 1997-03-04 Kabushiki Kaisha Toshiba Polishing method and polishing apparatus
JP2838021B2 (ja) * 1993-08-19 1998-12-16 新日本製鐵株式会社 ウェーハ研磨装置
US5571044A (en) * 1994-10-11 1996-11-05 Ontrak Systems, Inc. Wafer holder for semiconductor wafer polishing machine
US5791969A (en) * 1994-11-01 1998-08-11 Lund; Douglas E. System and method of automatically polishing semiconductor wafers
JPH1094957A (ja) * 1996-09-25 1998-04-14 Toshiba Corp 研磨定盤およびそれを用いた研磨装置
JPH10296619A (ja) * 1997-05-02 1998-11-10 Fujikoshi Mach Corp 研磨用定盤
US5873769A (en) * 1997-05-30 1999-02-23 Industrial Technology Research Institute Temperature compensated chemical mechanical polishing to achieve uniform removal rates
JP3741523B2 (ja) * 1997-07-30 2006-02-01 株式会社荏原製作所 研磨装置
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US6386957B1 (en) * 1998-10-30 2002-05-14 Shin-Etsu Handotai Co., Ltd. Workpiece holder for polishing, method for producing the same, method for polishing workpiece, and polishing apparatus
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Also Published As

Publication number Publication date
WO2001056742A1 (fr) 2001-08-09
EP1197293A1 (de) 2002-04-17
US20050048882A1 (en) 2005-03-03
EP1614505B1 (de) 2008-11-26
KR20010108076A (ko) 2001-12-07
DE60136759D1 (de) 2009-01-08
DE60133231T2 (de) 2008-07-03
EP1197293A4 (de) 2004-12-15
DE60128768T2 (de) 2007-10-11
US6827638B2 (en) 2004-12-07
US20020187728A1 (en) 2002-12-12
EP1602444A2 (de) 2005-12-07
US7513819B2 (en) 2009-04-07
TWI291730B (en) 2007-12-21
KR100729022B1 (ko) 2007-06-14
EP1602444B1 (de) 2008-03-12
EP1602444A3 (de) 2005-12-14
DE60133231D1 (de) 2008-04-24
EP1614505A1 (de) 2006-01-11
EP1197293B1 (de) 2007-06-06

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee